Patents by Inventor Kyung Han Ryu
Kyung Han Ryu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11948887Abstract: Various aspects of the present disclosure provide a device that comprises an electronic device comprising a first device side, a second device side, and a first lateral device side. The example device may, for example, also comprise a substrate comprising a first substrate side, a second substrate side, and a first lateral substrate side. The substrate may, for example, comprise a first conductive pattern, a first barrier structure, and a second conductive pattern. The first conductive pattern may, for example, comprise a first side, a second side, and a first lateral side. The first barrier structure may, for example, be on the first lateral side of the first conductive pattern. The second conductive pattern may, for example, comprise a first side, a second side, and a first lateral side. The first lateral side of the second conductive pattern may, for example, be free of a metal barrier structure.Type: GrantFiled: April 26, 2022Date of Patent: April 2, 2024Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.Inventors: Ki Yeul Yang, Kyung Han Ryu, Hyun Cho
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Patent number: 11897761Abstract: In one example, an electronic device includes a semiconductor sensor device having a cavity extending partially inward from one surface to provide a diaphragm adjacent an opposite surface. A barrier is disposed adjacent to the one surface and extends across the cavity, the barrier has membrane with a barrier body and first barrier strands bounded by the barrier body to define first through-holes. The electronic device further comprises one or more of a protrusion pattern disposed adjacent to the barrier structure, which can include a plurality of protrusion portions separated by a plurality of recess portions; one or more conformal membrane layers disposed over the first barrier strands; or second barrier strands disposed on and at least partially overlapping the first barrier strands. The second barrier strands define second through-holes laterally offset from the first through-holes. Other examples and related methods are also disclosed herein.Type: GrantFiled: June 6, 2022Date of Patent: February 13, 2024Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Ki Yeul Yang, Kyung Han Ryu, Seok Hun Yun, Bora Baloglu, Hyun Cho, Ramakanth Alapati
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Publication number: 20220415733Abstract: In one example, an electronic device comprises a cavity substrate comprising a substrate base comprising a top side and a bottom side and a cavity wall over the substrate base and defining a cavity, an electronic component over the substrate base and in the cavity, a lid comprising a top side and a bottom side, wherein the lid is over the substrate base and the cavity wall to define an interior of the cavity and an exterior of the cavity, an adhesive between the bottom side of the lid and a top side of the cavity wall, and a vent seal between the interior of the cavity and the exterior of the cavity. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: June 29, 2021Publication date: December 29, 2022Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Kwang Seok Oh, Chang Uk Jang, Jin Seok Ryu, Seung Jae Yu, Weilung Lu, Adrian Arcedera, Seung Mo Kim, Kyung Han Ryu, Yi Seul Han, Woo Jun Kim, Tae Yong Lee
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Publication number: 20220298008Abstract: In one example, an electronic device includes a semiconductor sensor device having a cavity extending partially inward from one surface to provide a diaphragm adjacent an opposite surface. A barrier is disposed adjacent to the one surface and extends across the cavity, the barrier has membrane with a barrier body and first barrier strands bounded by the barrier body to define first through-holes. The electronic device further comprises one or more of a protrusion pattern disposed adjacent to the barrier structure, which can include a plurality of protrusion portions separated by a plurality of recess portions; one or more conformal membrane layers disposed over the first barrier strands; or second barrier strands disposed on and at least partially overlapping the first barrier strands. The second barrier strands define second through-holes laterally offset from the first through-holes. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: June 6, 2022Publication date: September 22, 2022Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Ki Yeul YANG, Kyung Han RYU, Seok Hun YUN, Bora BALOGLU, Hyun CHO, Ramakanth ALAPATI
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Publication number: 20220254726Abstract: Various aspects of the present disclosure provide a device that comprises an electronic device comprising a first device side, a second device side, and a first lateral device side. The example device may, for example, also comprise a substrate comprising a first substrate side, a second substrate side, and a first lateral substrate side. The substrate may, for example, comprise a first conductive pattern, a first barrier structure, and a second conductive pattern. The first conductive pattern may, for example, comprise a first side, a second side, and a first lateral side. The first barrier structure may, for example, be on the first lateral side of the first conductive pattern. The second conductive pattern may, for example, comprise a first side, a second side, and a first lateral side. The first lateral side of the second conductive pattern may, for example, be free of a metal barrier structure.Type: ApplicationFiled: April 26, 2022Publication date: August 11, 2022Inventors: Ki Yeul Yang, Kyung Han Ryu, Hyun Cho
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Patent number: 11352252Abstract: In one example, an electronic device includes a semiconductor sensor device having a cavity extending partially inward from one surface to provide a diaphragm adjacent an opposite surface. A barrier is disposed adjacent to the one surface and extends across the cavity, the barrier has membrane with a barrier body and first barrier strands bounded by the barrier body to define first through-holes. The electronic device further comprises one or more of a protrusion pattern disposed adjacent to the barrier structure, which can include a plurality of protrusion portions separated by a plurality of recess portions; one or more conformal membrane layers disposed over the first barrier strands; or second barrier strands disposed on and at least partially overlapping the first barrier strands. The second barrier strands define second through-holes laterally offset from the first through-holes. Other examples and related methods are also disclosed herein.Type: GrantFiled: June 21, 2019Date of Patent: June 7, 2022Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Ki Yeul Yang, Kyung Han Ryu, Seok Hun Yun, Bora Baloglu, Hyun Cho, Ramakanth Alapati
