Abstract: A tool strip mark generator capable of measuring applied force includes: a bottom surface on which at least a portion of a target surface made of a material capable of generating a tool strip mark, which is a tool-scraped stripe, is formed; a rotating member configured to be rotatable in a state of being spaced apart from the bottom surface; a moving member movable on the bottom surface by laterally coupling the rotating member to a coupling portion; a force sensor attached to one side of an outer peripheral surface of the rotating member and sensing force which is applied when a tool strip mark is generated on the target surface by inserting the tool; a measurer configured to measure an output signal of the force sensor and calculate information about the applied force; and a display configured to display information about the applied force calculated by the measurer.

Abstract: A temperature and humidity chamber type apparatus for taking potential impact marks according to an embodiment includes: a specimen treated with an amino acid reaction reagent to react with potential impact marks to take the potential impact marks; a chamber in which a receiving space for receiving the specimen is secured; a door for opening and closing the chamber; a supporter formed in the receiving space to receive the specimen; an adjuster for adjusting temperature and humidity in the chamber within a set application time range to take the potential impact marks; a display unit attached to one side of the outside of the chamber to display an operation state in the chamber; a power source; a controller for controlling setting of temperature, humidity, and an application time in the chamber; and an input unit in which the controller operates according to a user's input.

Abstract: According to an embodiment, a method of determining tool mark identity using machine learning may include: obtaining surface height data of at least two tool strip marks by photographing tool strip marks generated using at least two tools with a three-dimensional (3D) microscope; generating a data set by calculating a cross-correlation coefficient for the surface height data of the tool strip marks; separating the data set into a training set for machine learning training and a test set for verifying a machine learning result; performing the machine learning training to determine whether the tool strip marks are identical using the training set; and verifying a result of the machine learning training using the test set.

Abstract: Disclosed is a composition containing a licorice extract comprising glycyrrhizin and liquiritin at a content ratio of 1.5 to 1.8:1, obtained by performing extraction on licorice, adding an excipient and performing spray drying. The composition containing the licorice extract can be efficiently used as a pharmaceutical composition for the prevention or treatment of liver disease or a food composition for the improvement of liver function in the pharmaceutical and food industry fields.

Abstract: The present application relates to a cured product and the use thereof. When the cured product, for example, is applied to a semiconductor device such as an LED or the like, the decrease in brightness may be minimized even upon the long-term use of the device, and since the cured product has excellent cracking resistance, the device having high long-term reliability may be provided. The cured product has excellent processability, workability, and adhesive properties or the like, and does not cause whitening and surface stickiness, etc. Further, the cured product exhibits excellent heat resistance at high temperature, gas barrier properties, etc. The cured product may be, for example, applied as an encapsulant or an adhesive material of a semiconductor device.

Abstract: The present application relates to a cured product and the use thereof. When the cured product, for example, is applied to a semiconductor device such as an LED or the like, the decrease in brightness may be minimized even upon the long-term use of the device, and since the cured product has excellent cracking resistance, the device having high long-term reliability may be provided. The cured product has excellent processability, workability, and adhesive properties or the like, and does not cause whitening and surface stickiness, etc. Further, the cured product exhibits excellent heat resistance at high temperature, gas barrier properties, etc. The cured product may be, for example, applied as an encapsulant or an adhesive material of a semiconductor device.

Abstract: The present application relates to a cured product and the use thereof. When the cured product, for example, is applied to a semiconductor device such as an LED or the like, the decrease in brightness may be minimized even upon the long-term use of the device, and since the cured product has excellent cracking resistance, the device having high long-term reliability may be provided. The cured product has excellent processability, workability, and adhesive properties or the like, and does not cause whitening and surface stickiness, etc. Further, the cured product exhibits excellent heat resistance at high temperature, gas barrier properties, etc. The cured product may be, for example, applied as an encapsulant or an adhesive material of a semiconductor device.

Abstract: The present application relates to a cured product and the use thereof. The cured product has excellent processability, workability, and adhesive properties or the like, and does not cause whitening and surface stickiness, etc. The cured product has excellent transparency, moisture resistance, mechanical properties, and cracking resistance, etc. The cured product, for example, may be applied as an encapsulant or an adhesive material of a semiconductor device to provide a device having high long-term reliability.

Abstract: Provided are a curable composition and its use. The curable composition may provide a cured product having excellent processability and workability, no surface stickiness, and an excellent adhesive property. The curable composition has excellent thermal resistance, crack resistance, and gas permeability. The curable composition may have stable performance when being applied to a semiconductor device at a high temperature for a long time.

Abstract: Disclosed are a piezoelectric element and a piezoelectric vibrator having the same. The piezoelectric element and the piezoelectric vibrator having the same in accordance with an embodiment of the present invention include: a piezoelectric material formed by laminating a plurality of ceramic layers with one another; internal electrodes formed, respectively, on surfaces of the ceramic layers; and a pair of cover layers formed, respectively, above and below the piezoelectric material in order to protect the internal electrodes, and at least one of the cover layers includes: a plurality of crystal grains; and crack inhibiting particles disposed at boundaries between the plurality of crystal grains and configured to inhibit a crack from spreading in the cover layers.

