Patents by Inventor Kyung Hun Jung

Kyung Hun Jung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210295856
    Abstract: Provided are a device and a method for transmitting and receiving voice data in a wireless communication system. A method for operating a transmission terminal for transmitting a voice signal comprises the steps of: generating sampling and bitrate request information including sampling information for determining a sampling rate of the voice signal and bitrate information for determining a bitrate of the voice signal, and transmitting the generated sampling and bitrate request information to a reception terminal; receiving, from the reception terminal, combined determination information obtained by at least one combination of the sampling rate determined on the basis of the sampling information and the bitrate determined on the basis of the bitrate information; and compressing the voice signal according to the received combined determination information, and transmitting the compressed voice signal to the reception terminal.
    Type: Application
    Filed: June 4, 2021
    Publication date: September 23, 2021
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Kyung-hun JUNG
  • Patent number: 11056126
    Abstract: Provided are a device and a method for transmitting and receiving voice data in a wireless communication system. A method for operating a transmission terminal for transmitting a voice signal comprises the steps of: generating sampling and bitrate request information including sampling information for determining a sampling rate of the voice signal and bitrate information for determining a bitrate of the voice signal, and transmitting the generated sampling and bitrate request information to a reception terminal; receiving, from the reception terminal, combined determination information obtained by at least one combination of the sampling rate determined on the basis of the sampling information and the bitrate determined on the basis of the bitrate information; and compressing the voice signal according to the received combined determination information, and transmitting the compressed voice signal to the reception terminal.
    Type: Grant
    Filed: September 12, 2019
    Date of Patent: July 6, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Kyung-hun Jung
  • Publication number: 20210203093
    Abstract: The present invention relates to a board mating connector including a first body part having a first hollow portion formed therein, a signal contact part inserted into the first hollow portion, a dielectric part positioned between the first body part and the signal contact part, a second body part which has a second hollow portion formed therein, is positioned between the dielectric part and the first body part, and is formed of a metal plate, and a ground contact part which extends upward from an upper side of the second body part and is separated into a plurality of portions by a plurality of slits to have elasticity.
    Type: Application
    Filed: November 20, 2020
    Publication date: July 1, 2021
    Inventors: Kyung Hun JUNG, Hwa Yoon SONG, Young Jo KIM, Yu Jin LEE, Jae Jun LEE, Sang Min SEO, Hee seok JUNG
  • Publication number: 20210203092
    Abstract: The present invention relates to a board mating connector including a first body part having a first hollow portion formed therein, a signal contact part inserted into the first hollow portion, a dielectric part positioned between the first body part and the signal contact part, a second body part which has a second hollow portion formed therein, is positioned between the dielectric part and the first body part, and is formed of a metal plate, and a ground contact part which extends upward from an upper side of the second body part and is separated into a plurality of portions by a plurality of slits to have elasticity.
    Type: Application
    Filed: November 20, 2020
    Publication date: July 1, 2021
    Inventors: Kyung Hun JUNG, Hwa Yoon SONG, Young Jo KIM, Yu Jin LEE, Jae Jun LEE, Sang Min SEO, Hee seok JUNG
  • Patent number: 11037581
    Abstract: Provided is a method for processing a signal adaptively to a noisy environment, the method including: determining a class related to enhancement of intelligibility, based on a noise spectrum of a reception side or a near-end device and a received voice spectrum; generating guide information for the enhancement of intelligibility based on the noise spectrum, the voice spectrum, and the determined class; and generating a changed voice spectrum by applying the guide information to the voice spectrum.
    Type: Grant
    Filed: June 26, 2017
    Date of Patent: June 15, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ki-hyun Choo, Holly Francois, Eun-mi Oh, Chang-yeong Kim, Ho-sang Sung, Kyung-hun Jung
  • Patent number: 11025552
    Abstract: A playout delay adjustment method includes: adjusting a playout delay surplus based on a difference value between a first playout delay obtained in a first scheme and a second playout delay obtained in a second scheme and determining an adaptation type of a current frame according to whether a previous frame is an active frame; and when the determined adaptation type is signal-based adaptation, performing time scale modification (TSM) according to an adaptation scheme determined according to a comparison result between the first playout delay and the second playout delay and a comparison result between a target delay and the first playout delay.
    Type: Grant
    Filed: September 5, 2016
    Date of Patent: June 1, 2021
    Assignees: SAMSUNG ELECTRONICS CO., LTD., INDUSTRY—UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY ERICA CAMPUS
    Inventors: Ho-sang Sung, Sang-won Kang, Jong-hyun Kim, Eun-mi Oh, Yaxing Li, Kyung-hun Jung
  • Publication number: 20210143596
    Abstract: The present invention relates to a connection having a joint with a limited range of motion, the connector including: a connection connector including a connection signal pin, a connection dielectric surrounding the connection signal pin, and a connection ground electrically insulated from the connection signal pin by the connection dielectric; and a first fixed connector into which one side of the connection connector is inserted and which allows a joint of the connection connector to move on the basis of the inserted one side of the connection connector, wherein the connection ground includes a connection protruding portion formed so that one end of the connection ground protrudes outward, a connection limiting portion which is adjacent to the connection protruding portion, has a thickness smaller than a thickness of the connection protruding portion, and comes in contact with an inner side of the first fixed connector to limit a range of motion of the joint of the connection connector, a connection elastic
    Type: Application
    Filed: September 30, 2020
    Publication date: May 13, 2021
    Inventors: Kyung Hun JUNG, Sun Hwa CHA, Hwa Yoon SONG, Chang Hyun YANG, Jae Jun LEE, Sang Min SEO, Hee seok JUNG
  • Patent number: 10972854
    Abstract: Provided are a method and an apparatus for increasing call quality while reducing consumption of bit rates in immersive multimedia communication. A method of transmitting, by a terminal device, an audio signal to a counterpart terminal device, includes: extracting head tracking information of a user of the counterpart terminal device from a packet received from the counterpart terminal device; predicting a head direction of the user of the counterpart terminal device after a predetermined time period, based on the extracted head tracking information; generating audio output signals by combining audio input signals received via a plurality of microphones, based on the predicted head direction; and transmitting information about the predicted head direction and a sound frame in which the audio output signals are compressed, to the counterpart terminal device.
