Patents by Inventor KyuHyeon An

KyuHyeon An has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240079313
    Abstract: A semiconductor package includes: a lower substrate including a lower wiring layer; an upper substrate disposed on the lower substrate and including an upper wiring layer and a cavity; an adhesive layer disposed in the cavity; a semiconductor chip having a first surface and a second surface opposite to the first surface, wherein connection pads are disposed on the first surface of the semiconductor chip and are electrically connected to the lower wiring layer, and wherein the second surface of the semiconductor chip is attached to the adhesive layer; a connection structure disposed between the lower substrate and the upper substrate and electrically connecting the lower wiring layer and the upper wiring layer; an encapsulant at least partially surrounding at least a portion of each of the semiconductor chip and the connection structure; and connection bumps electrically connected to the lower wiring layer.
    Type: Application
    Filed: May 30, 2023
    Publication date: March 7, 2024
    Inventor: Kyuhyeon CHOI
  • Publication number: 20230231848
    Abstract: An authentication service system according to an embodiment includes a terminal transmitting a voice call to an interactive voice response service server, identifying a recipient number of the voice call, and transmitting the user's authentication information to an authentication server, the interactive voice response service providing an interactive voice response service according to a user request, and an authentication server generating an authentication key for authenticating the user based on the received authentication information and providing the generated authentication key to the interactive voice response service.
    Type: Application
    Filed: January 10, 2023
    Publication date: July 20, 2023
    Inventors: Semyeong On, Changwon Park, Keumsik IM, Minchul Shin, Kyuhyeon Lee, Hyejoung Park, Hyelim Choi, Bogyu Kim, Myunghee Kim
  • Patent number: 11286516
    Abstract: Disclosed is a method of designing a valid primer pair satisfying a specificity condition. The method includes searching for an identifier of a base sequence from a genetic information index based on a query language associated with a gene, searching for a candidate primer from a provided candidate primer set index to satisfy the specificity condition based on the identifier of the base sequence, filtering the candidate primer based on primer-related filtering conditions, and providing information about a primer pair satisfying the query language and the filtering conditions based on a result of the filtering.
    Type: Grant
    Filed: April 26, 2017
    Date of Patent: March 29, 2022
    Assignee: Daegu Gyeongbuk Institute of Science and Technology
    Inventors: Min Soo Kim, Hyerin Kim, Jaehyung Koo, Na Na Kang, KyuHyeon An
  • Publication number: 20170369934
    Abstract: Disclosed is a method of designing a valid primer pair satisfying a specificity condition. The method includes searching for an identifier of a base sequence from a genetic information index based on a query language associated with a gene, searching for a candidate primer from a provided candidate primer set index to satisfy the specificity condition based on the identifier of the base sequence, filtering the candidate primer based on primer-related filtering conditions, and providing information about a primer pair satisfying the query language and the filtering conditions based on a result of the filtering.
    Type: Application
    Filed: April 26, 2017
    Publication date: December 28, 2017
    Applicant: Daegu Gyeongbuk Institute of Science and Technology
    Inventors: Min Soo Kim, HYERIN KIM, JAEHYUNG KOO, Na Na Kang, KyuHyeon An