Abstract: The present application relates to a cured product and the use thereof. When the cured product, for example, is applied to a semiconductor device such as an LED or the like, the decrease in brightness may be minimized even upon the long-term use of the device, and since the cured product has excellent cracking resistance, the device having high long-term reliability may be provided. The cured product has excellent processability, workability, and adhesive properties or the like, and does not cause whitening and surface stickiness, etc. Further, the cured product exhibits excellent heat resistance at high temperature, gas barrier properties, etc. The cured product may be, for example, applied as an encapsulant or an adhesive material of a semiconductor device.

Abstract: The present application relates to a cured product and the use thereof. The cured product has excellent processability, workability, and adhesive properties or the like, and does not cause whitening and surface stickiness, etc. The cured product has excellent transparency, moisture resistance, mechanical properties, and cracking resistance, etc. The cured product, for example, may be applied as an encapsulant or an adhesive material of a semiconductor device to provide a device having high long-term reliability.

Abstract: The present application relates to a cured product and the use thereof. When the cured product, for example, is applied to a semiconductor device such as an LED or the like, the decrease in brightness may be minimized even upon the long-term use of the device, and since the cured product has excellent cracking resistance, the device having high long-term reliability may be provided. The cured product has excellent processability, workability, and adhesive properties or the like, and does not cause whitening and surface stickiness, etc. Further, the cured product exhibits excellent heat resistance at high temperature, gas barrier properties, etc. The cured product may be, for example, applied as an encapsulant or an adhesive material of a semiconductor device.

Abstract: Provided are a curable composition and its use. The curable composition may provide a cured product having excellent processability and workability, no surface stickiness, and an excellent adhesive property. The curable composition has excellent thermal resistance, crack resistance, and gas permeability. The curable composition may have stable performance when being applied to a semiconductor device at a high temperature for a long time.

Abstract: The present application relates to a cured product and the use thereof. When the cured product, for example, is applied to a semiconductor device such as an LED or the like, the decrease in brightness may be minimized even upon the long-term use of the device, and since the cured product has excellent cracking resistance, the device having high long-term reliability may be provided. The cured product has excellent processability, workability, and adhesive properties or the like, and does not cause whitening and surface stickiness, etc. Further, the cured product exhibits excellent heat resistance at high temperature, gas barrier properties, etc. The cured product may be, for example, applied as an encapsulant or an adhesive material of a semiconductor device.

Abstract: Provided are a curable composition and its use. The curable composition may provide a cured product having excellent processability, workability, and adhesive property, and having no whitening and surface stickiness. The curable composition has excellent thermal resistance at a high temperature, gas barrierability, and crack resistance, and thus, when applied to a semiconductor device, may stably maintain performance of the device at a high temperature for a long time.

Abstract: Provided are a curable composition and its use. The curable composition may provide a cured product having excellent processability and workability, no whitening and surface stickiness, and an excellent adhesive property. Since the curable composition has excellent thermal resistance, gas barrier-ability, and crack resistance, even when a semiconductor device to which the composition is applied is used at a high temperature for a long time, performance of the device may be stably maintained. Specifically the curable composition is a blend of three different polyorganosiloxanes having aliphatic unsaturated groups and specific Ar/Si ratios and a polyorganosiloxane having SiH groups.

Abstract: Disclosed are a piezoelectric element and a piezoelectric vibrator having the same. The piezoelectric element and the piezoelectric vibrator having the same in accordance with an embodiment of the present invention include: a piezoelectric material formed by laminating a plurality of ceramic layers with one another; internal electrodes formed, respectively, on surfaces of the ceramic layers; and a pair of cover layers formed, respectively, above and below the piezoelectric material in order to protect the internal electrodes, and at least one of the cover layers includes: a plurality of crystal grains; and crack inhibiting particles disposed at boundaries between the plurality of crystal grains and configured to inhibit a crack from spreading in the cover layers.

Abstract: A piezoelectric oscillation substrate is disclosed. The piezoelectric oscillation substrate in accordance with an aspect of the present invention includes: a substrate body having a receiving groove formed on one surface thereof; an adhesive layer formed by being coated on a surface of the receiving groove; and a piezoelectric body being received in the receiving groove and adhered to the substrate body by the adhesive layer so as to generate vibrations in the substrate body.

Abstract: Provided are a curable composition and its use. The curable composition may provide a cured product having excellent processability, workability, and adhesive property, and having no whitening and surface stickiness. The curable composition has excellent thermal resistance and crack resistance, and low gas permeability, and thus provides a device having excellent initial performance when being applied to a semiconductor device and maintaining stable performance when being used at a high temperature for a long time.