Abstract: Provided is a method for preparing an oligomer including: supplying a monomer stream and a solvent stream to a reactor to perform an oligomerization reaction to prepare a reaction product; supplying a discharge stream from the reactor including the reaction product to a separation device and supplying a lower discharge stream from the separation device to a settling tank; adding an organic flocculant to the settling tank to settle and remove a polymer and supplying the lower discharge stream from the separation device from which the polymer is removed to a high boiling point separation column; and removing a high boiling point material from the lower portion in the high boiling point separation column and supplying an upper discharge stream including an oligomer to a solvent separation column.

Abstract: The present disclosure relates to an apparatus for preparing an oligomer, the apparatus including: a reactor for oligomerizing a feed stream containing a fed monomer; a stirrer inserted into a hole formed in an upper portion of the reactor; and a solvent transfer line extending inward from a side of the reactor, wherein the stirrer includes a rotating shaft vertically extending downward from the upper portion of the reactor, and a blade having a conical shape whose vertex is positioned at a lower end of the rotating shaft and outer diameter increases from a bottom toward a top, and the solvent transfer line has a plurality of spray nozzles formed in a direction toward the blade.

Abstract: Provided is a method of producing an oligomer, the method including: supplying a monomer stream and a solvent stream to a reactor to perform an oligomerization reaction to produce a reaction product; supplying a discharge stream of the reactor to a separation device, and supplying an upper discharge stream of the separation device including an unreacted monomer to the reactor and supplying a lower discharge stream of the separation device to a settling tank; settling a polymer in the settling tank and removing the polymer, and supplying the lower discharge stream of the separation device from which the polymer is removed to a high-boiling point separation column; removing a high-boiling point material from a lower discharge stream of the high-boiling point separation column and supplying an upper discharge stream of the high-boiling point separation column including an oligomer to a solvent separation column; and separating a solvent and the oligomer in the solvent separation column.

Abstract: The present invention provides methods for treating or ameliorating metabolic diseases, cholestatic liver diseases, or organ fibrosis, which comprises administering to a subject a therapeutically effective amount of a pharmaceutical composition comprising an isoxazole derivative, a racemate, an enantiomer, or a diastereoisomer thereof, or a pharmaceutically acceptable salt of the derivative, the racemate, the enantiomer, or the diastereoisomer.

Abstract: Disclosed is a LED which can be mounted at high density on a large area display. Having a hole for heat sink in the ceramic substrate, the LED is superior in heat sink property. In order to fabricate the light emitting device, first, a secondary ceramic sheet is stacked on the ceramic substrate, followed by forming electrodes in a predetermined pattern on the secondary ceramic sheet around the hole for heat sink. On the ceramic substrate, an upper ceramic sheet with an opening is stacked to form a stacked ceramic substrate in such a way that a part of the electrodes are exposed through the opening. After co-firing the stacked ceramic substrate, a light emitting diode chip is mounted on the secondary ceramic sheet at a position corresponding to the hole for heat sink. Then, the electrodes are electrically connected with the LED chip, and the LED chip is sealed with insulating resin. A light emitting device using the LED and a fabrication method therefor are also disclosed.

Abstract: An LED package, made of ceramic substrates and having a reflective metal plate, has a first ceramic substrate, which has a chip mounting area on its top surface, and is provided with a predetermined conductive pattern formed around the chip mounting area. One or more LED chips are seated on the chip mounting area of the first ceramic substrate, and are connected to the conductive pattern. A second ceramic substrate is mounted on the top surface of the first ceramic substrate and has a cavity at a position corresponding to the chip mounting area. The reflective metal plate is set in the cavity of the second ceramic substrate to surround the LED chips. The reflective metal plate acts as a heat sink for dissipating heat from the LED chips.

Abstract: Disclosed is a LED which can be mounted at high density on a large area display. Having a hole for heat sink in the ceramic substrate, the LED is superior in heat sink property. In order to fabricate the light emitting device, first, a secondary ceramic sheet is stacked on the ceramic substrate, followed by forming electrodes in a predetermined pattern on the secondary ceramic sheet around the hole for heat sink. On the ceramic substrate, an upper ceramic sheet with an opening is stacked to form a stacked ceramic substrate in such a way that a part of the electrodes are exposed through the opening. After co-firing the stacked ceramic substrate, a light emitting diode chip is mounted on the secondary ceramic sheet at a position corresponding to the hole for heat sink. Then, the electrodes are electrically connected with the LED chip, and the LED chip is sealed with insulating resin. A light emitting device using the LED and a fabrication method therefor are also disclosed.

