Patents by Inventor Kyu-yong LEE

Kyu-yong LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11507565
    Abstract: An accelerated transaction processing apparatus includes a memory for storing one or more instructions, a communication interface for communicating with a blockchain network, and a processor. The processor is configured to determine whether the blockchain network is in a congested state based on monitoring information about the blockchain network, adjust a batch size based on a result of the determination, and perform batch processing for one or more individual transactions using the adjusted batch size.
    Type: Grant
    Filed: December 26, 2019
    Date of Patent: November 22, 2022
    Assignee: SAMSUNG SDS CO., LTD.
    Inventors: Chang Suk Yoon, Kyu Sang Lee, Hwa Yong Oh, Sang Won Lee, Ki Woon Sung
  • Publication number: 20220367104
    Abstract: Embodiments include an inductor that comprises an inductor trace and a magnetic body surrounding the inductor trace. In an embodiment, the magnetic body comprises a first step surface and a second step surface. Additional embodiments include an inductor that includes a barrier layer. In an embodiment, an inductor trace is formed over a first surface of the barrier layer. Embodiments include a first magnetic body over the inductor trace and the first surface of the barrier layer, and a second magnetic body over a second surface of the barrier layer opposite the first surface. In an embodiment, a width of the second magnetic body is greater than a width of the first magnetic body.
    Type: Application
    Filed: July 26, 2022
    Publication date: November 17, 2022
    Inventors: Cheng XU, Kyu-Oh LEE, Junnan ZHAO, Rahul JAIN, Ji Yong PARK, Sai VADLAMANI, Seo Young KIM
  • Publication number: 20220359115
    Abstract: Apparatuses, systems and methods associated with a substrate assembly with an encapsulated magnetic feature for an inductor are disclosed herein. In embodiments, a substrate assembly may include a base substrate, a magnetic feature encapsulated within the base substrate, and a coil, wherein a portion of the coil extends through the magnetic feature. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: July 26, 2022
    Publication date: November 10, 2022
    Inventors: Kyu-Oh LEE, Rahul JAIN, Sai VADLAMANI, Cheng XU, Ji Yong PARK, Junnan ZHAO, Seo Young KIM
  • Publication number: 20220344821
    Abstract: A chip antenna module includes: a solder layer disposed on a lower surface of the first dielectric layer; a first patch antenna pattern disposed on upper surface of the first dielectric layer and having a through-hole; a second patch antenna pattern spaced apart from an upper surface of the first patch antenna pattern and having an area less than an area of the first patch antenna pattern; a first feed via extending through the first dielectric layer and electrically connected to the first patch antenna pattern; a second feed via extending through the first dielectric layer and the through-hole, and electrically connected to the second patch antenna pattern; and shielding vias extending through the first dielectric layer, electrically connected to the first patch antenna pattern, and at least partially surrounding the second feed via.
    Type: Application
    Filed: July 6, 2022
    Publication date: October 27, 2022
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Ju Hyoung PARK, Won Cheol LEE, Sung Yong AN, Kyu Bum HAN
  • Publication number: 20220331407
    Abstract: The present invention relates to a peptide with anti-inflammatory activity, wherein the peptide comprises SEQ ID NO: 1, the peptide has above 80% homology of amino acid sequence with above-mentioned sequence, or the peptide is the fragment of the above-mentioned peptides. The present invention also relates to an inflammatory composition comprising the above mentioned peptides. According to the present invention, a peptide comprising a sequence of SEQ ID NO: 1 has outstanding efficacy in both suppressing inflammation and in prophylactic means. Therefore, the composition comprising the peptide of this invention can be used as anti-inflammatory pharmaceutical composition or as cosmetic composition, in turn, treating and preventing a variety of different types of inflammatory diseases.