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Patent number: 11315875Abstract: Various aspects of the present disclosure provide a device that comprises an electronic device comprising a first device side, a second device side, and a first lateral device side. The example device may, for example, also comprise a substrate comprising a first substrate side, a second substrate side, and a first lateral substrate side. The substrate may, for example, comprise a first conductive pattern, a first barrier structure, and a second conductive pattern. The first conductive pattern may, for example, comprise a first side, a second side, and a first lateral side. The first barrier structure may, for example, be on the first lateral side of the first conductive pattern. The second conductive pattern may, for example, comprise a first side, a second side, and a first lateral side. The first lateral side of the second conductive pattern may, for example, be free of a metal barrier structure.Type: GrantFiled: October 28, 2019Date of Patent: April 26, 2022Assignee: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE. LTD.Inventors: Ki Yeul Yang, Kyung Han Ryu, Hyun Cho
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Publication number: 20210125934Abstract: Various aspects of the present disclosure provide a device that comprises an electronic device comprising a first device side, a second device side, and a first lateral device side. The example device may, for example, also comprise a substrate comprising a first substrate side, a second substrate side, and a first lateral substrate side. The substrate may, for example, comprise a first conductive pattern, a first barrier structure, and a second conductive pattern. The first conductive pattern may, for example, comprise a first side, a second side, and a first lateral side. The first barrier structure may, for example, be on the first lateral side of the first conductive pattern. The second conductive pattern may, for example, comprise a first side, a second side, and a first lateral side. The first lateral side of the second conductive pattern may, for example, be free of a metal barrier structure.Type: ApplicationFiled: October 28, 2019Publication date: April 29, 2021Inventors: Ki Yeul Yang, Kyung Han Ryu, Hyun Cho
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Publication number: 20200399119Abstract: In one example, an electronic device includes a semiconductor sensor device having a cavity extending partially inward from one surface to provide a diaphragm adjacent an opposite surface. A barrier is disposed adjacent to the one surface and extends across the cavity, the barrier has membrane with a barrier body and first barrier strands bounded by the barrier body to define first through-holes. The electronic device further comprises one or more of a protrusion pattern disposed adjacent to the barrier structure, which can include a plurality of protrusion portions separated by a plurality of recess portions; one or more conformal membrane layers disposed over the first barrier strands; or second barrier strands disposed on and at least partially overlapping the first barrier strands. The second barrier strands define second through-holes laterally offset from the first through-holes. Other examples and related methods are also disclosed herein.Type: ApplicationFiled: June 21, 2019Publication date: December 24, 2020Applicants: Amkor Technology Korea, Inc., Amkor Technology Inc.Inventors: Ki Yeul YANG, Kyung Han RYU, Seok Hun YUN, Bora BALOGLU, Hyun CHO, Ramakanth ALAPATI
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Patent number: 10388619Abstract: A semiconductor device and a manufacturing method thereof, which can reduce a size of the semiconductor device. As a non-limiting example, various aspects of this disclosure provide for a reduction in package size based at least in part on patterning techniques for forming interconnection structures.Type: GrantFiled: August 26, 2015Date of Patent: August 20, 2019Assignee: Amkor Technology, Inc.Inventors: Sung Woong Hong, Jun Park, Kyung Han Ryu
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Publication number: 20170200782Abstract: Provided are a capacitor of a semiconductor integrated circuit and a method for manufacturing the same, for example a metal-insulator-metal (MIM) type capacitor of a semiconductor integrated circuit, which is capable of improving adhesive force between an electrode layer and a dielectric layer of a capacitor, and a method for manufacturing the same. For example, the present disclosure provides a capacitor for a semiconductor integrated circuit having a new structure, which is capable of preventing a delamination phenomenon on an interface between a lower electrode layer and a dielectric layer by further forming a buffer layer, which is capable of decreasing or compensating for a difference in a coefficient of thermal expansion, between a metal electrode layer and a dielectric layer, particularly, between the lower electrode layer and the dielectric layer, and a method for manufacturing the same.Type: ApplicationFiled: May 6, 2016Publication date: July 13, 2017Inventors: Han Min Lee, Pan Ju Choi, Kwang Sun Oh, Sung Man Hong, Sung Woong Hong, Kyung Han Ryu
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Publication number: 20160133591Abstract: A semiconductor device and a manufacturing method thereof, which can reduce a size of the semiconductor device. As a non-limiting example, various aspects of this disclosure provide for a reduction in package size based at least in part on patterning techniques for forming interconnection structures.Type: ApplicationFiled: August 26, 2015Publication date: May 12, 2016Inventors: Sung Woong Hong, Jun Park, Kyung Han Ryu
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Patent number: 8828802Abstract: A wafer level chip scale package includes a first dielectric layer having a first surface, a second surface, and a main through hole passing through the first dielectric layer between the first and second surfaces. A semiconductor die is disposed in the main through hole of the first dielectric layer and including a bond pad disposed away from the first surface of the first dielectric layer. A redistribution layer is electrically connected to the bond pad of the semiconductor die and extends along the second surface of the first dielectric layer. A second dielectric layer covers the first dielectric layer and the redistribution layer and has an opening exposing the redistribution layer. An under bump metal fills the opening of the second dielectric layer and is electrically connected to the redistribution layer. A solder ball is electrically connected to the under bump metal.Type: GrantFiled: November 1, 2011Date of Patent: September 9, 2014Inventors: Sung Su Park, Kyung Han Ryu, Sang Mok Lee