Abstract: A method of fabricating an image forming element includes preparing an image drum, transferring conductive ink as a pre-form of a plurality of ring electrodes on an outer circumference of the image drum using an imprinting process, solidifying the conductive ink on the outer circumference of the image drum to form the plurality of ring electrodes, and forming an outer insulating layer on the outer circumference of the image drum having the plurality of ring electrodes.

Abstract: A method of manufacturing an image drum includes fixing a control circuit board inside the drum body using a fixing member so that a plurality of terminals of the control circuit board are located in the slot formed longitudinally on the drum body, forming an insulation layer by applying a sensitizer to the entire external surface of the drum body, forming connection parts by removing parts of the insulation layer where the terminals of the control circuit board are formed using photolithography processing, forming electrode forming grooves including the insulation layer as a base on the external surface of the drum body comprising the connection parts thereon, and forming a plurality of ring electrodes to be connected to respective terminals among the plurality of the terminals, respectively, through the connection parts by applying a fluent conductive substance to the external surface of the drum body comprising the electrode forming grooves thereon, and by filling the electrode forming grooves with the flu

Abstract: A method of fabricating an image drum includes preparing a hollow drum body having a slot extending in a longitudinal direction, preparing a printed circuit board (PCB) having a plurality of board terminals, mounting the PCB inside the hollow drum body with a fixing member such that the board terminals of the PCB are placed in the slot of the hollow drum body, coating a first insulating layer on an outer circumference of the hollow drum body, forming a plurality of ring electrodes on the first insulating layer corresponding to the board terminals of the PCB, in which a portion of ring electrodes which corresponds to the board terminals of the PCB is non-continuous, exposing the board terminals below non-continuous area of the ring electrodes by etching the first insulating layer with the ring electrodes as an etching mask, and forming a connecting electrode to electrically connect the board terminals to the ring electrodes.

Abstract: An LED package includes a substrate, an LED, and a cap. The substrate includes a first conductor unit, a second conductor unit, and a non-conductor unit which electrically insulates the first and second conductor unit. The LED is bonded to the first conductor unit. The cap is mounted on the substrate over the LED and comprises a conductive wire which connects the LED to the second conductor unit.

Abstract: An image forming apparatus that may be easily and inexpensively manufactured is provided. The image forming apparatus includes: a toner supply unit; an image forming element to which toner is adsorbed from the toner supply unit; an image developing unit disposed on an outer side of the image forming element, wherein said image developing unit selectively separates from the image forming element at least a part of the toner adsorbed to the image forming element in order to develop an image on the image forming element; and a toner return unit which returns the toner separated from the image forming element by the image developing unit to the toner supply unit.

Abstract: Provided is a vertical semiconductor light-emitting device and a method of manufacturing the same. The method may include sequentially forming a lower clad layer, an active layer, and an upper clad layer on a substrate to form a semiconductor layer and forming first electrode layers on the upper clad layer. A metal support layer may be formed on each of the first electrode layers and a trench may be formed between the first electrode layers. The substrate may be removed and a second electrode layer may be formed on the lower clad layer.

Abstract: An image forming element and its manufacturing apparatus and method are disclosed, in which manufacturing process steps can be simplified to reduce the cost and improve productivity. The manufacturing method of an image forming element includes respectively providing a mold and an image drum, forming line shaped conductive paste patterns on the mold, and transferring the conductive paste patterns from the mold onto the image drum.

Abstract: An image forming element includes an image drum including a plurality of ring electrodes and a slot. The plurality of ring electrodes are formed to be spaced apart from one another on a circumference of the image drum. The slot is formed in a longitudinal direction on the image drum. A connecting member includes a plurality of connecting electrodes and is disposed inside the image drum so that an end of the connecting member is received in the slot. The connecting electrodes are electrically connected with the ring electrodes one to one on the same line.

Abstract: Provided is a vertical semiconductor light-emitting device and a method of manufacturing the same. The method may include sequentially forming a lower clad layer, an active layer, and an upper clad layer on a substrate to form a semiconductor layer and forming first electrode layers on the upper clad layer. A metal support layer may be formed on each of the first electrode layers and a trench may be formed between the first electrode layers. The substrate may be removed and a second electrode layer may be formed on the lower clad layer.

Abstract: A lighting device is provided. The lighting device includes a light source, a light source supporting member which has a surface to which the light source is attached, and a heat sink on an opposite surface of the light source supporting member, for dissipating heat generated by the light source. In addition, the heat sink includes a heat transfer member which protrudes from the surface of the light source supporting member; a plurality of first fins which are spaced apart from each other at intervals in a length direction of the heat transfer member, and are arranged parallel to the light source supporting member; and a plurality of second fins which are spaced apart from each other at intervals, surround outer portions of the first fins, and are arranged perpendicularly to the light source supporting member.