    Type: Application
    Filed: June 8, 2022
    Publication date: October 20, 2022
    Inventors: Sang Jae KIM, Kyung Hee KIM, Kyu-Yong LEE, Seong-Ho KOH, Hyun-Hee PARK, Sung Jin HUH, Woo Jin LEE, Bum Joon KIM
  • Patent number: 11474491
    Abstract: Disclosed are a communication method between a master controller and slave controllers, a slave controller for the communication method, and a battery management system using the communication method and the slave controller, in which the master controller receives safety information about battery cells through a plurality of channels even when each of a plurality of slave controllers includes only one micro controller unit, thereby minimizing the increase in the cost and enhancing the safety of the battery management system. The communication method includes performing bidirectional communication between a master controller and first to Nth (where N is an integer equal to or more than two) slave controllers through a first communication channel, and receiving, by the master controller, an indication signal through a second communication signal via the first to Nth slave controllers.
    Type: Grant
    Filed: December 21, 2020
    Date of Patent: October 18, 2022
    Assignees: SILICON WORKS CO., LTD., LG ENERGY SOLUTION, LTD.
    Inventors: Myoung Su Song, Jae Wan Kim, Jin Yong Jeon, Ki Suk Cho, Il Kwon Kim, Seung Jun Choi, Kyu Ho Kim, Kyoung Choon Min, Ki Young Lee, Won Gon Kim
  • Publication number: 20220328431
    Abstract: Embodiments include an electronic package that includes a first layer that comprises a dielectric material and a second layer over the first layer, where the second layer comprises a magnetic material. In an embodiment, a third layer is formed over the second layer, where the third layer comprises a dielectric material. In an embodiment, the third layer entirely covers a first surface of the second layer. In an embodiment a first conductive layer and a second conductive layer are embedded within the second layer. In an embodiment, sidewalls of the first conductive layer and the second conductive layer are substantially vertical.
    Type: Application
    Filed: June 28, 2022
    Publication date: October 13, 2022
    Inventors: Cheng XU, Kyu-Oh LEE, Junnan ZHAO, Rahul JAIN, Ji Yong PARK, Sai VADLAMANI, Seo Young KIM
  • Publication number: 20220318885
    Abstract: According to various example embodiments, an information processing method of an electronic device may include acquiring information on a selection of a user for one or more items, confirming whether at least some of the one or more selected items are included in a specific category, confirming limited quantity information corresponding to the specific category based on a confirmation result, confirming purchase request quantity information based on the information on the selection of the user for the one or more items, confirming information of the user, and providing purchasable quantity information related to the one or more items to the user based on the limited quantity information and the information of the user.
    Type: Application
    Filed: April 23, 2021
    Publication date: October 6, 2022
    Inventors: Kyu Yong Lee, Seung Hwan Lee, Catherine Chang, Min Ji Yoon
  • Patent number: 11450471
    Abstract: Embodiments include an inductor that comprises an inductor trace and a magnetic body surrounding the inductor trace. In an embodiment, the magnetic body comprises a first step surface and a second step surface. Additional embodiments include an inductor that includes a barrier layer. In an embodiment, an inductor trace is formed over a first surface of the barrier layer. Embodiments include a first magnetic body over the inductor trace and the first surface of the barrier layer, and a second magnetic body over a second surface of the barrier layer opposite the first surface. In an embodiment, a width of the second magnetic body is greater than a width of the first magnetic body.
    Type: Grant
    Filed: March 28, 2018
    Date of Patent: September 20, 2022
    Assignee: Intel Corporation
    Inventors: Cheng Xu, Kyu-Oh Lee, Junnan Zhao, Rahul Jain, Ji Yong Park, Sai Vadlamani, Seo Young Kim
  • Patent number: 11443892
    Abstract: Apparatuses, systems and methods associated with a substrate assembly with an encapsulated magnetic feature for an inductor are disclosed herein. In embodiments, a substrate assembly may include a base substrate, a magnetic feature encapsulated within the base substrate, and a coil, wherein a portion of the coil extends through the magnetic feature. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: June 27, 2018
    Date of Patent: September 13, 2022
    Assignee: Intel Corporation
    Inventors: Kyu-Oh Lee, Rahul Jain, Sai Vadlamani, Cheng Xu, Ji Yong Park, Junnan Zhao, Seo Young Kim
  • Publication number: 20220278038
    Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a core substrate with a first conductive structure having a first thickness on the core substrate, and a second conductive structure having a second thickness on the core substrate, where the first thickness is different than the second thickness.
