Abstract: A molding apparatus for molding semiconductor devices using a molding compound in which a mold is automatically treated with a mold releasing agent is provided. A lead frame strip in-magazine part and a tablet loading part are designed so that dummy lead frame strips and releasing tablets used in a mold releasing agent treatment process are automatically supplied to the molding apparatus in a mold releasing agent treatment mode or a mold cleaning mode. After the mold releasing agent treatment mode or mold cleaning mode is complete, the molding apparatus is switched back to a normal molding process and normal lead frame strips and molding compound tablets are to the mold part. In addition, a pick-up part and a stack magazine part are designed to distinguish by-products generated during the mold releasing agent treatment process from normally molded products by switching from a normal molding process to either a mold releasing agent treatment process or a mold cleaning process.

Abstract: A tablet detecting system ascertains whether a tablet exists in a receiving hole of a loader unit used for a molding tablet supplying apparatus or, if exists, whether the tablet has a standard size, by using a mechanical contact manner. The tablet detecting system has a push rod, a contact head, an insulation plate, a conductive assembly and a control unit. The push rod is inserted into the receiving hole and moves upward just as high as the tablet. The contact head is formed on a top of the push rod and the insulation plate is located over the contact head. The conductive assembly is formed in the insulation plate and the control unit is electrically connected to the conductive assembly. When the tablet in the receiving hole has a standard size, the contact head mechanically touches the conductive assembly and gives electrical connection to the conductive assembly, and the control unit senses the electrical connection.

Abstract: Provided is a molding apparatus for molding simultaneously a plurality of semiconductor devices. The molding apparatus includes a mold, a plurality of plungers, and a plunger block. The mold is prepared to mold a plurality of semiconductor devices. The plurality of plungers are plunged into the mold to inject a molding compound that will encapsulate the semiconductor devices in the mold. The plurality of plungers are assembled with the plunge block to operate at the same time. Each of the plurality of plungers includes a load sensor and/or a contact sensor, so as to sense separately whether the plungers are improperly operating.

Abstract: A semiconductor chip molding apparatus includes an upper platen including an upper mold, a lower platen including a lower mold having a molding block configured to receive a lead frame, a controller, and an electrical detector for forming an electrical circuit between the controller and the lead frame when the lead frame is oriented improperly on the lower mold. A low-level test voltage is imparted to at least the lower mold. As a result, an electrical signal will flow from the detecting block when the lead frame rests on the detecting block. When such a signal is detected, therefore, the lead frame is determined as having been improperly set on the molding block. The signal generated is detected by a controller and used thereby to interrupt the operation of the molding apparatus.