Patents by Inventor Kyung Min SON

Kyung Min SON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic component having lead part including regions having different thicknesses and method of manufacturing the same
    Patent number: 10546681
    Abstract: An electronic component includes a magnetic body; and a coil pattern embedded in the magnetic body, the coil pattern including an internal coil part having a spiral shape and a lead part connected to an end of the internal coil part and exposed to an external surface of the magnetic body. The lead part includes at least two regions having different thicknesses, and the thickness of at least a portion of the lead part having a relatively thin thickness is thinner than a thickness of the internal coil part.
    Type: Grant
    Filed: May 15, 2019
    Date of Patent: January 28, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dong Jin Jeong, Kyung Seop Lee, Yong Un Choi, Kyung Min Son
  • ELECTRONIC COMPONENT HAVING LEAD PART INCLUDING REGIONS HAVING DIFFERENT THICKNESSES AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20190267178
    Abstract: An electronic component includes a magnetic body; and a coil pattern embedded in the magnetic body, the coil pattern including an internal coil part having a spiral shape and a lead part connected to an end of the internal coil part and exposed to an external surface of the magnetic body. The lead part includes at least two regions having different thicknesses, and the thickness of at least a portion of the lead part having a relatively thin thickness is thinner than a thickness of the internal coil part.
    Type: Application
    Filed: May 15, 2019
    Publication date: August 29, 2019
    Inventors: Dong Jin JEONG, Kyung Seop LEE, Yong Un CHOI, Kyung Min SON
  • Electronic component having lead part including regions having different thicknesses and method of manufacturing the same
    Patent number: 10332667
    Abstract: An electronic component includes a magnetic body; and a coil pattern embedded in the magnetic body, the coil pattern including an internal coil part having a spiral shape and a lead part connected to an end of the internal coil part and exposed to an external surface of the magnetic body. The lead part includes at least two regions having different thicknesses, and the thickness of at least a portion of the lead part having a relatively thin thickness is thinner than a thickness of the internal coil part.
    Type: Grant
    Filed: November 9, 2015
    Date of Patent: June 25, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dong Jin Jeong, Kyung Seop Lee, Yong Un Choi, Kyung Min Son
  • ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20160172103
    Abstract: An electronic component includes a magnetic body; and a coil pattern embedded in the magnetic body, the coil pattern including an internal coil part having a spiral shape and a lead part connected to an end of the internal coil part and exposed to an external surface of the magnetic body. The lead part includes at least two regions having different thicknesses, and the thickness of at least a portion of the lead part having a relatively thin thickness is thinner than a thickness of the internal coil part.
    Type: Application
    Filed: November 9, 2015
    Publication date: June 16, 2016
    Inventors: Dong Jin JEONG, Kyung Seop LEE, Yong Un CHOI, Kyung Min SON