    Type: Application
    Filed: May 12, 2022
    Publication date: September 1, 2022
    Applicant: Intel Corporation
    Inventors: Ji Yong Park, Kyu Oh Lee, Yikang Deng, Zhichao Zhang, Liwei Cheng, Andrew James Brown, Cheng Xu, Jiwei Sun
  • Patent number: 11417959
    Abstract: A chip antenna module includes: a solder layer disposed on a lower surface of the first dielectric layer; a first patch antenna pattern disposed on upper surface of the first dielectric layer and having a through-hole; a second patch antenna pattern spaced apart from an upper surface of the first patch antenna pattern and having an area less than an area of the first patch antenna pattern; a first feed via extending through the first dielectric layer and electrically connected to the first patch antenna pattern; a second feed via extending through the first dielectric layer and the through-hole, and electrically connected to the second patch antenna pattern; and shielding vias extending through the first dielectric layer, electrically connected to the first patch antenna pattern, and at least partially surrounding the second feed via.
    Type: Grant
    Filed: October 23, 2019
    Date of Patent: August 16, 2022
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Ju Hyoung Park, Won Cheol Lee, Sung Yong An, Kyu Bum Han
  • Patent number: 11417614
    Abstract: Embodiments include an electronic package that includes a first layer that comprises a dielectric material and a second layer over the first layer, where the second layer comprises a magnetic material. In an embodiment, a third layer is formed over the second layer, where the third layer comprises a dielectric material. In an embodiment, the third layer entirely covers a first surface of the second layer. In an embodiment a first conductive layer and a second conductive layer are embedded within the second layer. In an embodiment, sidewalls of the first conductive layer and the second conductive layer are substantially vertical.
    Type: Grant
    Filed: March 28, 2018
    Date of Patent: August 16, 2022
    Assignee: Intel Corporation
    Inventors: Cheng Xu, Kyu-Oh Lee, Junnan Zhao, Rahul Jain, Ji Yong Park, Sai Vadlamani, Seo Young Kim
  • Publication number: 20220230800
    Abstract: Techniques are provided for an inductor at a first level interface between a first die and a second die. In an example, the inductor can include a winding and a core disposed inside the winding. The winding can include first conductive traces of a first die, second conductive traces of a second die, and a plurality of connectors configured to connect the first die with the second die. Each connector of the plurality of connecters can be located between a trace of the first conductive traces and a corresponding trace of the second conductive traces.
    Type: Application
    Filed: April 5, 2022
    Publication date: July 21, 2022
    Inventors: Cheng Xu, Yikang Deng, Kyu Oh Lee, Ji Yong Park, Srinivas Venkata Ramanuja Pietambaram, Ying Wang, Chong Zhang, Rui Zhang, Junnan Zhao
  • Patent number: 11380609
    Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a core substrate with a first conductive structure having a first thickness on the core substrate, and a second conductive structure having a second thickness on the core substrate, where the first thickness is different than the second thickness.
    Type: Grant
    Filed: May 21, 2018
    Date of Patent: July 5, 2022
    Assignee: Intel Corporation
    Inventors: Cheng Xu, Jiwei Sun, Ji Yong Park, Kyu Oh Lee, Yikang Deng, Zhichao Zhang, Liwei Cheng, Andrew James Brown
  • Publication number: 20220208875
    Abstract: Disclosed is a light emitting display device which prevents pixel shrinkage and improves reliability by changing the structure of a bank and the inner structures of light emitting devices outside an active area of the light emitting display device.
