Abstract: A novel pyrimidine derivative compound and a salt thereof are disclosed. The pyrimidine derivative compound effectively inhibits the growth of C797S mutant EGFR-expressed and MET-amplified cancer cells, which are the main resistance mechanisms of third generation EGFR anticancer agents, and thus may be effectively used in the treatment of lung cancer.

Abstract: A novel pyrimidine derivative compound and a salt thereof are disclosed. The pyrimidine derivative compound effectively inhibits the growth of C797S mutant EGFR-expressed and MET-amplified cancer cells, which are the main resistance mechanisms of third generation EGFR anticancer agents, and thus may be effectively used in the treatment of lung cancer.

Abstract: Disclosed is a composition and method for preventing, ameliorating or treating an EGFR-mutant non-small cell lung cancer including a c-Jun N-terminal kinase (JNK) activator as an active ingredient. The composition significantly reduces the level of EGFR in EGFR-mutant non-small cell lung cancer cells, inducing apoptosis. Therefore, the composition is suitable for preventing, ameliorating or treating non-small cell lung cancers in subjects in need thereof. Particularly, the composition is effective in treating and preventing non-small cell lung cancers, which are difficult to effectively treat and prevent with gefitinib or erlotinib. Also disclosed is a composition and method for inhibiting the resistance of a non-small cell lung cancer to an EGFR tyrosine kinase inhibitor including a c-Jun N-terminal kinase (JNK) activator as an active ingredient. The inhibitory composition effectively overcomes resistance to EGFR tyrosine kinase inhibitors.

Abstract: The invention describes anti-cancer therapies comprising using a 3G-EGFR inhibitor and an anti-IGF antibody, each as described herein.

Abstract: A process for making a plurality of leadless packages is disclosed. Firstly, chips are attached onto a lead frame with a first metal layer formed thereon. Each lead of the lead frame has a first portion, a second portion and a third portion connecting the first portion and the second portion, wherein the first metal layer is not provided on the third portion. After a wire bonding step and an encapsulating step are conducted, a second metal layer is selectively plated on the first portions and the second portions of the leads and the die pads exposed from the bottom of the molded product. Then, the third portion of each lead is selectively etched away such that the first portion and the second portion are electrically isolated from each other. Finally, a singulation step is conducted to complete the process. The present invention further provides a new lead frame design.