Patents by Inventor Kyung-ryul Lee
Kyung-ryul Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11955289Abstract: A multilayer capacitor includes a body including a stack structure in which at least one first internal electrode and at least one second internal electrode are alternately stacked in a first direction with at least one dielectric layer interposed therebetween; and first and second external electrodes spaced apart from each other and disposed on the body to be respectively connected to the at least one first internal electrode and the at least one second internal electrode, wherein each of the first and second external electrodes includes a first conductive layer including a first conductive material and glass; and an oxide layer including an oxide and disposed on at least a portion of an external surface of the first conductive layer.Type: GrantFiled: April 14, 2022Date of Patent: April 9, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Young Soo Yi, Kun Ho Koo, San Kyeong, Hai Joon Lee, Kyung Ryul Lee, Ho Yeol Lee
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Patent number: 11939580Abstract: A self-circularization RNA construct that can be expressed in a DNA vector and simultaneously circularized through a self-targeting and splicing reaction to form a circRNA is disclosed. The circRNA can consist only of a gene of interest which can be a coding, non-coding, or a combination thereof. The gene of interest has the advantage of being able to rapidly express a peptide or protein. The formed circRNA has a circular structure and has a stable and high half-life because 5? and 3? ends are not exposed. Accordingly, functional RNA such as miRNA, anti-miRNA, siRNA, shRNA, aptamer, functional RNA for gene/RNA editing, ADAR (adenosine deaminase acting on the RNA)-recruiting RNA, mRNA vaccine, mRNA therapeutic agent, vaccine adjuvant, and CAR-T mRNA can be produced as a stable circRNA in cells.Type: GrantFiled: October 12, 2022Date of Patent: March 26, 2024Assignee: Rznomics Inc.Inventors: Seong-Wook Lee, Kyung Hyun Lee, Seung Ryul Han, Ji Hyun Kim, Seongcheol Kim
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Patent number: 11894196Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and first and second internal electrodes stacked in a first direction and having first and second surfaces opposing each other in the first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction, and first and second external electrodes disposed on the third and fourth surfaces of the body, respectively, and connected to the first and second internal electrodes, respectively. The first and second external electrodes each include a central portion disposed in a center of each of the third and fourth surfaces and an outer portion disposed outside the central portion. T1>T2>T3, in which T1 and T3 are maximum value and minimum value of a thickness of the central portion, respectively, and T2 is a maximum value of a thickness of the outer portion.Type: GrantFiled: June 6, 2022Date of Patent: February 6, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: San Kyeong, Young Soo Yi, Kun Ho Koo, Soung Jin Kim, Ho Yeol Lee, Kyung Ryul Lee, Chang Hak Choi
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Publication number: 20230343514Abstract: A conductive paste includes: conductive powder containing Cu particles; and a glass frit including an oxide containing alkali metal, wherein a content of the alkali metal is 0.16 wt% or more and 0.35 wt% or less with respect to a total content of the Cu particles.Type: ApplicationFiled: December 1, 2022Publication date: October 26, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kun Ho KOO, San KYEONG, Soung Jin KIM, Young Soo YI, Ho Yeol LEE, Ic Seob KIM, Kyung Ryul LEE, Chang Hak CHOI
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Patent number: 11791097Abstract: A ceramic electronic component includes: a body including dielectric layers and internal electrodes; and external electrodes disposed on the body and connected to the internal electrodes, wherein the dielectric layer includes a plurality of dielectric crystal grains, and at least one of the plurality of dielectric crystal grains has a core-double shell structure, the double shell includes a first shell surrounding at least a portion of the core and a second shell surrounding at least a portion of the first shell, the first shell includes a first element, one or more of Sn, Sb, Ge, Si, Ga, In, or Zr, and the second shell includes a second element, one or more of Ca or Sr.Type: GrantFiled: October 13, 2021Date of Patent: October 17, 2023Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Su Been Kim, Jong Hoon Yoo, Kyung Ryul Lee, Hyung Joon Jeon, Jin Woo Kim, Jong Suk Jeong
