Patents by Inventor Kyu-Hwa KIM

Kyu-Hwa KIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250151229
    Abstract: Disclosed are a fluid channel module and a power device including same. A fluid channel module according to an aspect of the present disclosure may include: a fluid channel division member communicating with a space of a housing to allow a fluid flowing in the space to be introduced thereinto; a duct member which is coupled to the fluid channel division member and communicates with the fluid channel division member to allow the fluid to flow therethrough; and a vortex formation member which is coupled to the duct member and communicates with the duct member to allow the fluid to flow therethrough, wherein the vortex formation member includes a vortex protrusion formed on the inner surface of the end in the extension direction thereof and configured such that the fluid is discharged while forming a vortex.
    Type: Application
    Filed: January 20, 2023
    Publication date: May 8, 2025
    Inventor: Kyu Hwa KIM
  • Publication number: 20240147677
    Abstract: A lower module of a power electronic device includes a lower module included in a power electronic device that is divided into an upper module and a lower module by an intermediate plate and comprises a blower fan to introduce air into the inner space of the lower module; a plurality of capacitors installed in a suspended form on the intermediate plate and spaced apart from the blower fan; a heat sink having a plurality of heat dissipation fins through which heat generated from a heating component disposed on the upper module is conducted, and disposed adjacent to the capacitors to cool the plurality of heat dissipation fins by air moved from the plurality of capacitors; a DC reactor cooled by the air moved from the heat dissipation fins; and a discharge plate having a vent hole to discharge the air moved from the DC reactor to the outside.
    Type: Application
    Filed: December 3, 2021
    Publication date: May 2, 2024
    Inventors: Soo Yong HWANG, Kil Ju JUNG, Su Hyeong LEE, Won Suk CHOI, Kyu Hwa KIM
  • Publication number: 20240042459
    Abstract: Provided is an inverter apparatus provided with a dust collecting unit. The inverter apparatus provided with the dust collecting unit according to an exemplary embodiment of the present disclosure comprises: a housing having an air inlet port formed on one surface and an air discharge port formed on the other surface; an electrical element for inverter, which is arranged in the housing; a first suction member arranged in the housing; and the dust collecting unit arranged on one side of the air inlet port.
    Type: Application
    Filed: November 25, 2021
    Publication date: February 8, 2024
    Inventor: Kyu Hwa KIM
  • Patent number: 11234348
    Abstract: Proposed is a heatsink module for an inverter. The heatsink module includes a housing a bottom face, both spaced side walls, and both flanges. The heatsink module include a heat-dissipation plate including a base fixed to the both flanges; and a plurality of heat-dissipation fins extending downward from a bottom of the base. The heatsink module includes a supporter interposed between the bottom face of the housing and the heat-dissipation fins. The supporter has slots defined therein for accommodating at least portions of the heat-dissipation fins respectively.
    Type: Grant
    Filed: August 13, 2019
    Date of Patent: January 25, 2022
    Assignee: LSIS CO., LTD.
    Inventor: Kyu-Hwa Kim
  • Publication number: 20200232711
    Abstract: Proposed is a heatsink module for an inverter. The heatsink module includes a housing a bottom face, both spaced side walls, and both flanges. The heatsink module include a heat-dissipation plate including a base fixed to the both flanges; and a plurality of heat-dissipation fins extending downward from a bottom of the base. The heatsink module includes a supporter interposed between the bottom face of the housing and the heat-dissipation fins. The supporter has slots defined therein for accommodating at least portions of the heat-dissipation fins respectively.
    Type: Application
    Filed: August 13, 2019
    Publication date: July 23, 2020
    Inventor: Kyu-Hwa KIM