Patents by Inventor KYUNG MOK YOON

KYUNG MOK YOON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11758251
    Abstract: An embodiment of the present invention relates to a camera module comprising: a housing comprising a through hole; a lens module disposed in the through hole; a connector penetrating the housing and extending to an outside from an inside of the housing; a first substrate unit located inside the housing and having an image sensor mounted thereon; a second substrate unit disposed inside the housing and connected to the connector; and a flexible substrate for electrically connecting the first substrate and the second substrate unit, wherein the flexible substrate is coupled to a lower surface of the first substrate unit and a side surface of the second substrate.
    Type: Grant
    Filed: June 3, 2022
    Date of Patent: September 12, 2023
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Jae Wook Ahn, Sun Min Hwang, Je Kyung Park, Kyung Mok Yoon, Chul Ho Lee, Jong Chul Choi
  • Publication number: 20220311913
    Abstract: An embodiment of the present invention relates to a camera module comprising: a housing comprising a through hole; a lens module disposed in the through hole; a connector penetrating the housing and extending to an outside from an inside of the housing; a first substrate unit located inside the housing and having an image sensor mounted thereon; a second substrate unit disposed inside the housing and connected to the connector; and a flexible substrate for electrically connecting the first substrate and the second substrate unit, wherein the flexible substrate is coupled to a lower surface of the first substrate unit and a side surface of the second substrate.
    Type: Application
    Filed: June 3, 2022
    Publication date: September 29, 2022
    Inventors: Jae Wook AHN, Sun Min HWANG, Je Kyung PARK, Kyung Mok YOON, Chul Ho LEE, Jong Chul CHOI
  • Patent number: 11381718
    Abstract: An embodiment of the present invention relates to a camera module comprising: a housing comprising a through hole; a lens module disposed in the through hole; a connector penetrating the housing and extending to an outside from an inside of the housing; a first substrate unit located inside the housing and having an image sensor mounted thereon; a second substrate unit disposed inside the housing and connected to the connector; and a flexible substrate for electrically connecting the first substrate and the second substrate unit, wherein the flexible substrate is coupled to a lower surface of the first substrate unit and a side surface of the second substrate.
    Type: Grant
    Filed: March 16, 2021
    Date of Patent: July 5, 2022
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Jae Wook Ahn, Sun Min Hwang, Je Kyung Park, Kyung Mok Yoon, Chul Ho Lee, Jong Chul Choi
  • Publication number: 20210211562
    Abstract: An embodiment of the present invention relates to a camera module comprising: a housing comprising a through hole; a lens module disposed in the through hole; a connector penetrating the housing and extending to an outside from an inside of the housing; a first substrate unit located inside the housing and having an image sensor mounted thereon; a second substrate unit disposed inside the housing and connected to the connector; and a flexible substrate for electrically connecting the first substrate and the second substrate unit, wherein the flexible substrate is coupled to a lower surface of the first substrate unit and a side surface of the second substrate.
    Type: Application
    Filed: March 16, 2021
    Publication date: July 8, 2021
    Inventors: Jae Wook AHN, Sun Min HWANG, Je Kyung PARK, Kyung Mok YOON, Chul Ho LEE, Jong Chul CHOI
  • Patent number: 10979606
    Abstract: An embodiment of the present invention relates to a camera module comprising: a housing comprising a through hole; a lens module disposed in the through hole; a connector penetrating the housing and extending to an outside from an inside of the housing; a first substrate unit located inside the housing and having an image sensor mounted thereon; a second substrate unit disposed inside the housing and connected to the connector; and a flexible substrate for electrically connecting the first substrate and the second substrate unit, wherein the flexible substrate is coupled to a lower surface of the first substrate unit and a side surface of the second substrate.
    Type: Grant
    Filed: August 28, 2019
    Date of Patent: April 13, 2021
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Jae Wook Ahn, Sun Min Hwang, Je Kyung Park, Kyung Mok Yoon, Chul Ho Lee, Jong Chul Choi
  • Publication number: 20190387136
    Abstract: An embodiment of the present invention relates to a camera module comprising: a housing comprising a through hole; a lens module disposed in the through hole; a connector penetrating the housing and extending to an outside from an inside of the housing; a first substrate unit located inside the housing and having an image sensor mounted thereon; a second substrate unit disposed inside the housing and connected to the connector; and a flexible substrate for electrically connecting the first substrate and the second substrate unit, wherein the flexible substrate is coupled to a lower surface of the first substrate unit and a side surface of the second substrate.
    Type: Application
    Filed: August 28, 2019
    Publication date: December 19, 2019
    Inventors: Jae Wook AHN, Sun Min HWANG, Je Kyung PARK, Kyung Mok YOON, Chul Ho LEE, Jong Chul CHOI
  • Patent number: 10440242
    Abstract: An embodiment of the present invention relates to a camera module comprising: a housing comprising a through hole; a lens module disposed in the through hole; a connector penetrating the housing and extending to an outside from an inside of the housing; a first substrate unit located inside the housing and having an image sensor mounted thereon; a second substrate unit disposed inside the housing and connected to the connector; and a flexible substrate for electrically connecting the first substrate and the second substrate unit, wherein the flexible substrate is coupled to a lower surface of the first substrate unit and a side surface of the second substrate.
    Type: Grant
    Filed: August 30, 2016
    Date of Patent: October 8, 2019
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Jae Wook Ahn, Sun Min Hwang, Je Kyung Park, Kyung Mok Yoon, Chul Ho Lee, Jong Chul Choi
  • Publication number: 20180255213
    Abstract: An embodiment of the present invention relates to a camera module comprising: a housing comprising a through hole; a lens module disposed in the through hole; a connector penetrating the housing and extending to an outside from an inside of the housing; a first substrate unit located inside the housing and having an image sensor mounted thereon; a second substrate unit disposed inside the housing and connected to the connector; and a flexible substrate for electrically connecting the first substrate and the second substrate unit, wherein the flexible substrate is coupled to a lower surface of the first substrate unit and a side surface of the second substrate.
    Type: Application
    Filed: August 30, 2016
    Publication date: September 6, 2018
    Inventors: JAE WOOK AHN, SUN MIN HWANG, JE KYUNG PARK, KYUNG MOK YOON, CHUL HO LEE, JONG CHUL CHOI