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Publication number: 20230207211Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer interposed therebetween in a first direction; and an external electrode disposed on the body and connected to the internal electrode, wherein 0.46 to 1.08 at% is a range of an indium (In) content compared to nickel (Ni) and indium (In) contents in a surface layer portion of the internal electrode.Type: ApplicationFiled: June 15, 2022Publication date: June 29, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Yu Hong Oh, Jun Oh Kim, Byung Kun Kim, Min Jung Cho, Won Mi Choi, Su Yeon Lee, Kyung Ryul Lee, Yun Sung Kang
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Publication number: 20230187137Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and first and second internal electrodes stacked in a first direction and having first and second surfaces opposing each other in the first direction, third and fourth surfaces opposing each other in a second direction, and fifth and sixth surfaces opposing each other in a third direction, and first and second external electrodes disposed on the third and fourth surfaces of the body, respectively, and connected to the first and second internal electrodes, respectively. The first and second external electrodes each include a central portion disposed in a center of each of the third and fourth surfaces and an outer portion disposed outside the central portion. T1>T2>T3, in which T1 and T3 are maximum value and minimum value of a thickness of the central portion, respectively, and T2 is a maximum value of a thickness of the outer portion.Type: ApplicationFiled: June 6, 2022Publication date: June 15, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: San KYEONG, Young Soo YI, Kun Ho KOO, Soung Jin KIM, Ho Yeol LEE, Kyung Ryul LEE, Chang Hak CHOI
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Publication number: 20230178302Abstract: A multilayer capacitor includes a body including a stack structure in which at least one first internal electrode and at least one second internal electrode are alternately stacked in a first direction with at least one dielectric layer interposed therebetween; and first and second external electrodes spaced apart from each other and disposed on the body to be respectively connected to the at least one first internal electrode and the at least one second internal electrode, wherein each of the first and second external electrodes includes a first conductive layer including a first conductive material and glass; and an oxide layer including an oxide and disposed on at least a portion of an external surface of the first conductive layer.Type: ApplicationFiled: April 14, 2022Publication date: June 8, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Young Soo YI, Kun Ho KOO, San KYEONG, Hai Joon LEE, Kyung Ryul LEE, Ho Yeol LEE
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Publication number: 20230145889Abstract: According to an aspect of the present disclosure, a capacitor component includes a body including a dielectric layer and an internal electrode layer; and an external electrode disposed on the body and connected to the internal electrode layer, wherein the body further includes a withstand voltage layer disposed in a region spaced apart by more than 0 to 30 nm or less in a direction from a boundary of the internal electrode layer toward the dielectric layer, and having ionic mobility, lower than ionic mobility of the dielectric layer.Type: ApplicationFiled: April 5, 2022Publication date: May 11, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jong Hoon Yoo, Su Been Kim, Kyung Ryul Lee, Jong Suk Jeong, Chun Hee Seo, Dong Geon Yoo, Hyung Jun Kong
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Patent number: 11574773Abstract: A multilayer electronic component includes a body including a dielectric layer and internal electrodes alternately stacked with the dielectric layer interposed therebetween; and an external electrode including a first electrode layer disposed externally on the body, connected to the internal electrodes, and including a conductive metal, a glass, a low melting point metal having a lower melting point than the conductive metal, and a pore, and a second electrode layer covering the first electrode layer and including a conductive metal, a glass, and a pore, wherein porosity of the first electrode layer is higher than porosity of the second electrode layer.Type: GrantFiled: September 30, 2021Date of Patent: February 7, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Young Soo Yi, Soung Jin Kim, Kun Hoi Koo, Jun Hyeon Kim, Kyung Ryul Lee