Abstract: Disclosed is a LED which can be mounted at high density on a large area display. Having a hole for heat sink in the ceramic substrate, the LED is superior in heat sink property. In order to fabricate the light emitting device, first, a secondary ceramic sheet is stacked on the ceramic substrate, followed by forming electrodes in a predetermined pattern on the secondary ceramic sheet around the hole for heat sink. On the ceramic substrate, an upper ceramic sheet with an opening is stacked to form a stacked ceramic substrate in such a way that a part of the electrodes are exposed through the opening. After co-firing the stacked ceramic substrate, a light emitting diode chip is mounted on the secondary ceramic sheet at a position corresponding to the hole for heat sink. Then, the electrodes are electrically connected with the LED chip, and the LED chip is sealed with insulating resin. A light emitting device using the LED and a fabrication method therefor are also disclosed.

Abstract: Disclosed is a blue light emitting diode comprising a laminate structure formed in the center of a first conductive nitride semiconductor layer, a first electrode formed on a part of a transparent metal layer included in the laminate structure and a second electrode formed on a peripheral part of the first conductive nitride semiconductor layer, which is not covered by the laminate structure. By altering the locations of the first electrode and the second electrode and forming electrode extensions thereof, it is possible to disperse effectively the current density. Accordingly, the concentration of the current density contributing to the rapid increase of the temperature can be avoided without a significant change of the laminate structure of the conventional light emitting diode. In addition it is possible to improve resistance to electrostatic discharge and to reduce the driving voltage.

Abstract: An LED package, made of ceramic substrates and having a reflective metal plate, is disclosed. This LED package consists of a first ceramic substrate, which has a chip mounting area on its top surface, and is provided with a predetermined conductive pattern formed around the chip mounting area. One or more LED chips are seated on the chip mounting area of the first ceramic substrate, and are connected to the conductive pattern. A second ceramic substrate is mounted on the top surface of the first ceramic substrate and has a cavity at a position corresponding to the chip mounting area. The reflective metal plate is set in the cavity of the second ceramic substrate to surround the LED chips. This LED package effectively controls the luminous intensity of the LED chips and the angular distribution of the luminance. The reflective metal plate also collaterally acts as a heat sink effectively dissipating heat from the LED chips to the surroundings of the LED package.

Abstract: Disclosed is a LED which can be mounted at high density on a large area display. Having a hole for heat sink in the ceramic substrate, the LED is superior in heat sink property. In order to fabricate the light emitting device, first, a secondary ceramic sheet is stacked on the ceramic substrate, followed by forming electrodes in a predetermined pattern on the secondary ceramic sheet around the hole for heat sink. On the ceramic substrate, an upper ceramic sheet with an opening is stacked to form a stacked ceramic substrate in such a way that a part of the electrodes are exposed through the opening. After co-firing the stacked ceramic substrate, a light emitting diode chip is mounted on the secondary ceramic sheet at a position corresponding to the hole for heat sink. Then, the electrodes are electrically connected with the LED chip, and the LED chip is sealed with insulating resin. A light emitting device using the LED and a fabrication method therefor are also disclosed.

Abstract: Disclosed is a blue light emitting diode comprising a laminate structure formed in the center of a first conductive nitride semiconductor layer, a first electrode formed on a part of a transparent metal layer included in the laminate structure and a second electrode formed on a peripheral part of the first conductive nitride semiconductor layer, which is not covered by the laminate structure. By altering the locations of the first electrode and the second electrode and forming electrode extensions thereof, it is possible to disperse effectively the current density. Accordingly, the concentration of the current density contributing to the rapid increase of the temperature can be avoided without a significant change of the laminate structure of the conventional light emitting diode. In addition it is possible to improve resistance to electrostatic discharge and to reduce the driving voltage.