Abstract: An antenna module includes a ground layer including a through-hole; a feed via disposed to pass through the through-hole; a patch antenna pattern spaced apart from the ground layer and electrically connected to one end of the feed via; a coupling patch pattern spaced apart from the patch antenna pattern; a first dielectric layer to accommodate the patch antenna pattern and the coupling patch pattern; a second dielectric layer to accommodate at least a portion of the feed via and the ground layer; and electrical connection structures disposed between the first dielectric layer and the second dielectric layer to separate the first dielectric layer from the second dielectric layer.

Abstract: An antenna module includes a ground layer including a through-hole; a feed via disposed to pass through the through-hole; a patch antenna pattern spaced apart from the ground layer and electrically connected to one end of the feed via; a coupling patch pattern spaced apart from the patch antenna pattern; a first dielectric layer to accommodate the patch antenna pattern and the coupling patch pattern; a second dielectric layer to accommodate at least a portion of the feed via and the ground layer; and electrical connection structures disposed between the first dielectric layer and the second dielectric layer to separate the first dielectric layer from the second dielectric layer.

Abstract: An antenna module includes a ground layer including a through-hole; a feed via disposed to pass through the through-hole; a patch antenna pattern spaced apart from the ground layer and electrically connected to one end of the feed via; a coupling patch pattern spaced apart from the patch antenna pattern; a first dielectric layer to accommodate the patch antenna pattern and the coupling patch pattern; a second dielectric layer to accommodate at least a portion of the feed via and the ground layer; and electrical connection structures disposed between the first dielectric layer and the second dielectric layer to separate the first dielectric layer from the second dielectric layer.

Abstract: The present invention relates to a method for controlling a structural member design considering constructability of formwork, comprising: an initial input step S10 wherein drawing information including structural member information is inputted from an input unit; a recognition step S20 wherein space information and structural members are recognized from the drawing information; a space partitioning step S30 wherein arrangement spaces in which previously set standard forms are arranged are determined; a form arrangement step S40 wherein the previously set standard forms are virtually arranged; a coordinate determination step S50 wherein the coordinate positions of the previously set standard forms are recognized; and an optimization step S60 wherein the variable information of the structural members is changed.

Abstract: A shielded electronic device module includes a substrate that includes a first conductive member and a second conductive member separated from each other, a metal housing covering a mounting space on the substrate and connected to the first conductive member and the second conductive member, and a first terminal and a second terminal disposed on a surface of the substrate and connected to the first conductive member and the second conductive member.

Abstract: An antenna module includes a ground layer including a through-hole; a feed via disposed to pass through the through-hole; a patch antenna pattern spaced apart from the ground layer and electrically connected to one end of the feed via; a coupling patch pattern spaced apart from the patch antenna pattern; a first dielectric layer to accommodate the patch antenna pattern and the coupling patch pattern; a second dielectric layer to accommodate at least a portion of the feed via and the ground layer; and electrical connection structures disposed between the first dielectric layer and the second dielectric layer to separate the first dielectric layer from the second dielectric layer.

Abstract: An electronic component package includes a frame, an electronic component, an encapsulant, a metal layer, and a redistribution layer. The frame has a through hole. The electronic component is disposed in the through hole of the frame and has an active surface on which electrode pads are formed and an inactive surface opposing the active surface. The encapsulant covers the inactive surface of the electronic component and is disposed between the frame and the electronic component within the through hole. The metal layer is formed on a surface of the encapsulant. The redistribution layer is disposed adjacently to the active surface of the electronic component and electrically connected to the electrode pads.

Abstract: Disclosed herein is a cage apparatus for construction, which includes: a cage base having a base frame supporting a base foothold to carry out frame work of a building; and a cage gondola unit arranged to be operated relative to the cage base to carry out exterior finish work of the building.

