Patents by Inventor Kyu-min Oh

Kyu-min Oh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Preparing conditioning disk for chemical mechanical polishing and chemical mechanical polishing method including the same
    Patent number: 10525566
    Abstract: A chemical mechanical polishing (CMP) method includes preparing a polishing pad, determining a first load to be applied to a conditioning disk during conditioning of the polishing pad and a first indentation depth at which tips of the conditioning disk are inserted into the polishing pad when the first load is applied to the conditioning disk, preparing a conditioning disk, and positioning the conditioning disk on the polishing pad and conditioning a surface of the polishing pad by using the conditioning disk while applying the first load to the conditioning disk.
    Type: Grant
    Filed: May 23, 2017
    Date of Patent: January 7, 2020
    Assignees: SAMSUNG ELECTRONICS CO., LTD., EHWA Diamond Industrial Co., Ltd.
    Inventors: Myung-ki Hong, Yung-jun Kim, Sung-oh Park, Hyo-san Lee, Joo-han Lee, Kyu-min Oh, Sun-gyu Park, Seh-kwang Lee, Chan-ki Yang
  • CHEMICAL MECHANICAL POLISHING METHOD AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
    Publication number: 20190091833
    Abstract: A chemical mechanical polishing method includes providing a pad conditioner, such that the pad conditioner includes a base and a plurality of tips protruding from a surface of the base, adjusting a surface roughness of an upper surface of each tip of the plurality of tips, and adjusting a polishing rate of chemical mechanical polishing using the adjusted surface roughness of the upper surfaces of the plurality of tips.
    Type: Application
    Filed: April 19, 2018
    Publication date: March 28, 2019
    Applicant: EHWA DIAMOND IND. CO., LTD.
    Inventors: Sol HAN, Yung Jun KIM, Ho Young KIM, Doo Sik MOON, Sung Oh PARK, Young Seok JANG, Sun Gyu PARK, Kyu Min OH, Joo Han LEE
  • CHEMICAL MECHANICAL POLISHING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR MANUFACTURING APPARATUS
    Publication number: 20180104792
    Abstract: A chemical mechanical polishing (CMP) method includes preparing a polishing pad, determining a first load to be applied to a conditioning disk during conditioning of the polishing pad and a first indentation depth at which tips of the conditioning disk are inserted into the polishing pad when the first load is applied to the conditioning disk, preparing a conditioning disk, and positioning the conditioning disk on the polishing pad and conditioning a surface of the polishing pad by using the conditioning disk while applying the first load to the conditioning disk.
    Type: Application
    Filed: May 23, 2017
    Publication date: April 19, 2018
    Applicant: EHWA Diamond Industrial Co., Ltd.
    Inventors: Myung-ki HONG, Yung-jun KIM, Sung-oh PARK, Hyo-san LEE, Joo-han LEE, Kyu-min Oh, Sun-gyu PARK, Seh-kwang LEE, Chan-ki YANG