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Patent number: 11476047Abstract: A multilayer electronic component includes a body in which internal electrodes including Ni and Sn and dielectric layers are alternately disposed, and external electrodes disposed on a surface of the body, connected to the internal electrodes, and including Cu and Sn, wherein the internal electrodes include an alloy including Ni, Cu, and Sn in a region in contact with the external electrodes, and Sn in an amount that satisfies the following formula: 1<C2/C1<13.5 in which C1 is the content of Sn of the internal electrodes at a central portion of the body and C2 is the content of Sn of the internal electrodes at a point 2 ?m away from a point at which the internal electrode and the external electrode are in contact with each other in an inward direction of the body.Type: GrantFiled: May 14, 2021Date of Patent: October 18, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Woong Do Jung, Yu Hong Oh, Kyung Ryul Lee, Kun Ho Koo, Young Soo Yi
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Publication number: 20220301770Abstract: A multilayer ceramic electronic component includes: a ceramic body including a dielectric layer having a main component represented by (Ba1-xCax) (Ti1-y(Zr, Hf)y)O3 (where, 0?x?1, 0?y?0.5), and including first and second internal electrodes alternately stacked with the dielectric layer interposed therebetween; a first external electrode connected to the first internal electrode; and a second external electrode connected to the second internal electrode, wherein at least one of the dielectric layer and the internal electrode includes Sn or Dy. If Sn, an average content of Sn at an interface between the dielectric layer and the internal electrode is within a range of 5 at % or more and 20 at % or less. If Dy, an average content of Dy at an interface between the dielectric layer and the internal electrode is within a range of 1 at % or more and 5 at % or less.Type: ApplicationFiled: January 14, 2022Publication date: September 22, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kyung Ryul Lee, Jong Suk Jeong, Chang Hak Choi
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Publication number: 20220199326Abstract: A ceramic electronic component includes: a body including dielectric layers and internal electrodes; and external electrodes disposed on the body and connected to the internal electrodes, wherein the dielectric layer includes a plurality of dielectric crystal grains, and at least one of the plurality of dielectric crystal grains has a core-double shell structure, the double shell includes a first shell surrounding at least a portion of the core and a second shell surrounding at least a portion of the first shell, the first shell includes a first element, one or more of Sn, Sb, Ge, Si, Ga, In, or Zr, and the second shell includes a second element, one or more of Ca or Sr.Type: ApplicationFiled: October 13, 2021Publication date: June 23, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Su Been Kim, Jong Hoon Yoo, Kyung Ryul Lee, Hyung Joon Jeon, Jin Woo Kim, Jong Suk Jeong
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Publication number: 20220189696Abstract: A multilayer electronic component includes a body including a dielectric layer and internal electrodes alternately stacked with the dielectric layer interposed therebetween; and an external electrode including a first electrode layer disposed externally on the body, connected to the internal electrodes, and including a conductive metal, a glass, a low melting point metal having a lower melting point than the conductive metal, and a pore, and a second electrode layer covering the first electrode layer and including a conductive metal, a glass, and a pore, wherein porosity of the first electrode layer is higher than porosity of the second electrode layer.Type: ApplicationFiled: September 30, 2021Publication date: June 16, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Young Soo YI, Soung Jin KIM, Kun Hoi KOO, Jun Hyeon KIM, Kyung Ryul LEE
