Abstract: A display device includes: an interfacing unit for converting one of a plurality of image signals inputted according to a switch among a plurality of input modes into an image data; a first reset controlling unit for resetting the interfacing unit according to the switch among the plurality of input modes; a driving unit for converting the image data into a data signal; a display panel for displaying an image using the data signal; and a panel power unit for supplying a panel power to the driving unit and the display panel.

Abstract: A display device includes: an interfacing unit for converting one of a plurality of image signals inputted according to a switch among a plurality of input modes into an image data; a first reset controlling unit for resetting the interfacing unit according to the switch among the plurality of input modes; a driving unit for converting the image data into a data signal; a display panel for displaying an image using the data signal; and a panel power unit for supplying a panel power to the driving unit and the display panel.

Abstract: An MEMS device using an SOI wafer includes a first silicon layer, an insulation layer formed on the first insulation layer, a second silicon layer formed an the insulation layer, a protective layer formed on the second silicon layer, and a ground hole extending from an upper portion of the protective layer to the first silicon layer and having a conductive material therein. A handle wafer in the MEMS device is connected to the ground hole without performing any additional wiring or bonding process.

Abstract: A horizontal and tuning fork vibratory microgyroscope is provided for detecting angular velocity and angular acceleration of an inertial object when the inertial object is rotated, wherein resonance directions of the microgyroscope are on the same horizontal plane in both sensing and driving modes. The microgyroscope includes a substrate, an anchored pad unit, an outer elastic element unit, an outer frame, a sensing electrode unit, an inner elastic element unit including a plurality of inner elastic elements connected to the inside of the outer frame, an inner weighted element unit including a pair of first and second inner weighted elements each having a driven comb, and a driven electrode unit including a comb drive forming a comb structure.

Abstract: A horizontal and tuning fork vibratory microgyroscope detects angular velocity and angular acceleration of an inertial object when the inertial object is rotated, wherein resonance directions of the microgyroscope are on the same horizontal plane in both sensing and driving modes. The microgyroscope includes a substrate, an anchored pad unit, an outer elastic element unit, an outer frame, a sensing electrode unit, an inner elastic element unit including a plurality of inner elastic elements connected to the inside of the outer frame, an inner weighted element unit including a pair of first and second inner weighted elements each having a driven comb, and a driven electrode unit including a comb drive forming a comb structure.

Abstract: Disclosed is an MEMS device using an SOI wafer, the MEMS device comprising a first silicon layer, an insulation layer formed on the first insulation layer, a second silicon layer formed on the insulation layer, a protective layer formed on the second silicon layer, and a ground hole extending from an upper portion of the protective layer to the first silicon layer and having a conductive material therein, whereby a handle wafer in the MEMS device is connected to the ground hole without performing any additional wiring or bonding process.

Abstract: A microgyroscope of a microstructure is disclosed, in which a voltage supplied to the exciting comb drivers of an outer frame is easily offset, and the exciting comb drivers are stably resonated without being influenced by an exciting voltage. The microgyroscope includes an inner frame 110 installed within an outer frame 120 across beam elastic bodies 130. Elastic exciting bodies 230 are installed at four corners of the outer frame 120 excitingly in an exciting direction (x axis). Exciting comb drivers 250 and 250′ are installed to dispose a plurality of combs between a plurality of frame part exciting combs 220. At both sides of the outer frame 120, a plurality of combs 280 of comb sensors 270 and 270′ are installed horizontally asymmetrically, so that the interfering signals transmitted to the comb sensors can be offset.

Abstract: A microgyroscope is disclosed, in which an oscillating mass is oscillated by dividing it into three parts, and thus, the forces transmitted from external oscillations are minimized, thereby minimizing the influence of the external oscillations. The microgyroscope includes an inner mass part 110 excitedly installed within an outer frame 120 across beam elastic bodies 130. A plurality of combs 150 are formed on the inner mass part 110, the combs 150 extending in the y axis direction. A plurality of sensing electrodes 170 are disposed between the plurality of the combs 150, the sensing electrode being formed integrally with an electrode supporting part 160. The inner mass part 110 is connected through elastic bodies to outer mass parts 210 and 210′. In this manner, the influence of external oscillations can be minimized, and the friction loss of the supporting part can also be minimized, thereby improving the resolving power of the microgyroscope.

Abstract: A microsensor for use in a microgyroscope, and a packaging method therefor, are disclosed. During a bonding packaging operation for the purpose of protecting the microstructure or for the purpose of sealing it, the inside and outside of the packaged microsensor are perfectly connected together without a possibility of short circuit, so that any short circuit of the metal layer of the contact hole can be prevented. The method for packaging the microsensor includes the following steps. A structure installing part of a device wafer is etched so as to install a structure on a surface of the device wafer, and then, a sacrificial layer is formed on the part thus etched. A cavity is formed in a separate package wafer, and then, the package wafer (having a function of protection) is bonded onto a surface electrode of the device wafer thus manufactured. Then a contact hole is formed in the package wafer, for connecting the patterns of the device wafer and the package wafer together.

Abstract: A microgyroscope includes a substrate, a first sensor where a plurality of stripe-shaped anodes and cathodes are alternatively arrayed in parallel on the substrate, a driver arranged to be perpendicular to a stripe length direction of the first sensor on the substrate and where a plurality of stripe-shaped anodes and cathodes are alternatively arrayed in parallel, a vibratory structure having a plurality of first grooves of a stripe shape vertically spaced from a plane of the first sensor and the driver at a predetermined height and formed in a direction congruous with a stripe length direction of first sensor and a plurality of second grooves of a stripe shape formed in a direction congruous with a stripe length direction of the driver, a support portion formed on the substrate for maintaining the vibratory structure from the substrate at a predetermined height, and elastic members for elastically connecting the vibratory structure and the support portion.

Abstract: A microgyroscope includes a substrate, a vibratory structure having two stripe portions, a plurality of connection portions, and a comb, an elastic member for elastically maintaining the vibratory structure, a driver for applying the vibratory structure, a sensor for sensing the one directional action of the vibratory structure, and a plurality of sensing electrodes for sensing displacement by Coriolis force.