Patents by Inventor Kyung Bo LEE

Kyung Bo LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING DEVICE, AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
    Publication number: 20240120177
    Abstract: A substrate processing method is provided. The substrate processing method comprises loading a substrate onto a substrate support inside a chamber, forming a plasma inside the chamber, providing a first DC pulse signal to an electromagnet that generates a magnetic field inside the chamber and processing the substrate with the plasma, wherein the first DC pulse signal is repeated at a first period including a first section and a second section subsequent to the first section, the first DC pulse signal has a first level during the first section, and the first DC pulse signal has a second level different from the first level during the second section.
    Type: Application
    Filed: September 19, 2023
    Publication date: April 11, 2024
    Inventors: Ji Mo LEE, Dong Hyeon NA, Myeong Soo SHIN, Woong Jin CHEON, Kyung-Sun KIM, Jae Bin KIM, Tae-Hwa KIM, Seung Bo SHIM
  • Polishing head, substrate processing apparatus including the same and processing method of substrate using the same
    Patent number: 11919122
    Abstract: A substrate processing apparatus includes: a conveyor belt configured to have an outer surface on which a bottom surface of a substrate is seated; and a polishing head unit configured to face an upper surface of the substrate, wherein the polishing head unit includes: a polishing head connected to a driver; a polishing pad configured to face the polishing head; a polishing pad fixing ring disposed between the polishing head and the polishing pad; and a temperature sensor configured to overlap the polishing pad fixing ring and to be spaced apart from the polishing pad fixing ring.
    Type: Grant
    Filed: September 29, 2020
    Date of Patent: March 5, 2024
    Assignees: SAMSUNG DISPLAY CO., LTD., KCTECH CO., LTD.
    Inventors: Seung Bae Kang, Sung Hyeon Park, Jung Gun Nam, Joon-Hwa Bae, Kyung Bo Lee, Keun Woo Lee, Woo Jin Cho, Byoung Kwon Choo
  • POLISHING HEAD, SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME AND PROCESSING METHOD OF SUBSTRATE USING THE SAME
    Publication number: 20210114163
    Abstract: A substrate processing apparatus includes: a conveyor belt configured to have an outer surface on which a bottom surface of a substrate is seated; and a polishing head unit configured to face an upper surface of the substrate, wherein the polishing head unit includes: a polishing head connected to a driver; a polishing pad configured to face the polishing head; a polishing pad fixing ring disposed between the polishing head and the polishing pad; and a temperature sensor configured to overlap the polishing pad fixing ring and to be spaced apart from the polishing pad fixing ring.
    Type: Application
    Filed: September 29, 2020
    Publication date: April 22, 2021
    Inventors: Seung Bae KANG, Sung Hyeon PARK, Jung Gun NAM, Joon-Hwa BAE, Kyung Bo LEE, Keun Woo LEE, Woo Jin CHO, Byoung Kwon CHOO