Patents by Inventor Kyung Sang Lim

Kyung Sang Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PHOTONIC INTEGRATED CIRCUIT EMBEDDED SUBSTRATE AND PHOTONIC INTEGRATED CIRCUIT PACKAGE
    Publication number: 20240032202
    Abstract: A photonic integrated circuit embedded substrate may include: an embedded insulating layer on which a photonic integrated circuit is disposed, and at least one first insulating layer stacked on one surface of the embedded insulating layer. The at least one first insulating layer may have an optical path extending in a stacking direction of the at least one first insulating layer.
    Type: Application
    Filed: February 13, 2023
    Publication date: January 25, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kwang Yun KIM, Kyung Sang LIM, Seung Eun LEE, Yong Hoon KIM
  • Fan-out semiconductor package
    Patent number: 10332843
    Abstract: A fan-out semiconductor package includes a semiconductor chip disposed in a through-hole of a first connection member having the through-hole and a second connection member disposed on an active surface of the semiconductor chip. A plurality of dummy vias surrounding the semiconductor chip are disposed in the first connection member.
    Type: Grant
    Filed: August 2, 2017
    Date of Patent: June 25, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yong Ho Baek, Moon Hee Yi, Kyung Sang Lim
  • FAN-OUT SEMICONDUCTOR PACKAGE
    Publication number: 20180053732
    Abstract: A fan-out semiconductor package includes a semiconductor chip disposed in a through-hole of a first connection member having the through-hole and a second connection member disposed on an active surface of the semiconductor chip. A plurality of dummy vias surrounding the semiconductor chip are disposed in the first connection member.
    Type: Application
    Filed: August 2, 2017
    Publication date: February 22, 2018
    Inventors: Yong Ho BAEK, Moon Hee YI, Kyung Sang LIM
  • Printed circuit board
    Patent number: 9226388
    Abstract: A printed circuit board disclosed. One embodiment of the present invention provides a printed circuit board that includes: an insulation layer having multiple layers of circuit wirings formed therein; a via formed along a perimeter of the insulation layer and configured for connecting circuit wirings formed on different layers of the insulation layer, the via being formed in such a way that an inside thereof is hollow; and an electromagnetic wave absorbing part contained in the via.
    Type: Grant
    Filed: July 31, 2013
    Date of Patent: December 29, 2015
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Sang-Kyung Lee, Hee-Kyoung Lee, Dong-Hwan Lee, Kyung-Sang Lim
  • PRINTED CIRCUIT BOARD
    Publication number: 20140034357
    Abstract: A printed circuit board disclosed. One embodiment of the present invention provides a printed circuit board that includes: an insulation layer having multiple layers of circuit wirings formed therein; a via formed along a perimeter of the insulation layer and configured for connecting circuit wirings formed on different layers of the insulation layer, the via being formed in such a way that an inside thereof is hollow; and an electromagnetic wave absorbing part contained in the via.
    Type: Application
    Filed: July 31, 2013
    Publication date: February 6, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sang-Kyung LEE, Hee-Kyoung Lee, Dong-Hwan Lee, Kyung-Sang Lim
  • PRINTED CIRCUIT BOARD
    Publication number: 20130081868
    Abstract: Disclosed herein is a printed circuit board, including: a dielectric substrate having a ground surface; a plurality of pads formed on the dielectric substrate; a transmission line transmitting a signal between the plurality of pads; and slots formed in partial regions of the ground surface correspondingly to the pads, thereby to improve signal transmitting characteristics and allow high-density wiring and thin thickness.
    Type: Application
    Filed: January 23, 2012
    Publication date: April 4, 2013
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dong Hwan LEE, Seung Wook Park, Kyung Sang Lim, Young Do Kweon