    Type: Grant
    Filed: March 7, 2017
    Date of Patent: April 6, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kyung-hun Jung, Byeong-hoon Kwak, Ho-sang Sung, Eun-mi Oh, Jong-hoon Jeong, Ki-hyun Choo, Betlehem Terence
  • Publication number: 20210028567
    Abstract: A board mating connector includes a signal contact unit, a first ground portion including a hollow portion formed thereinside to accommodate at least a portion of the signal contact unit, a second ground portion including a hollow portion formed thereinside to accommodate at least a portion of the signal contact unit and at least a portion of the first ground portion, and an elastic member disposed between the first ground portion and the second ground portion to provide an elastic restoring force in a first direction. The first ground portion includes a first protrusion protruding outward or inward from a lower end portion thereof, and the second ground portion includes a second protrusion protruding from an upper end portion thereof in a direction different from that of the first protrusion. The first protrusion is engaged with the second protrusion in the hollow portion of the second ground portion.
    Type: Application
    Filed: June 19, 2020
    Publication date: January 28, 2021
    Inventors: Sun Hwa Cha, Hwa Yoon Song, Kyung Hun Jung, Hee seok Jung
  • Patent number: D908637
    Type: Grant
    Filed: July 31, 2020
    Date of Patent: January 26, 2021
    Assignee: GIGALANE CO., LTD.
    Inventors: Kyung Hun Jung, Hwa Yoon Song, Hee Seok Jung, Jin Uk Lee, Chang Hyun Yang, Sun Hwa Cha, Eun Jung Kim
  • Patent number: D908638
    Type: Grant
    Filed: August 1, 2020
    Date of Patent: January 26, 2021
    Assignee: GIGALANE CO., LTD.
    Inventors: Kyung Hun Jung, Hwa Yoon Song, Hee Seok Jung, Jin Uk Lee, Chang Hyun Yang, Sun Hwa Cha, Eun Jung Kim
  • Patent number: D908639
    Type: Grant
    Filed: August 1, 2020
    Date of Patent: January 26, 2021
    Assignee: GIGALANE CO., LTD.
    Inventors: Kyung Hun Jung, Hwa Yoon Song, Hee Seok Jung, Jin Uk Lee, Chang Hyun Yang, Sun Hwa Cha, Eun Jung Kim
  • Patent number: D909311
    Type: Grant
    Filed: August 1, 2020
    Date of Patent: February 2, 2021
    Assignee: GIGALANE CO., LTD.
    Inventors: Kyung Hun Jung, Hwa Yoon Song, Hee Seok Jung, Jin Uk Lee, Chang Hyun Yang, Sun Hwa Cha, Eun Jung Kim
  • Patent number: D913945
    Type: Grant
    Filed: January 10, 2019
    Date of Patent: March 23, 2021
    Assignee: GigaLane Co., Ltd.
    Inventors: Kyung Hun Jung, Hwa Yoon Song, Jin Uk Lee, Hee seok Jung, Chang Hyun Yang, Sun Hwa Cha, Eun Jung Kim
  • Patent number: D914606
    Type: Grant
    Filed: September 28, 2020
    Date of Patent: March 30, 2021
    Assignee: GIGALANE CO., LTD.
    Inventors: Kyung Hun Jung, Hwa Yoon Song, Hee Seok Jung, Jin Uk Lee, Chang Hyun Yang, Sun Hwa Cha, Eun Jung Kim
  • Patent number: D915286
    Type: Grant
    Filed: September 28, 2020
    Date of Patent: April 6, 2021
    Assignee: GIGALANE CO., LTD.
    Inventors: Kyung Hun Jung, Hwa Yoon Song, Hee Seok Jung, Jin Uk Lee, Chang Hyun Yang, Sun Hwa Cha, Eun Jung Kim
  • Patent number: D926693
    Type: Grant
    Filed: September 28, 2020
    Date of Patent: August 3, 2021
    Assignee: GigaLane Co., Ltd.
    Inventors: Kyung Hun Jung, Hwa Yoon Song, Hee Seok Jung, Jin Uk Lee, Chang Hyun Yang, Sun Hwa Cha, Eun Jung Kim
  • Patent number: D926694
    Type: Grant
    Filed: September 28, 2020
    Date of Patent: August 3, 2021
    Assignee: GigaLane Co., Ltd.
    Inventors: Kyung Hun Jung, Hwa Yoon Song, Hee Seok Jung, Jin Uk Lee, Chang Hyun Yang, Sun Hwa Cha, Eun Jung Kim
  • Patent number: D926695
    Type: Grant
    Filed: September 28, 2020
    Date of Patent: August 3, 2021
    Assignee: GigaLane Co., Ltd.
    Inventors: Kyung Hun Jung, Hwa Yoon Song, Hee Seok Jung, Jin Uk Lee, Chang Hyun Yang, Sun Hwa Cha, Eun Jung Kim
  • Patent number: D926696
    Type: Grant
    Filed: September 28, 2020
    Date of Patent: August 3, 2021
    Assignee: GigaLane Co., Ltd.
    Inventors: Kyung Hun Jung, Hwa Yoon Song, Hee Seok Jung, Jin Uk Lee, Chang Hyun Yang, Sun Hwa Cha, Eun Jung Kim