Abstract: A chip component includes: a ceramic body including a capacitance forming part in which first and second dielectric layers are alternately disposed; and external electrodes disposed on both end surfaces of the ceramic body, wherein the capacitance forming part includes first and second internal electrodes spaced apart from each other on the first dielectric layers and exposed to the end surfaces of the ceramic body to thereby be connected to the external electrodes; and floating electrodes disposed on the second dielectric layers and overlapped with portions of the first and second internal electrodes, the ceramic body includes protective parts disposed between upper and lower surfaces thereof and the capacitance forming part and having third dielectric layers on which first and second dummy electrodes exposed to the end surfaces of the ceramic body are disposed, and the protective parts include third dummy electrodes disposed between the first and second dummy electrodes.

Abstract: There is provided a conductive resin composition including epoxy resin, copper powder particles, and non-nitrogen-based hardeners.

Abstract: Disclosed herein is a multilayer ceramic capacitor including: a ceramic body in which internal electrodes and dielectric layers are alternately stacked; a pair of external electrodes covering both end portions of the ceramic body; and a moisture resistant protective film formed on surfaces of the dielectric layers between the pair of external electrodes and having a hydrophobic functional group.

Abstract: The present invention relates to a multi-layer ceramic capacitor which includes a ceramic body on which an inner electrode and a dielectric layer are alternately stacked, a crack prevent layer formed on both sides of the ceramic body and an external electrode covering both ends of the ceramic body on which the crack prevention layer is formed.

Abstract: There is provided a conductive resin composition including epoxy resin, copper powder particles, and non-nitrogen-based hardeners.

Abstract: There is provided a multilayer ceramic electronic component, including a ceramic body including dielectric layers; a plurality of internal electrodes stacked within the ceramic body, and external electrodes formed on external surfaces of the ceramic body and electrically connected to the internal electrodes, wherein the external electrodes include a metal layer and a conductive resin layer formed on the metal layer, the conducive resin layer containing a copper powder and an epoxy resin, the copper powder including a first copper powder having a content of 10 wt % or more and a particle diameter of 2 ?m or greater and a second copper powder having a content of 5 wt % or more and a particle diameter of 0.7 ?m or smaller, the first copper powder being a mixture of spherical powder particles and flake type powder particles.

Abstract: There is provided a multilayer ceramic capacitor including a ceramic body including dielectric layers, first and second internal electrodes formed within the ceramic body and disposed to face each other, having the dielectric layer interposed therebetween, first and second electrode layers disposed on outer surfaces of the ceramic body and electrically connected to the first and second internal electrodes, respectively, a conductive resin layer disposed on the first and second electrode layers and containing copper powder, a nickel plating layer disposed on an outer portion of the conductive resin layer, and a copper-nickel alloy layer disposed between the conductive resin layer and the nickel plating layer and having a thickness of 1 to 10 nm.

Abstract: A multilayer ceramic electronic component may include a ceramic body including dielectric layers and internal electrodes, electrode layers connected to the internal electrodes, and a conductive resin layer formed on the electrode layers and including a first conductor, a second conductor containing carbon nanotubes, and a base resin. When the multilayer ceramic electronic component is heat-tested by raising a temperature of the multilayer ceramic electronic component from room temperature to about 900° C. at a rate of about 10° C./min, a weight of the multilayer ceramic electronic component decreases by about 0.33% to about 2.19%.

Abstract: There is provided a multilayer ceramic capacitor including a ceramic body including dielectric layers and internal electrodes, electrode layers connected to the internal electrodes, and a conductive resin layer formed on the electrode layer and containing conductive particles, fullerenes, and a base resin.

Abstract: There is provided a conductive resin composition including 10 to 50 wt % of a gel type silicon rubber such as polydimethylsiloxane (PDMS), and 50 to 90 wt % of conductive metal powder particles.

Abstract: A multilayer ceramic capacitor may include: a ceramic body including dielectric layers; first and second internal electrodes disposed in the ceramic body; and first and second external electrodes formed to end surfaces of the ceramic body. The ceramic body may includes an active layer, a capacitance formation portion, and a cover layer, a non-capacitance formation portion, the cover layer includes a plurality of dummy electrode layers. When the number of the first and second internal electrodes is defined as AL, a thickness of each of the first and second internal electrodes is defined as AT, a thickness of each of the dummy electrode layers is defined as DT, and the number of the dummy electrode layers is defined as DL, DL is equal to {(T×x)?(AL×AT)}/DT, x being 9.0% or more.