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Publication number: 20220122770Abstract: A multilayer electronic component includes a body in which internal electrodes including Ni and Sn and dielectric layers are alternately disposed, and external electrodes disposed on a surface of the body, connected to the internal electrodes, and including Cu and Sn, wherein the internal electrodes include an alloy including Ni, Cu, and Sn in a region in contact with the external electrodes, and Sn in an amount that satisfies the following formula: 1<C2/C1<13.5 in which C1 is the content of Sn of the internal electrodes at a central portion of the body and C2 is the content of Sn of the internal electrodes at a point 2 ?m away from a point at which the internal electrode and the external electrode are in contact with each other in an inward direction of the body.Type: ApplicationFiled: May 14, 2021Publication date: April 21, 2022Inventors: Woong Do JUNG, Yu Hong OH, Kyung Ryul LEE, Kun Ho KOO, Young Soo YI
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Patent number: 11152153Abstract: A method of manufacturing a multilayer ceramic electronic component includes preparing a ceramic green sheet, forming an internal electrode pattern by coating a paste for an internal electrode including nickel (Ni) powder including a coating layer having a surface including copper (Cu) on the ceramic green sheet, forming a ceramic multilayer structure by stacking the ceramic green sheet with the internal electrode pattern formed thereon, and forming a body including a dielectric layer and an internal electrode by sintering the ceramic multilayer structure. The content of Cu is equal to or greater than 0.2 wt %, based on a total weight of the Ni powder.Type: GrantFiled: October 10, 2018Date of Patent: October 19, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kyoung Jin Cha, Jeong Ryeol Kim, Kyung Ryul Lee, Young Joon Oh, Hyo Min Kang, Jun Oh Kim
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Patent number: 10714262Abstract: A multilayer capacitor includes: a body including dielectric layers and internal electrodes alternately disposed therein; and external electrodes disposed on the body and connected to the internal electrodes, respectively. Each of the internal electrodes includes a Ni grain, ceramics distributed in the Ni grain, a first coating layer surrounding the Ni grain, and second coating layers surrounding the ceramics.Type: GrantFiled: July 31, 2018Date of Patent: July 14, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jeong Ryeol Kim, Hyo Sub Kim, Kyung Ryul Lee, Jun Oh Kim, Beom Seock Oh, Jong Han Kim, Kyoung Jin Cha
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Publication number: 20200058442Abstract: A method of manufacturing a multilayer ceramic electronic component includes preparing a ceramic green sheet, forming an internal electrode pattern by coating a paste for an internal electrode including nickel (Ni) powder including a coating layer having a surface including copper (Cu) on the ceramic green sheet, forming a ceramic multilayer structure by stacking the ceramic green sheet with the internal electrode pattern formed thereon, and forming a body including a dielectric layer and an internal electrode by sintering the ceramic multilayer structure. The content of Cu is equal to or greater than 0.2 wt %, based on a total weight of the Ni powder.Type: ApplicationFiled: October 10, 2018Publication date: February 20, 2020Inventors: Kyoung Jin CHA, Jeong Ryeol KIM, Kyung Ryul LEE, Young Joon OH, Hyo Min KANG, Jun Oh KIM
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Publication number: 20190304695Abstract: A multilayer capacitor includes: a body including dielectric layers and internal electrodes alternately disposed therein; and external electrodes disposed on the body and connected to the internal electrodes, respectively. Each of the internal electrodes includes a Ni grain, ceramics distributed in the Ni grain, a first coating layer surrounding the Ni grain, and second coating layers surrounding the ceramics.Type: ApplicationFiled: July 31, 2018Publication date: October 3, 2019Inventors: Jeong Ryeol KIM, Hyo Sub KIM, Kyung Ryul LEE, Jun Oh KIM, Beom Seock OH, Jong Han KIM, Kyoung Jin CHA
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Patent number: 10262795Abstract: A multilayer ceramic electronic component includes a ceramic body in which dielectric layers and internal electrodes are alternately disposed. Ceramic-metal compound layers are disposed on interfaces between the internal electrodes and the dielectric layers. Additionally, in some examples, spaces between adjacent internal electrodes are fully occupied by the dielectric layers and the dielectric layers contain a ceramic-metal compound containing metal particle. The ceramic-metal compound layer may have an embossing type configuration or a dendrite type configuration.Type: GrantFiled: March 16, 2016Date of Patent: April 16, 2019Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Hong Seok Kim, Chung Eun Lee, Doo Young Kim, Ki Han Kim, Ji Ye Choi, Kyung Ryul Lee, Jae Yeol Choi, Soo Kyong Jo