Abstract: The present invention relates to a method for controlling a structural member design considering constructability of formwork, comprising: an initial input step S10 wherein drawing information including structural member information is inputted from an input unit; a recognition step S20 wherein space information and structural members are recognized from the drawing information; a space partitioning step S30 wherein arrangement spaces in which previously set standard forms are arranged are determined; a form arrangement step S40 wherein the previously set standard forms are virtually arranged; a coordinate determination step S50 wherein the coordinate positions of the previously set standard forms are recognized; and an optimization step S60 wherein the variable information of the structural members is changed.

Abstract: An electronic component package includes a frame, an electronic component, an encapsulant, a metal layer, and a redistribution layer. The frame has a through hole. The electronic component is disposed in the through hole of the frame and has an active surface on which electrode pads are formed and an inactive surface opposing the active surface. The encapsulant covers the inactive surface of the electronic component and is disposed between the frame and the electronic component within the through hole. The metal layer is formed on a surface of the encapsulant. The redistribution layer is disposed adjacently to the active surface of the electronic component and electrically connected to the electrode pads.

Abstract: A shielded electronic device module includes a substrate that includes a first conductive member and a second conductive member separated from each other, a metal housing covering a mounting space on the substrate and connected to the first conductive member and the second conductive member, and a first terminal and a second terminal disposed on a surface of the substrate and connected to the first conductive member and the second conductive member.

Abstract: A solder joint structure may include a first active surface on which a plurality of connection terminals are provided, a second active surface on which a plurality of bonding pads are provided, and a plurality of solder bonding portions bonded to the connection terminals and the bonding pads. A bonding area between the connection terminal and the solder bonding portion may be smaller than a bonding area between the bonding pad and the solder bonding portion.

Abstract: There is provided a printed circuit board including: a core substrate; a solder mask selectively covering one surface of the core substrate; an open region of the solder mask including a portion of a surface of the core substrate and partitioned by the solder mask; a ball land formed on the open region of the solder mask; and a barrier formed between the ball land and the solder mask.

Abstract: A lead free solder is provided. The lead free solder includes about 1.5 wt % to about 2.5 wt % silver (Ag), about 3 wt % to about 6 wt % bismuth (Bi), about 0.005 wt % to about 0.1 wt % of a deoxidizing agent, and a balance of tin (Sn). The lead free solder has improved wettability, a lowered melting point, little or substantially no formation of oxidation layer in a solder bath, suppressed brittleness, improved thermal shock resistance and drop resistance.

Abstract: A self movable boom system is provided. The self movable boom system include: a boom disposed on a plane perpendicular to a building clamp structure; and a moving unit apparatus including a circumferential moving unit which is disposed between the boom and the building clamp structure to move the boom on a plane perpendicular to the building clamp structure, a lifting-up unit of which one end is disposed toward the circumferential moving unit and of which other end is disposed toward the building clamp structure to move the boom along a longitudinal direction of the building clamp structure, and a boom moving unit which moves an object along the longitudinal direction of the building clamp structure and along a longitudinal direction of the boom.

Abstract: A self movable boom system is provided. The self movable boom system include: a boom disposed on a plane perpendicular to a building clamp structure; and a moving unit apparatus including a circumferential moving unit which is disposed between the boom and the building clamp structure to move the boom on a plane perpendicular to the building clamp structure, a lifting-up unit of which one end is disposed toward the circumferential moving unit and of which other end is disposed toward the building clamp structure to move the boom along a longitudinal direction of the building clamp structure, and a boom moving unit which moves an object along the longitudinal direction of the building clamp structure and along a longitudinal direction of the boom.

Abstract: A lead free solder is provided. The lead free solder includes about 1.5 wt % to about 2.5 wt % silver (Ag), about 3 wt % to about 6 wt % bismuth (Bi), about 0.005 wt % to about 0.1 wt % of a deoxidizing agent, and a balance of tin (Sn). The lead free solder has improved wettability, a lowered melting point, little or substantially no formation of oxidation layer in a solder bath, suppressed brittleness, improved thermal shock resistance and drop resistance.