Patents by Inventor Kyung Ja LIM

Kyung Ja LIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate separation device and substrate separation system
    Patent number: 9553009
    Abstract: There is provided a substrate separation device and method for separating a growth substrate from a laminate structure which includes a support substrate, a semiconductor layer, and the growth substrate. The device includes: a first base which is configured to hold the laminate structure thereon, and includes a first holding unit configured to hold the support substrate defining a bottom surface of the laminate structure and a heating unit configured to heat the laminate structure; and a second base including a second holding unit disposed above the first holding unit and configured to hold the growth substrate defining an upper surface of the laminate structure.
    Type: Grant
    Filed: October 24, 2014
    Date of Patent: January 24, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae In Sim, Gyeong Seon Park, Kyung Ja Lim, Seung Woo Choi, O Hak Kwon
  • SUBSTRATE SEPARATION DEVICE AND SUBSTRATE SEPARATION SYSTEM
    Publication number: 20150279707
    Abstract: There is provided a substrate separation device and method for separating a growth substrate from a laminate structure which includes a support substrate, a semiconductor layer, and the growth substrate. The device includes: a first base which is configured to hold the laminate structure thereon, and includes a first holding unit configured to hold the support substrate defining a bottom surface of the laminate structure and a heating unit configured to heat the laminate structure; and a second base including a second holding unit disposed above the first holding unit and configured to hold the growth substrate defining an upper surface of the laminate structure.
    Type: Application
    Filed: October 24, 2014
    Publication date: October 1, 2015
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae In SIM, Gyeong Seon PARK, Kyung Ja LIM, Seung Woo CHOI, O Hak KWON