Abstract: A method of controlling an EOP of a powertrain may include determining, by a controller electrically connected to the EOP, whether an oil sloshing phenomenon in which it is difficult for oil to return to a space where an oil intake port of the EOP is positioned may occur while a vehicle is running; and reducing, by the controller, the revolutions per minute (RPM) of the EOP by a predetermined reduced RPM when it is determined that the oil sloshing phenomenon may occur.

Abstract: The method of bonding an interposer and an integrated circuit chip includes preparing an interposer including an insulator and conductive lines each having one end exposed to a first surface of the insulator and another end exposed to a second surface opposite to the first surface; placing a bonding mask on the interposer; forming through-holes on the bonding mask before or after the placing of the bonding mask on the interposer; filling the plurality with a conductive material; and bonding an integrated circuit chip to the bonding mask.

Abstract: An interposer includes: a circuit board stack in which circuit boards are stacked; and an outer board arranged on at least one of outer side surfaces of the circuit board stack. The circuit boards are arranged include first conductive lines having first ends exposed through a first side portion of the circuit boards and second ends exposed through a second side portion opposite the first side portion of the circuit boards. The outer board includes second conductive lines having first ends exposed through a different side from the first side portion of the circuit boards and second ends exposed through a side portion located on a same side as the second side portion of the circuit boards.

Abstract: An RF coil has an improved structure to prevent an excessive heat from being transferred to an object, and a magnetic resonance imaging apparatus includes the same. The MRI apparatus includes an RF coil configured to receive an RF signal, wherein the RF coil may include a first cover configured to allow thermal insulation material to be injected into the inside thereof, a second cover configured to allow thermal insulation material to be injected into the inside thereof and detachably coupled to the first cover to form an inner space with the first cover, and at least one circuit board disposed in the inner space and on which a circuit element configured to receive the RF signal is mounted.

Abstract: An interposer includes: a circuit board stack in which circuit boards are stacked; and an outer board arranged on at least one of outer side surfaces of the circuit board stack. The circuit boards are arranged include first conductive lines having first ends exposed through a first side portion of the circuit boards and second ends exposed through a second side portion opposite the first side portion of the circuit boards. The outer board includes second conductive lines having first ends exposed through a different side from the first side portion of the circuit boards and second ends exposed through a side portion located on a same side as the second side portion of the circuit boards.

Abstract: The method of bonding an interposer and an integrated circuit chip includes preparing an interposer including an insulator and conductive lines each having one end exposed to a first surface of the insulator and another end exposed to a second surface opposite to the first surface; placing a bonding mask on the interposer; forming through-holes on the bonding mask before or after the placing of the bonding mask on the interposer; filling the plurality with a conductive material; and bonding an integrated circuit chip to the bonding mask.

Abstract: Provided is a probe for an ultrasonic diagnostic apparatus, including a transducer module for transmitting or receiving ultrasound waves. The probe includes: a plurality of ultrasonic elements arranged in a two-dimensional (2D) array; a plurality of first electrical circuit boards located below the plurality of ultrasonic elements, spaced apart from one another by a predetermined distance along columns in one direction of the 2D array, and electrically connected to the plurality of ultrasonic elements; and a support frame including a plurality of slots into which the plurality of electrical circuit boards are inserted for support.

Abstract: An RF coil has an improved structure to prevent an excessive heat from being transferred to an object, and a magnetic resonance imaging apparatus includes the same. The MRI apparatus includes an RF coil configured to receive an RF signal, wherein the RF coil may include a first cover configured to allow thermal insulation material to be injected into the inside thereof, a second cover configured to allow thermal insulation material to be injected into the inside thereof and detachably coupled to the first cover to form an inner space with the first cover, and at least one circuit board disposed in the inner space and on which a circuit element configured to receive the RF signal is mounted.