Patents by Inventor Kyu-Hyun Shin

Kyu-Hyun Shin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7975380
    Abstract: Provided is a probe card and method of fabricating the same. This method comprises forming soldering bumpers electrically connected to conductive patterns on a substrate, forming probes connected to the conductive patterns and supported by the soldering bumpers, and then melting the soldering bumpers to fixing the probes to the substrate. Forming the soldering bumpers includes a step of forming the soldering bumpers in the same pattern and size by means of a photolithography process.
    Type: Grant
    Filed: October 19, 2006
    Date of Patent: July 12, 2011
    Assignee: Phicom Corporation
    Inventors: Oug-Ki Lee, Kyu-Hyun Shin, Seong-Hoon Jeong
  • Publication number: 20090184726
    Abstract: Provided is a probe card and method of fabricating the same. This method comprises forming soldering bumpers electrically connected to conductive patterns on a substrate, forming probes connected to the conductive patterns and supported by the soldering bumpers, and then melting the soldering bumpers to fixing the probes to the substrate. Forming the soldering bumpers includes a step of forming the soldering bumpers in the same pattern and size by means of a photolithography process.
    Type: Application
    Filed: October 19, 2006
    Publication date: July 23, 2009
    Inventors: Oug-Ki Lee, Kyu-Hyun Shin, Seong-Hoon Jeong