Patents by Inventor Kyung Seop LEE

Kyung Seop LEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240071306
    Abstract: A display device according to one or more embodiments of the disclosure includes a pixel circuit layer including a base layer and circuit elements on the base layer; and a display layer on the pixel circuit layer. The display layer includes a first electrode on the pixel circuit layer; an insulating layer on the first electrode; a second electrode on the insulating layer; a light emitting stacked structure on the second electrode and including a first insulating layer, a second insulating layer, and a light emitting layer between the first insulating layer and the second insulating layer; and a third electrode on the light emitting stacked structure. The light emitting layer includes a two-dimensional material, is separated from the second electrode by the first insulating layer, and is separated from the third electrode by the second insulating layer.
    Type: Application
    Filed: May 18, 2023
    Publication date: February 29, 2024
    Inventors: Yun JANG, Yun Hee PARK, Yi Seop SHIM, Hyun Seung LEE, Kyu Won JO, Kyung Seon TAK
  • Patent number: 10546681
    Abstract: An electronic component includes a magnetic body; and a coil pattern embedded in the magnetic body, the coil pattern including an internal coil part having a spiral shape and a lead part connected to an end of the internal coil part and exposed to an external surface of the magnetic body. The lead part includes at least two regions having different thicknesses, and the thickness of at least a portion of the lead part having a relatively thin thickness is thinner than a thickness of the internal coil part.
    Type: Grant
    Filed: May 15, 2019
    Date of Patent: January 28, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dong Jin Jeong, Kyung Seop Lee, Yong Un Choi, Kyung Min Son
  • Publication number: 20190267178
    Abstract: An electronic component includes a magnetic body; and a coil pattern embedded in the magnetic body, the coil pattern including an internal coil part having a spiral shape and a lead part connected to an end of the internal coil part and exposed to an external surface of the magnetic body. The lead part includes at least two regions having different thicknesses, and the thickness of at least a portion of the lead part having a relatively thin thickness is thinner than a thickness of the internal coil part.
    Type: Application
    Filed: May 15, 2019
    Publication date: August 29, 2019
    Inventors: Dong Jin JEONG, Kyung Seop LEE, Yong Un CHOI, Kyung Min SON
  • Patent number: 10332667
    Abstract: An electronic component includes a magnetic body; and a coil pattern embedded in the magnetic body, the coil pattern including an internal coil part having a spiral shape and a lead part connected to an end of the internal coil part and exposed to an external surface of the magnetic body. The lead part includes at least two regions having different thicknesses, and the thickness of at least a portion of the lead part having a relatively thin thickness is thinner than a thickness of the internal coil part.
    Type: Grant
    Filed: November 9, 2015
    Date of Patent: June 25, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dong Jin Jeong, Kyung Seop Lee, Yong Un Choi, Kyung Min Son
  • Patent number: 9875837
    Abstract: A coil electronic component includes a first coil disposed on a first surface of an insulating substrate; a second coil disposed on a second surface of the insulating substrate opposing the first surface; a via connecting the first and second coils through the insulating substrate; a first via pad formed as one end of the first coil extending and disposed on the first surface of the insulating substrate to cover the via; and a second via pad formed as one end of the second coil extending and disposed on the second surface of the insulating substrate to cover the via. Upper surfaces of the first and second via pads have rounded corners.
    Type: Grant
    Filed: April 1, 2016
    Date of Patent: January 23, 2018
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Dong Jin Jeong, Kyung Seop Lee
  • Publication number: 20160351314
    Abstract: An electronic component includes at least one current path blocking part formed in a surface of a magnetic body in a direction crossing a direction in which terminals of a coil part are exposed. The current path of the fine current flowing on the surface of the magnetic body may be blocked by the current path blocking part, when a high voltage is applied. The current path of the current flowing in the magnetic body may be formed as long as possible, whereby the fine current flowing on the surface of the inductor may be removed or decreased.
    Type: Application
    Filed: April 5, 2016
    Publication date: December 1, 2016
    Inventors: Dong Jin JEONG, Kyung Seop LEE
  • Publication number: 20160307689
    Abstract: A coil electronic component includes a first coil disposed on a first surface of an insulating substrate; a second coil disposed on a second surface of the insulating substrate opposing the first surface; a via connecting the first and second coils through the insulating substrate; a first via pad formed as one end of the first coil extending and disposed on the first surface of the insulating substrate to cover the via; and a second via pad formed as one end of the second coil extending and disposed on the second surface of the insulating substrate to cover the via. Upper surfaces of the first and second via pads have rounded corners.
    Type: Application
    Filed: April 1, 2016
    Publication date: October 20, 2016
    Inventors: Dong Jin JEONG, Kyung Seop LEE
  • Publication number: 20160172103
    Abstract: An electronic component includes a magnetic body; and a coil pattern embedded in the magnetic body, the coil pattern including an internal coil part having a spiral shape and a lead part connected to an end of the internal coil part and exposed to an external surface of the magnetic body. The lead part includes at least two regions having different thicknesses, and the thickness of at least a portion of the lead part having a relatively thin thickness is thinner than a thickness of the internal coil part.
    Type: Application
    Filed: November 9, 2015
    Publication date: June 16, 2016
    Inventors: Dong Jin JEONG, Kyung Seop LEE, Yong Un CHOI, Kyung Min SON
  • Publication number: 20160172096
    Abstract: An electronic component includes a body including internal electrodes and a filler containing a metal component, a first insulating layer enclosing the internal electrodes, and a second insulating layer enclosing the first insulating layer.
    Type: Application
    Filed: November 2, 2015
    Publication date: June 16, 2016
    Inventors: Dong Jin JEONG, Min Young KIM, Sin Gon KIM, Kyung Seop LEE