Abstract: Disclosed is a wireless charging delivery module used in a wireless charging system. The wireless charging delivery module includes at least one first antenna that receives a power signal in at least one frequency band from at least one transmitter in a radio frequency (RF) scheme, at least one matching unit connected to the at least one first antenna to match and output the power signal in the at least one frequency band, a frequency converter connected to the at least one matching unit to convert the power signal in the at least one frequency band into a power signal in a specific frequency band of the receiver, and a second antenna connected to the frequency converter to transmit the power signal in the specific frequency band to the receiver in one of a magnetic resonance scheme and a magnetic induction scheme.

Abstract: A method of fabricating a semiconductor device is provided in which an adhesive layer is disposed on a first surface of a first semiconductor substrate. A carrier substrate is provided on the first surface of the first semiconductor substrate, and the carrier substrate is separated from a surface of the adhesive layer while the adhesive layer is still attached to the first surface of the first semiconductor substrate.

Abstract: Disclosed is a transmitter used for a wireless charging system. The transmitter includes a plurality of phase locked loops (PLLs) that outputs single-phase power signals, a plurality of antennas that transmits power signals transmitted from the plurality of PLLs to a receiver, and a controller that determines a specific frequency for the receiver based on a signal strength indication (RSSI) received from the receiver and allows output frequencies of the plurality of PLLs to be different from each other in a specific frequency band preset based on the specific frequency.

Abstract: A method of fabricating a semiconductor device is provided in which an adhesive layer is disposed on a first surface of a first semiconductor substrate. A carrier substrate is provided on the first surface of the first semiconductor substrate, and the carrier substrate is separated from a surface of the adhesive layer while the adhesive layer is still attached to the first surface of the first semiconductor substrate.

Abstract: Disclosed is a wireless charging system of using multi-frequency including at least one transmitter and at least one receiver which is wirelessly charged by the at least one transmitter, wherein the at least one transmitter includes a signal generator configured to generate a power signal of each of a plurality of frequency bands; a plurality of matching units connected to the signal generator matching and outputting the power signal of each of the plurality of frequency bands; and at least one antenna connected to the plurality of matching units transmitting the power signal of each of the plurality of frequency bands to each of at least one receiver, and wherein the at least one receiver includes at least one antenna receiving a power signal of each of a plurality of frequency bands from each of at least one transmitter; a plurality of matching units connected to the at least one antenna matching and outputting the power signal of each of the plurality of frequency bands; and a plurality of rectifiers conne

Abstract: Disclosed is a method of packaging a power amplifier module. The method of packaging a power amplifier module includes providing a unified pattern including a ceramic layer and a pattern formed on the ceramic layer, bonding the unified pattern on a metal layer, and depositing a ceramic sidewall, on which at least one external signal connection lead line is formed, on the unified pattern bonded the metal layer.

Abstract: A method of processing a substrate includes attaching a first surface of a planarization film to a processing target substrate, disposing an electrostatic carrier onto a second surface opposite the first surface of the planarization film, fixing the processing target substrate to the electrostatic carrier by supplying power to the electrostatic carrier, and performing processing on the processing target substrate.

Abstract: Disclosed is a wireless charging delivery module used in a wireless charging system. The wireless charging delivery module includes at least one first antenna that receives a power signal in at least one frequency band from at least one transmitter in a radio frequency (RF) scheme, at least one matching unit connected to the at least one first antenna to match and output the power signal in the at least one frequency band, a frequency converter connected to the at least one matching unit to convert the power signal in the at least one frequency band into a power signal in a specific frequency band of the receiver, and a second antenna connected to the frequency converter to transmit the power signal in the specific frequency band to the receiver in one of a magnetic resonance scheme and a magnetic induction scheme.

Abstract: Disclosed is a transmitter used in a wireless charging system. The transmitter includes at least one phase locked loop (PLL) that outputs a power signal, a first antenna that transmits the power signal transmitted from the at least one PLL to at least one receiver in an RF scheme, a second antenna that transmits the power signal to the at least one receiver in one of a magnetic resonance scheme and a magnetic induction scheme, and a controller that selectively drives at least one of the first and second antennas.

Abstract: Disclosed is a transmitter used for a wireless charging system. The transmitter includes a plurality of phase locked loops (PLLs) that outputs single-phase power signals, a plurality of antennas that transmits power signals transmitted from the plurality of PLLs to a receiver, and a controller that determines a specific frequency for the receiver based on a signal strength indication (RSSI) received from the receiver and allows output frequencies of the plurality of PLLs to be different from each other in a specific frequency band preset based on the specific frequency.

Abstract: A band-type electronic device and an antenna module included therein are provided. The band-type electronic device includes a band configured to be worn on a body of a user, a metal housing configured to connect to the band, and a frequency control module configured to operate such that the metal housing is used as a wireless charging antenna.

Abstract: Disclosed is a wireless charging system of using multi-frequency including at least one transmitter and at least one receiver which is wirelessly charged by the at least one transmitter, wherein the at least one transmitter includes a signal generator configured to generate a power signal of each of a plurality of frequency bands; a plurality of matching units connected to the signal generator matching and outputting the power signal of each of the plurality of frequency bands; and at least one antenna connected to the plurality of matching units transmitting the power signal of each of the plurality of frequency bands to each of at least one receiver, and wherein the at least one receiver includes at least one antenna receiving a power signal of each of a plurality of frequency bands from each of at least one transmitter; a plurality of matching units connected to the at least one antenna matching and outputting the power signal of each of the plurality of frequency bands; and a plurality of rectifiers conne

Abstract: A band-type electronic device and an antenna module included therein are provided. The band-type electronic device includes a band configured to be worn on a body of a user, a metal housing configured to connect to the band, and a frequency control module configured to operate such that the metal housing is used as a wireless charging antenna.

Abstract: Disclosed is a method of packaging a power amplifier module. The method of packaging a power amplifier module includes providing a unified pattern including a ceramic layer and a pattern formed on the ceramic layer, bonding the unified pattern on a metal layer, and depositing a ceramic sidewall, on which at least one external signal connection lead line is formed, on the unified pattern bonded the metal layer.