Abstract: There are provided a rigid flexible printed circuit board and a method of manufacturing the same. The rigid flexible printed circuit board according to an exemplary embodiment of the present disclosure includes: a flexible board including a flexible region, a first rigid region formed at one side of the flexible region, and a second rigid region formed at the other side of the flexible region; a first rigid board formed on the flexible board and formed in the first rigid region and the second rigid region; and a second rigid board formed below the flexible board and formed in the first rigid region.

Abstract: A flexible printed circuit board and a manufacturing method thereof are disclosed. The flexible printed circuit board in accordance with an aspect of the present invention includes: a base board including a flexible region; an inner circuit layer formed on the base board; a flexible laminate laminated on the base board and having a portion thereof removed, the portion having been laminated on the flexible region; and an outer circuit layer formed on the flexible laminate. The flexible laminate is formed by having an adhesive layer, a polyimide layer and a copper foil layer sequentially laminated and is arranged and laminated in such a way that the adhesive layer faces the base board.

Abstract: There are provided a rigid flexible printed circuit board and a method of manufacturing the same. The rigid flexible printed circuit board according to an exemplary embodiment of the present disclosure includes: a flexible board including a flexible region, a first rigid region formed at one side of the flexible region, and a second rigid region formed at the other side of the flexible region; a first rigid board formed on the flexible board and formed in the first rigid region and the second rigid region; and a second rigid board formed below the flexible board and formed in the first rigid region.

Abstract: Disclosed herein are a rigid flexible printed circuit board and a method of manufacturing the same. The rigid flexible printed circuit board includes: a flexible substrate having a flexible region and a plurality of rigid regions; a first insulating layer formed in the rigid regions and extended from the rigid regions to cover a portion of the flexible region; and a plurality of build-up layers formed in the first insulating layer of the rigid regions and including a build-up insulating layer and a circuit pattern, wherein at least one of the plurality of build-up layers has a thickness different from those of the other build-up layers.