Abstract: An electric compressor including a motor configured to generate power; a compression mechanism configured to receive the power from the motor and compress a refrigerant; and an inverter configured to control the motor. A housing receiving the motor and the inverter includes a partition wall that divides a motor receiving space receiving the motor and an inverter receiving space receiving the inverter, and a suction port guiding the refrigerant to the motor receiving space. The partition wall includes a rib that protrudes from a surface facing the motor receiving space. As a result, it is possible to sufficiently cool a plurality of elements of an inverter as a whole and to suppress temperature deviation between the plurality of elements, thereby suppressing damage, operation stop, and increase in maintenance cost.

Abstract: An electric compressor including a housing, a compression mechanism disposed in the housing and configured to compress a refrigerant, a motor configured to generate power required for the compression mechanism, a rotary shaft configured to transmit power from the motor to the compression mechanism, a bearing configured to support the rotary shaft, and an elastic member configured to press the rotary shaft toward the compression mechanism, thereby suppressing axial vibration of the rotary shaft during an operation, suppressing an increase in noise, and preventing damage to the bearing configured to support the rotary shaft.

Abstract: A method of forming a hydrocarbon-containing polymer film on a semiconductor substrate by a capacitively-coupled plasma CVD apparatus. The method includes the steps of: vaporizing a hydrocarbon-containing liquid monomer (C?H?X?, wherein ? and ? are natural numbers of 5 or more; ? is an integer including zero; X is O, N or F) having a boiling point of about 20° C. to about 350° C. which is not substituted by a vinyl group or an acetylene group; introducing the vaporized gas and CO2 gas or H2 gas into a CVD reaction chamber inside which a substrate is placed; and forming a hydrocarbon-containing polymer film on the substrate by plasma polymerization of the gas, thereby reducing extinction coefficient (k) at 193 nm and increasing mechanical hardness.

Abstract: A plasma CVD apparatus for forming a thin film on a wafer having diameter Dw and thickness Tw, includes: a vacuum chamber; a shower plate; a top plate; a top mask portion for covering a top surface peripheral portion of the wafer; and a side mask portion for covering a side surface portion of the wafer. The side mask portion has an inner diameter of Dw+?, and the top mask portion is disposed at a clearance of Tw+? between a bottom surface of the top mask portion and a wafer-supporting surface of the top plate, wherein ? is more than zero, and ? is more than zero.