Patents by Inventor Kyung Beom Seo

Kyung Beom Seo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11949881
    Abstract: The present invention discloses an encoding apparatus using a Discrete Cosine Transform (DCT) scanning, which includes a mode selection means for selecting an optimal mode for intra prediction; an intra prediction means for performing intra prediction onto video inputted based on the mode selected in the mode selection means; a DCT and quantization means for performing DCT and quantization onto residual coefficients of a block outputted from the intra prediction means; and an entropy encoding means for performing entropy encoding onto DCT coefficients acquired from the DCT and quantization by using a scanning mode decided based on pixel similarity of the residual coefficients.
    Type: Grant
    Filed: April 1, 2021
    Date of Patent: April 2, 2024
    Assignees: Electronics and Telecommunications Research Institute, Kwangwoon University Research Institute for Industry Cooperation, Industry-Academia Cooperation Group of Sejong University
    Inventors: Se-Yoon Jeong, Hae-Chul Choi, Jeong-Il Seo, Seung-Kwon Beack, In-Seon Jang, Jae-Gon Kim, Kyung-Ae Moon, Dae-Young Jang, Jin-Woo Hong, Jin-Woong Kim, Yung-Lyul Lee, Dong-Gyu Sim, Seoung-Jun Oh, Chang-Beom Ahn, Dae-Yeon Kim, Dong-Kyun Kim
  • Publication number: 20240014175
    Abstract: A stack package includes stacked semiconductor dies and an encapsulant. The encapsulant is formed to cover sides of the stacked semiconductor dies. A first semiconductor die of the stack package has an overhang portion that protrudes farther into the encapsulant than a second semiconductor die of the stack package.
    Type: Application
    Filed: October 28, 2022
    Publication date: January 11, 2024
    Applicant: SK hynix Inc.
    Inventors: Kyung Beom SEO, Jong Kyu MOON, Jong Hyock PARK
  • Patent number: 11501981
    Abstract: Disclosed is a method for fabricating a semiconductor package. A mold press with upper and lower chases is used. A molded underfill (MUF) material is dispensed on a bottom surface of a mold cavity to form a first dispensed pattern with a serpentine shape. A base substrate on which die stacks are mounted is loaded on the upper chase. The mold cavity in which the die stacks are inserted is closed and MUF material flows between the die stacks to impregnate the die stacks.
    Type: Grant
    Filed: March 16, 2021
    Date of Patent: November 15, 2022
    Assignee: SK hynix Inc.
    Inventors: Kyung Beom Seo, Jong Kyu Moon, Jong Hyock Park, Song Na
  • Publication number: 20220115247
    Abstract: Disclosed is a method for fabricating a semiconductor package. A mold press with upper and lower chases is used. A molded underfill (MUF) material is dispensed on a bottom surface of a mold cavity to form a first dispensed pattern with a serpentine shape. A base substrate on which die stacks are mounted is loaded on the upper chase. The mold cavity in which the die stacks are inserted is closed and MUF material flows between the die stacks to impregnate the die stacks.
    Type: Application
    Filed: March 16, 2021
    Publication date: April 14, 2022
    Applicant: SK hynix Inc.
    Inventors: Kyung Beom SEO, Jong Kyu MOON, Jong Hyock PARK, Song NA
  • Patent number: 9758654
    Abstract: A polypropylene resin composition, particularly, an olefin-based polypropylene resin composition includes: about 50 to 70% by weight of a high crystalline polypropylene; about 10 to 20% by weight of a reactor made thermoplastic polyolefin (RTPO) polypropylene; about 5 to 20% by weight of an inorganic filler; about 10 to 20% by weight of a rubber elastomer; and about 3% by weight or less of a slip agent, based on the total weight of the composition. The composition provides excellent physical properties such as high strength and impact resistance, and thus superior resistance to damage, and shows low gloss characteristics and excellent fluidity. The polypropylene resin composition is used as interior and exterior materials for vehicles.
    Type: Grant
    Filed: June 6, 2013
    Date of Patent: September 12, 2017
    Assignees: Hyundai Motor Company, Daeha Co., Ltd.
    Inventors: Kyeong-Hoon Jang, Dae-Sik Kim, Han-Ki Lee, Hak-Soo Kim, Jung-Gyun Noh, Tae-Sik Lee, Im-Taek Sung, Kyung-Beom Seo
  • Patent number: 9139725
    Abstract: Disclosed is a polypropylene resin composition for automobile interior trim parts with superior paint adhesivity and low specific gravity. More specifically, a polypropylene resin composition for automobile interior trim parts having superior paint adhesivity and low specific gravity is disclosed, wherein a base resin including polypropylene, a propylene-ethylene copolymer or a mixture thereof is mixed with a reinforcer including magnesium hydroxide and an ethylene-butene elastomer. The present polypropylene resin composition allows for direct painting of an automobile interior trim part surface without primer treatment and provides excellent resistance to damage caused by impact.
    Type: Grant
    Filed: May 21, 2013
    Date of Patent: September 22, 2015
    Assignees: Hyundai Motor Company, Kia Motor Corporation, Daeha Co., Ltd.
    Inventors: Jung Gyun Noh, Kyeong Hoon Jang, Hak Soo Kim, Han Ki Lee, Kyung Beom Seo, Han Pyol Kim, Im Taek Sung
  • Publication number: 20140187694
    Abstract: Disclosed is a polypropylene resin composition and interior and exterior materials for vehicles using the same, particularly an olefin-based polypropylene resin composition including: about 50 to 70% by weight of a high crystalline polypropylene; about 10 to 20% by weight of a reactor made thermoplastic polyolefin (RTPO) polypropylene; about 5 to 20% by weight of an inorganic filler; about 10 to 20% by weight of a rubber elastomer; and about 3% by weight or less of a slip agent, based on the total weight of the composition. The composition provides excellent physical properties such as high strength and impact resistance, and thus superior resistance to damage, and shows low gloss characteristics and excellent fluidity.
    Type: Application
    Filed: June 6, 2013
    Publication date: July 3, 2014
    Inventors: Kyeong-Hoon Jang, Dae-Sik Kim, Han-Ki Lee, Hak-Soo Kim, Jung-Gyun Noh, Tae-Sik Lee, Im-Taek Sung, Kyung-Beom Seo
  • Publication number: 20140135440
    Abstract: Disclosed is a polypropylene resin composition for automobile interior trim parts with superior paint adhesivity and low specific gravity. More specifically, a polypropylene resin composition for automobile interior trim parts having superior paint adhesivity and low specific gravity is disclosed, wherein a base resin including polypropylene, a propylene-ethylene copolymer or a mixture thereof is mixed with a reinforcer including magnesium hydroxide and an ethylene-butene elastomer. The present polypropylene resin composition allows for direct painting of an automobile interior trim part surface without primer treatment and provides excellent resistance to damage caused by impact.
    Type: Application
    Filed: May 21, 2013
    Publication date: May 15, 2014
    Inventors: Jung Gyun Noh, Kyeong Hoon Jang, Hak Soo Kim, Han Ki Lee, Kyung Beom Seo, Han Pyol Kim, Im Taek Sung