Abstract: A method of fabricating a backlight module in which at least one luminescence element is positioned, including: positioning a luminescence element in at least one cavity formed on a carrier; forming a lower electrode on a substrate; transferring the luminescence element positioned on the carrier to the substrate, connecting the luminescence element to a pattern of the lower electrode formed on the substrate, and removing the carrier; forming an insulating layer on a surface of the substrate to which the luminescence element is transferred, and exposing a top region of the luminescence element; and forming an upper electrode on the exposed top region of the luminescence element. Accordingly, the backlight module including very small luminescence elements being of a micro unit in size is easily fabricated.

Abstract: A light emitting device package including: a heat dissipating substrate including a cavity; a first conductive pattern formed on the cavity; a light emitting device installed on the first conductive pattern; and a second conductive pattern formed on the heat dissipating substrate at a periphery of the first conductive pattern. The second conductive pattern is electrically separated from the first conductive pattern, and the first and second conductive patterns supply power required for operating the light emitting device.

Abstract: A light emitting device package including a transparent cover having an electrode pattern formed on a bottom surface thereof; a light emitting device installed below the transparent cover and electrically connected to an external circuit via the electrode pattern; a fixing resin which fixes the light emitting device onto the bottom surface of the transparent cover; and a metal slug provided under the fixing resin to dissipate heat away from the light emitting device.

Abstract: An image drum for selectively adsorbing toner in a printing apparatus is provided. A method and a configuration of ring electrodes formed on an outside of a drum body is also provided. That is, a control board is mounted inside the drum body, of which a plurality of terminals is externally exposed in the cylindrical drum body, and a photocurable resin is coated on the circumferential surface. Ring electrodes are then formed on circumferential surface of the drum body, by rotating the drum body and allowing an ultraviolet ray through the mask pattern onto the drum body to harden the liquid photocurable resin after contacting a mask-patterned mold mask to the circumferential surface of the drum body.

Abstract: An image drum manufacturing method including: providing a hollow cylindrical mold having a plurality of mold grooves circumferentially cut in its inner circumferential surface and a core portion having a smaller diameter than a hollow of the mold and having a slit-shaped combination groove; filling a conductive material into the mold grooves of the mold; inserting a control unit for individually applying a voltage to each terminal in the combination groove of the core portion, so that a conductive pattern corresponding to the conductive material is partially exposed; inserting the core portion into the mold so that the conductive pattern corresponds to the conductive material filled into each mold groove; and forming a drum body to be integrally formed with the control unit and the conductive material by filling a molten plastic into a space between the mold and the core portion.

Abstract: An LED package and a fabrication method thereof are provided. The LED package includes an upper metal plate having an LED-receiving hole therein; a lower metal plate disposed under the upper metal plate; and an insulator which the upper metal plate and the lower metal plate from each other. A portion of the lower metal plate is exposed via the LED-receiving hole and an LED is mounted on the exposed portion of the lower metal plate and is electrically connected to both of the upper and lower metal plates. A protective cover encloses and protects exposed surfaces of the upper and lower metal plates.

Abstract: An LED package comprises: a package body having therein a LED receiving part including a reflecting surface; an LED mounted within the LED receiving part; a lead mounted within the package body such that first and second ends of the lead are exposed to the outside of the package body. The lead includes first and second conductive parts which are electrically connected to the LED and a non-conductive part which insulates the first and second conductive parts from each other.

Abstract: An LED package includes a substrate having an electrically conductive portion and an electrically non-conductive portion composed of an oxide of the conductive portion; an LED mounted on the conductive portion and electrically connected to the conductive portion; a first electrode disposed on the non-conductive portion and electrically connected to the LED by a wire; and a second electrode disposed on the substrate and electrically connected to the LED.

Abstract: An image drum and method of producing the same is provided. The drum includes a drum body having a pair of semi-cylindrical members, each being oppositely bonded and having a bonding surface having electrodes being separated from one another by insulating areas, and line electrodes formed on the periphery; a control unit including conductive parts corresponding to the line electrodes, and nonconductive parts interposed between the conductive parts, and disposed inside the drum body; and a connecting member electrically coupling the line electrodes to the control unit. The method includes cutting a cylindrical member into two semi-cylindrical members; oxidizing the surfaces of the members; forming electrodes on each of the cut surfaces; partially oxidizing a substrate; bonding the two semi-cylindrical members across the substrate such that the electrodes and the conductive parts couple together; and forming line electrodes on the periphery of the members.

Abstract: A light emitting diode (LED) array module includes a plurality of LEDs; and a substrate which mounts the LEDs and has a built-in cooling device for cooling heat generated when the LED is driven. The cooling device includes a heat radiation space formed on the substrate and a minute passage member which is wick- or mesh-structured to form a plurality of minute passages that operate by a heat pipe principle in the heat radiation space. The cooling device operating by the heat pipe principle is integrally formed on the substrate mounted with the LEDs, so heat radiation performance of the LEDs is enhanced, such that the LEDs can operate stably for a long time.