Abstract: A matrix-type display capable of being repaired by pixel unit, Two or more of signal lines such as scanning lines, image signal lines and auxiliary signal lines and a pixel electrode are overlapped via an insulating layer, so that a defect such as the disconnection of the image signal lines and scanning lines, the short of the pixel electrode and the signal line, and the loss of electrode of a switching element, and a pixel defect can be repaired. Here, the layout of the auxiliary gate line and dual gate line can be modified.

Abstract: A matrix-type display capable of being repaired by pixel unit, Two or more of signal lines such as scanning lines, image signal lines and auxiliary signal lines and a pixel electrode are overlapped via an insulating layer, so that a defect such as the disconnection of the image signal lines and scanning lines, the short of the pixel electrode and the signal line, and the loss of electrode of a switching element, and a pixel defect can be repaired. Here, the layout of the auxiliary gate line and dual gate line can be modified.

Abstract: A liquid crystal display device has a flexible circuit board which can prevent the disconnections of output side conductive layer patterns formed at the border portion of the solder resist layer. A flexible base film has a liquid crystal panel engaging portion, engaged with a liquid crystal panel on one side thereof. A driving IC is formed at the central portion of the base film to apply driving signals to driving devices of the liquid crystal panel. A first conductive layer patterns are extended on the base film from the driving IC to the liquid crystal panel engaging portion to electrically connect the driving IC to the liquid crystal panel. A solder resin layer exposes the first conductive layer patterns formed on the liquid crystal panel engaging portion and covers the first conductive layer patterns of the periphery of the driving IC.

Abstract: A matrix-type display device having a repair layout, particularly, a matrix-type display device which can be repaired in a pixel unit, is provided. Two or more of signal lines such as scanning signal lines, displaying signal lines and auxiliary signal lines and a pixel electrode are overlapped via an insulating layer, so that a defect such as the disconnection of the displaying signal lines and scanning signal lines, the short of the pixel electrode and signal line, and the loss of electrode of a switching element, can be repaired. Here, the layout of the auxiliary gate line and dual gate line can be modified.

Abstract: A liquid crystal display device has a flexible circuit board which can prevent the disconnections of output side conductive layer patterns formed at the border portion of the solder resist layer. A flexible base film has a liquid crystal panel engaging portion, engaged with a liquid crystal panel on one side thereof. A driving IC is formed at the central portion of the base film to apply driving signals to driving devices of the liquid crystal panel. A first conductive layer patterns are extended on the base film from the driving IC to the liquid crystal panel engaging portion to electrically connect the driving IC to the liquid crystal panel. A solder resin layer exposes the first conductive layer patterns formed on the liquid crystal panel engaging portion and covers the first conductive layer patterns of the periphery of the driving IC.

Abstract: A matrix-type display device having a repair layout, particularly, a matrix-type display device which can be repaired in a pixel unit, is provided. Two or more of signal lines such as scanning signal lines, displaying signal lines and auxiliary signal lines and a pixel electrode are overlapped via an insulating layer, so that a defect such as the disconnection of the displaying signal lines and scanning signal lines, the short of the pixel electrode and signal line, and the loss of electrode of a switching element, can be repaired Here, the layout of the auxiliary gate line and dual gate line can be modified.

Abstract: A matrix-type display device having a repair layout, particularly, a matrix-type display device which can be repaired in a pixel unit, is provided. Two or more of signal lines such as scanning signal lines, displaying signal lines and auxiliary signal lines and a pixel electrode are overlapped via an insulating layer, so that a defect such as the disconnection of the displaying signal lines and scanning signal lines, the short of the pixel electrode and signal line, and the loss of electrode of a switching element, can be repaired. Here, the layout of the auxiliary gate line and dual gate line can be modified.

Abstract: Flat panel display devices having improved signal line repair capability utilize repair lines which have reduced parasitic capacitance with other active signal lines when connected to provide a repair function. This reduced parasitic capacitance is a result of a reduced number of overlaps between active signal lines (or other repair lines) and each repair line performing a repair function. A main repair line is provided on a display substrate to provide a repair function in the event one of the signal lines is defective. If a repair function is needed because a data line is defective (e.g., "opened"), this main repair line is electrically connected to a first end of the defective data line and indirectly electrically connected to a second end of the defective data line. The indirect electrical connection is provided by a sub-repair line, which can be electrically connected (i.e.

Abstract: A matrix-type display capable of being repaired by pixel unit, Two or more of signal lines such as scanning lines, image signal lines and auxiliary signal lines and a pixel electrode are overlapped via an insulating layer, so that a defect such as the disconnection of the image signal lines and scanning lines, the short of the pixel electrode and the signal line, and the loss of electrode of a switching element, and a pixel defect can be repaired. Here, the layout of the auxiliary gate line and dual gate line can be modified.

Abstract: A lead-on-chip package manufacturing method includes an insulating liquid adhesive depositing step on lead attaching regions formed on an active surface of a semiconductor on a wafer. The adhesive deposition may be accomplished by a screen printing method in which the adhesive is forced through hole patterns of a metal screen, or by a dispensing method in which a liquid adhesive is dispensed from needles of a dispensing head that is movable over the wafer surface and is aligned with the wafer. The dispensing technique may be applied to a plurality of chips in step-by-step fashion, or in a simultaneous manner by using a multi-needled dispensing head.