Abstract: There is provided a multilayer ceramic capacitor including a ceramic body including a plurality of dielectric layers, a plurality of first and second internal electrodes disposed in the ceramic body to be alternately exposed to first and second end surfaces of the ceramic body, having the dielectric layer therebetween, first and second electrode layers electrically connected to the first and second internal electrodes, respectively, a conductive resin layer formed on the first and second electrode layers and in regions of the ceramic body adjacent to the first and second electrode layers, and a coating layer formed between a portion of an outer surface of the ceramic body on which the conductive resin layer is to be formed and the conductive resin layer.

Abstract: There is provided a conductive paste composition for an external electrode, the conductive paste composition including a polymer resin, spherical first conductive metal particles included in the polymer resin and being hollow in at least a portion thereof, and second conductive metal particles of a flake shape included in the polymer resin and being hollow in at least a portion thereof.

Abstract: Disclosed herein is a ZnO-based varistor composition including zinc oxide (ZnO) as a main component and a calcium (Ca)-containing compound as an accessory component. The varistor composition provides excellent electrostatic discharge (ESD) characteristics because it has excellent physical properties, such as a nonlinear coefficient, a clamping voltage ratio, a surge absorbance and the like, and, particularly, does not include Bi2O3. Further, the varistor composition provides high work safety because it does not include Sb2O3 that is regulated for environmental purposes. Further, the varistor composition can reduce the manufacturing cost of a varistor because it does not Pr-based components that require high-temperature sintering and increase the manufacturing cost of a varistor. Particularly, the varistor composition has a low clamping voltage as well as a low capacitance.

Abstract: There is provided a multilayer ceramic electronic component, including a ceramic body including dielectric layers; a plurality of internal electrodes stacked within the ceramic body, and external electrodes formed on external surfaces of the ceramic body and electrically connected to the internal electrodes, wherein the external electrodes include a metal layer and a conductive resin layer formed on the metal layer, the conducive resin layer containing a copper powder and an epoxy resin, the copper powder including a first copper powder having a content of 10 wt % or more and a particle diameter of 2 ?m or greater and a second copper powder having a content of 5 wt % or more and a particle diameter of 0.7 ?m or smaller, the first copper powder being a mixture of spherical powder particles and flake type powder particles.

Abstract: There is provided a multilayer ceramic capacitor including a ceramic body including dielectric layers, first and second internal electrodes formed within the ceramic body and disposed to face each other, having the dielectric layer interposed therebetween, first and second electrode layers disposed on outer surfaces of the ceramic body and electrically connected to the first and second internal electrodes, respectively, a conductive resin layer disposed on the first and second electrode layers and containing copper powder, a nickel plating layer disposed on an outer portion of the conductive resin layer, and a copper-nickel alloy layer disposed between the conductive resin layer and the nickel plating layer and having a thickness of 1 to 10 nm.

Abstract: There is provided a multilayer ceramic capacitor including: a ceramic body in which a plurality of dielectric layers are stacked; a plurality of first and second internal electrodes formed on at least one surfaces of the plurality of dielectric layers and alternately exposed to both end surfaces of the ceramic body; first and second external electrodes formed on both end surfaces of the ceramic body and electrically connected to the respective first and second internal electrodes; and first and second non-conductive epoxy resin layers formed on peripheral surfaces of the first and second external electrodes except for mounting surfaces of the first and second external electrodes.

Abstract: There is provided a conductive resin composition including 10 to 50 wt % of a gel type silicon rubber such as polydimethylsiloxane (PDMS), and 50 to 90 wt % of conductive metal powder particles.

Abstract: There is provided conductive paste composition for an external electrode including: a first metal powder particle having a spherical shape and formed of a fine copper; and a second metal powder particle coated on a surface of the first metal powder particle and having a melting point lower than that of the copper.

Abstract: There are provided a conductive paste for an external electrode including: 100 parts by weight of a conductive metal particle; 5 to 30 parts by weight of a base resin; and 0.5 to 10 parts by weight of a spherical cross-linked polymer.