Abstract: A pneumatic tire with a reinforcement material includes: a tread that comes in contact with a road surface; side walls that extend and form shoulders and inner liners at both sides of the tread; a carcass that is integrally attached to the tread and the inner sides of the side walls and forms a turn-up head at both ends of the side walls; a belt layer that is layered on the tread of the carcass; and a bead that includes a bead core inserted in a wheel inside the turn-up head, a bead filler inserted in a side of the tread of the bead core, and a reinforcement material inserted in an interface of the turn-up head.

Abstract: A pneumatic tire with a reinforcement material includes: a tread that comes in contact with a road surface; side walls that extend and form shoulders and inner liners at both sides of the tread; a carcass that is integrally attached to the tread and the inner sides of the side walls and forms a turn-up head at both ends of the side walls; a belt layer that is layered on the tread of the carcass; and a bead that includes a bead core inserted in a wheel inside the turn-up head, a bead filler inserted in a side of the tread of the bead core, and a reinforcement material inserted in an interface of the turn-up head.

Abstract: Disclosed herein is an optical semiconductor based illuminating apparatus including light emitting modules including at least one semiconductor optical device; and a housing enclosing one side surface of at least one of the light emitting modules. This optical semiconductor based illuminating apparatus may promote convenience for checking and repairing, simply perform separation and fastening, have excellent waterproofing characteristics and durability, prevent accidents such as short circuit and electric shock improve heat radiation performance, prevent introduction of foreign materials, be easily cleaned and maintained, reliably provide power of a main power line to a plurality of light emitting modules, and utilize a space and secure reliability of a product regardless of a size and a shape of a power supply embedded therein.

Abstract: An optical semiconductor lighting apparatus includes a heat sink including a heat dissipation base and a plurality of heat dissipation fins formed on a lower surface of the heat dissipation base; an optical semiconductor device placed on the heat dissipation base; and an optical cover coupled to an upper side of the heat sink to cover the optical semiconductor device. The heat dissipation base is formed with an air flow hole through which upper ends of the heat dissipation fins are exposed.

Abstract: An optical semiconductor lighting apparatus includes a heat sink including a heat dissipation base and a plurality of heat dissipation fins formed on a lower surface of the heat dissipation base; an optical semiconductor device placed on the heat dissipation base; and an optical cover coupled to an upper side of the heat sink to cover the optical semiconductor device. The heat dissipation base is formed with an air flow hole through which upper ends of the heat dissipation fins are exposed.

Abstract: Disclosed herein is an optical semiconductor based illuminating apparatus including light emitting modules including at least one semiconductor optical device; and a housing enclosing one side surface of at least one of the light emitting modules. This optical semiconductor based illuminating apparatus may promote convenience for checking and repairing, simply perform separation and fastening, have excellent waterproofing characteristics and durability, prevent accidents such as short circuit and electric shock improve heat radiation performance, prevent introduction of foreign materials, be easily cleaned and maintained, reliably provide power of a main power line to a plurality of light emitting modules, and utilize a space and secure reliability of a product regardless of a size and a shape of a power supply embedded therein.

Abstract: An optical semiconductor lighting apparatus includes a heat sink including a heat dissipation base and a plurality of heat dissipation fins formed on a lower surface of the heat dissipation base; an optical semiconductor device placed on the heat dissipation base; and an optical cover coupled to an upper side of the heat sink to cover the optical semiconductor device. The heat dissipation base is formed with an air flow hole through which upper ends of the heat dissipation fins are exposed.