Abstract: A semiconductor device is provided. The semiconductor device includes a first stacked structure including a plurality of first insulating patterns and a plurality of first semiconductor patterns alternately stacked on a substrate, the first stacked structure extending in a first direction parallel to an upper surface of the substrate, a first conductive pattern on one side surface of the first stacked structure, the first conductive pattern extending in a second direction crossing the upper surface of the substrate, and a first ferroelectric layer between the first stacked structure and the first conductive pattern, the first ferroelectric layer extending in the second direction, wherein each of the first semiconductor patterns includes a first impurity region, a first channel region and a second impurity region which are sequentially arranged along the first direction.

Abstract: An example electronic device includes a housing; a touchscreen display; a microphone; at least one speaker; a button disposed on a portion of the housing or set to be displayed on the touchscreen display; a wireless communication circuit; a processor; and a memory. When a user interface is not displayed on the touchscreen display, the electronic device enables a user to receive a user input through the button, receives user speech through the microphone, and then provides data on the user speech to an external server. An instruction for performing a task is received from the server. When the user interface is displayed on the touchscreen display, the electronic device enables the user to receive the user input through the button, receives user speech through the microphone, and then provides data on the user speech to the external server.

Abstract: Provided is a hybrid speaker including a vibration diaphragm having a conductive coating layer formed by coating a conductive material for forming an electrode on a surface of a polymer film and an aerogel layer formed by coating aerogel on the other surface of the polymer film, a piezo element disposed at a surface of the vibration diaphragm, forming opposite poles with the vibration diaphragm, and generating sound pressure by a piezoelectric effect, a PCB electrically connected to the vibration diaphragm and the piezo element and applying an external AC voltage, a first insulation body disposed on the other surface of the vibration diaphragm opposite to the piezo element, and a case accommodating and fixing the above constituent elements and having a sonnd pressure discharge hole in a surface thereof.