Patents by Inventor Kyung-Jip Min

Kyung-Jip Min has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microcellular foam of thermoplastic resin prepared with die having improved cooling property and method for preparing the same
    Patent number: 8398904
    Abstract: The present invention relates to a microcellular foam of a thermoplastic resin and a method for preparing the same, and more particularly to a microcellular foam comprising a skin layer having a porosity of below 5% and a core layer having a porosity of at least 5%, wherein the thickness of the skin layer accounts for 5 to 50% of the entire foam, and a method for preparing the same. The microcellular foam of the present invention is advantageous in that it has a thicker skin layer and smaller and uniform micropores in the core layer, compared with conventional microcellular foams, while having mechanical properties comparable to those of conventional non-foamed sheets.
    Type: Grant
    Filed: August 5, 2010
    Date of Patent: March 19, 2013
    Assignee: LG Chem, Ltd.
    Inventors: Kyung-Gu Nam, Ki-Deog Choi, Jong-Sung Park, Seon-Mo Son, Bong-Keun Lee, Kyung-Jip Min
  • MICROCELLULAR FOAM OF THERMOPLASTIC RESIN PREPARED WITH DIE HAVING IMPROVED COOLING PROPERTY AND METHOD FOR PREPARING THE SAME
    Publication number: 20100311853
    Abstract: The present invention relates to a microcellular foam of a thermoplastic resin and a method for preparing the same, and more particularly to a microcellular foam comprising a skin layer having a porosity of below 5% and a core layer having a porosity of at least 5%, wherein the thickness of the skin layer accounts for 5 to 50% of the entire foam, and a method for preparing the same. The microcellular foam of the present invention is advantageous in that it has a thicker skin layer and smaller and uniform micropores in the core layer, compared with conventional microcellular foams, while having mechanical properties comparable to those of conventional non-foamed sheets.
    Type: Application
    Filed: August 5, 2010
    Publication date: December 9, 2010
    Applicant: LG CHEM, LTD.
    Inventors: Kyung-Gu NAM, Ki-Deog CHOI, Jong-Sung PARK, Seon-Mo SON, Bong-Keun LEE, Kyung-Jip MIN
  • Microcellular foam of thermoplastic resin prepared with die having improved cooling property and method for preparing the same
    Publication number: 20070123598
    Abstract: The present invention relates to a microcellular foam of a thermoplastic resin and a method for preparing the same, and more particularly to a microcellular foam comprising a skin layer having a porosity of below 5% and a core layer having a porosity of at least 5%, wherein the thickness of the skin layer accounts for 5 to 50% of the entire foam, and a method for preparing the same. The microcellular foam of the present invention is advantageous in that it has a thicker skin layer and smaller and uniform micropores in the core layer, compared with conventional microcellular foams, while having mechanical properties comparable to those of conventional non-foamed sheets.
    Type: Application
    Filed: May 30, 2006
    Publication date: May 31, 2007
    Inventors: Kyung-Gu Nam, Ki-Deog Choi, Jong-Sung Park, Seon-Mo Son, Bong-Keun Lee, Kyung-Jip Min