Abstract: Disclosed herein is a carrier for manufacturing a substrate, including: an insulation layer including a first metal layer formed on one side or both sides thereof; a second metal layer formed on one side of the first metal layer; and a third metal layer formed on one side of the second metal layer, wherein the second metal layer has a lower melting point than the first metal layer or the third metal layer. The carrier is advantageous in that a build up layer can be separated from a carrier by heating, so that a routing process is not required, with the result that the size of a substrate does not change when the build up layer is separated from the carrier, thereby reusing to the carrier and maintaining the compatibility between the substrate and manufacturing facilities.

Abstract: Disclosed herein is a carrier for manufacturing a substrate, including: an insulation layer including a first metal layer formed on one side or both sides thereof; a second metal layer formed on one side of the first metal layer; and a third metal layer formed on one side of the second metal layer, wherein the second metal layer has a lower melting point than the first metal layer or the third metal layer. The carrier is advantageous in that a build up layer can be separated from a carrier by heating, so that a routing process is not required, with the result that the size of a substrate does not change when the build up layer is separated from the carrier, thereby reusing the carrier and maintaining the compatibility between the substrate and manufacturing facilities.

Abstract: A printed circuit board and a method for manufacturing the printed circuit board are disclosed. The method can include; providing an insulated layer, in which a first metal layer is formed on one side of the insulated layer; forming a groove on the insulated layer; forming a metallic substance on an inner side of the groove and on another side of the insulated layer; and forming a first circuit pattern on at least one of one side of the insulated layer and the metallic substance formed on the groove by removing a portion of the first metal layer. The present invention provides the printed circuit board having a high efficiency of heat emission by disposing a heat sink in direct contact with a board and the method of manufacturing the printed circuit board.

Abstract: An apparatus for controlling gas layer thickness on the surface of casting rolls in a twin roll strip caster includes: a pair of chambers fixedly mounted on both lateral portions of the meniscus shield in a width direction of a strip; blocking units for blocking introduction of pollutants into the molten metal pool, wherein each of the blocking units includes front and rear barrier members which are mounted on each of the chambers and in close contact with an outer periphery of each casting roll and a blower for injecting inert gas toward the outer periphery of each casting roll; operating units for adjusting the thickness and the width of gas layers at both ends of the casting rolls, wherein each of the operating units includes suction lines connected with each chamber to transmit a suction force to ends of each casting roll and a pair of movable plates slidably assembled to both side portions within each chamber for being reciprocated by movable members; and a control unit for controlling the suction force