Patents by Inventor Kyun Sunwoo

Kyun Sunwoo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package structure and sensor module using the same
    Publication number: 20040212078
    Abstract: The present invention relates to a package structure which is formed by coupling a sintered ceramic base substrate to a ceramic frame, and a sensor module using the package structure. The package structure comprises a frame made of ceramic or plastic material, a groove being formed at an end portion of the frame on the sintered ceramic substrate side; one or more sintered ceramic substrates provided with electrodes; and a bonding means made of glass material or organic bonding material, for bonding the sintered ceramic substrate and the frame.
    Type: Application
    Filed: November 12, 2003
    Publication date: October 28, 2004
    Applicant: SMATTECH, INC.
    Inventors: Hyeung-Gyu Lee, Youn-Seob Lee, Kyun Sunwoo, In-Soo Jeon