    Type: Application
    Filed: June 2, 2021
    Publication date: June 30, 2022
    Applicant: LG DISPLAY CO., LTD.
    Inventors: KYU IL HAN, Mi So KIM, Hwa Yong SHIN, Ji Hyung LEE
  • Publication number: 20220204846
    Abstract: An etching composition for a silver-containing thin film, the etching composition comprising an inorganic acid compound, a sulfonic acid compound, an organic acid compound, a nitrate, a metal oxidizing agent, an amino acid compound, and water.
    Type: Application
    Filed: July 29, 2021
    Publication date: June 30, 2022
    Inventors: JONGHEE PARK, HYOUNG SIK KIM, O Byoung Kwon, Gi-Yong Nam, Kyungchan Min, SUCK JUN LEE, YOUNGMIN KIM, JINHYUNG KIM, DONGHUN LEE, KYU-HUN LIM, DONGMIN JANG
  • Publication number: 20220208876
    Abstract: Discussed are a light-emitting device and a light-emitting display device having improved efficiency and increased lifespan. A plurality of stacks is provided between an anode and a cathode for at least a subpixel to emit a predetermined color, and emissive layers in different stacks include the same color-based materials having different luminous properties.
    Type: Application
    Filed: June 7, 2021
    Publication date: June 30, 2022
    Applicant: LG Display Co., Ltd.
    Inventors: JIN HO PARK, KYU IL HAN, CHANG HWAN KWAK, DONG HYEOK LIM, HWA YONG SHIN, JI HYUNG LEE
  • Patent number: 11369665
    Abstract: A peptide with anti-inflammatory activity, wherein the peptide comprises SEQ ID NO: 1, the peptide has above 80% homology of amino acid sequence with above-mentioned sequence, or the peptide is the fragment of the above-mentioned peptides is described. An anti-inflammatory composition comprising the above mentioned peptides is described. According to the present invention, a peptide comprising a sequence of SEQ ID NO: 1 has outstanding efficacy in both suppressing inflammation and in prophylactic means. Therefore, the composition comprising the peptide of this invention can be used as anti-inflammatory pharmaceutical composition or as cosmetic composition, in turn, treating and preventing a variety of different types of inflammatory diseases.
    Type: Grant
    Filed: October 26, 2020
    Date of Patent: June 28, 2022
    Assignee: GemVax & KAEL Co., Ltd.
    Inventors: Sang Jae Kim, Kyung Hee Kim, Kyu-Yong Lee, Seong-Ho Koh, Hyun-Hee Park, Sung Jin Huh, Woo Jin Lee, Bum Joon Kim
  • Publication number: 20210388328
    Abstract: The present invention relates to a peptide with anti-inflammatory activity, wherein the peptide comprises any one amino acid sequence of SEQ ID NO: 1 to SEQ ID NO: 161, the peptide has above 80% homology of amino acid sequence with above-mentioned sequences, or the peptide is the fragment of the above-mentioned peptides. The present invention also relates to an inflammatory composition comprising the above mentioned peptides. According to the present invention, a peptide that has at least one amino acid sequence of SEQ ID NO: 1 to SEQ ID NO: 161 has outstanding efficacy in both suppressing inflammation and in prophylactic means. Therefore, the composition comprising the peptides of this invention can be used as anti-inflammatory pharmaceutical compositions or as cosmetic compositions, in turn, treating and preventing a variety of different types of inflammatory diseases.
    Type: Application
    Filed: July 30, 2021
    Publication date: December 16, 2021
    Inventors: Sang Jae KIM, Kyung Hee KIM, Kyu-Yong LEE, Seong-Ho KOH, Bum Joon KIM, Hyun-Hee PARK, Sung Jin HUH, Woo Jin LEE, Hwain JANG, Jung Soon HA