Patents by Inventor Kyung Mi SON

Kyung Mi SON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package including semiconductor chip and capacitor
    Patent number: 11450627
    Abstract: A semiconductor package may include a semiconductor chip mounted on a package substrate, and capacitors. The capacitors may be disposed between the package substrate and the first semiconductor chip, and the capacitors may support the first semiconductor chip.
    Type: Grant
    Filed: September 24, 2020
    Date of Patent: September 20, 2022
    Assignee: SK hynix Inc.
    Inventors: Dae Hyeok Ha, Kyung Mi Son
  • SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIP AND CAPACITOR
    Publication number: 20210327831
    Abstract: A semiconductor package may include a semiconductor chip mounted on a package substrate, and capacitors. The capacitors may be disposed between the package substrate and the first semiconductor chip, and the capacitors may support the first semiconductor chip.
    Type: Application
    Filed: September 24, 2020
    Publication date: October 21, 2021
    Applicant: SK hynix Inc.
    Inventors: Dae Hyeok HA, Kyung Mi SON