Patents by Inventor Kyung Jeon Pakr

Kyung Jeon Pakr has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160113124
    Abstract: A method for forming a printed circuit board (PCB) includes: depositing, a first time, a photo imageable solder resist (PSR) ink over a top surface and a bottom surface of the PCB including a conductive pattern; drying, a first time, the PCB on which the PSR ink has been deposited for the first time; depositing, a second time, the PSR ink over the top surface and the bottom surface of the PCB; and drying, a second time, the PCB on which the PSR ink has been deposited for the second time.
    Type: Application
    Filed: April 24, 2015
    Publication date: April 21, 2016
    Inventors: Hyung Keun Ko, Mun Jong Kim, Yang Yoon Choi, Kyung Jeon Pakr, Hyun Taek Hwang