Abstract: Disclosed is a method for generating a prediction result by using static data and dynamic data according to an exemplary embodiment of the present disclosure. Specifically, according to the present disclosure, a computing device generates an integrated feature vector from static data and dynamic data of input data by using an artificial neural network model. The computing device generates a dynamic feature vector from the dynamic data of the input data by using the artificial neural network model. The computing device generates a final prediction result of the artificial neural network model based on the integrated feature vector and the dynamic feature vector.

Abstract: An electronic device according to various embodiments may include: a first frame at least partially exposed to an outside of the electronic device and comprising a metal material, a flexible printed circuit board at least a portion of which is disposed adjacent to the first frame, a first connector electrically connecting the flexible printed circuit board and a main board of the electronic device, a bendable second connector electrically connecting the flexible printed circuit board and the first frame, a bolt including a bolt body extending through a groove formed in the second connector to be bolt-coupled to a bolt groove formed in the first frame and a bolt head formed integrally with the bolt body and disposed in a first direction with respect to the first frame, a plate disposed adjacent to the bolt head of the bolt and coupled to the first frame in the first direction to allow the bolt body of the bolt to be maintained in a state of being coupled to the bolt groove formed in the first frame, and an int

Abstract: An integrated silicone for protecting electronic devices includes a base resin, a thermal initiator, and a photoinitiator.

Abstract: A battery pack includes a plurality of battery cells; a case accommodating the battery cells; a protective circuit module comprising a circuit board adjacent to the battery cells; a temperature sensitive element on the protective circuit module; and a flexible printed circuit board comprising a conductive pattern layer, wherein the conductive pattern layer is thermally connected to the temperature sensitive element.

Abstract: A secondary battery includes a bare cell and a protective circuit module. The protective circuit module includes a protective circuit board, a first terminal, and a second terminal. The first and second terminals are electrically connected to positive and negative electrode tabs of the bare cell. The positive electrode tab and the negative electrode tab are respectively soldered to the first terminal and the second terminal, solder layers are on respective surfaces of the positive electrode tab soldered to the first terminal, and a solder layer is on one or more of the second terminal or the negative electrode tab.

Abstract: An integrated silicone for protecting electronic devices includes a base resin, a thermal initiator, and a photoinitiator.

Abstract: A battery pack includes a plurality of battery cells; a case accommodating the battery cells; a protective circuit module comprising a circuit board adjacent to the battery cells; a temperature sensitive element on the protective circuit module; and a flexible printed circuit board comprising a conductive pattern layer, wherein the conductive pattern layer is thermally connected to the temperature sensitive element.

Abstract: A connecting structure between circuit boards and a battery pack having the same. A hot bar does not make a direct contact with a circuit pattern of a flexible printed circuit board while soldering the flexible printed circuit board to a rigid printed circuit board, thereby preventing the damage to the circuit pattern and preventing electric short between a plurality of the circuit patterns due to the solder. During a soldering process, a base insulating layer having glass transition temperature (Tg) higher than a reflow temperature of the solder is arranged between the circuit pattern and the hot bar, the base insulating layer being perforated by a plurality of apertures to allow heat from the hot bar to more efficiently reach the circuit pattern and the solder. In addition, the circuit pattern covers the apertures, so that solder is unable to reach the hot iron.