Patents by Inventor Kyung Suk Kang

Kyung Suk Kang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11927890
    Abstract: A substrate processing apparatus includes a photoresist coater applying a photoresist film on a substrate, a humidifier increasing an amount of moisture in an ambient to which the photoresist film on the substrate is exposed, and an exposer irradiating the photoresist film exposed to the ambient having the increased amount of moisture with light. The humidifier is disposed between the photoresist coater and the exposer.
    Type: Grant
    Filed: August 22, 2022
    Date of Patent: March 12, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seok Heo, Cha Won Koh, Sang Joon Hong, Hyun Woo Kim, Kyung-Won Kang, Dong-Wook Kim, Kyung Won Seo, Young Il Jang, Yong Suk Choi
  • Patent number: 11912674
    Abstract: The present invention provides methods for treating or ameliorating metabolic diseases, cholestatic liver diseases, or organ fibrosis, which comprises administering to a subject a therapeutically effective amount of a pharmaceutical composition comprising an isoxazole derivative, a racemate, an enantiomer, or a diastereoisomer thereof, or a pharmaceutically acceptable salt of the derivative, the racemate, the enantiomer, or the diastereoisomer.
    Type: Grant
    Filed: March 4, 2021
    Date of Patent: February 27, 2024
    Assignee: IL DONG PHARMACEUTICAL CO., LTD.
    Inventors: Jae-Hoon Kang, Hong-Sub Lee, Yoon-Suk Lee, Jin-Ah Jeong, Sung-Wook Kwon, Jeong-Guen Kim, Kyung-Sun Kim, Dong-Keun Song, Sun-Young Park, Kyeo-Jin Kim, Ji-Hye Choi, Hey-Min Hwang
  • Publication number: 20160336684
    Abstract: The present invention relates to a cable manager, and more particularly, to a cable manager which can secure promptness and convenience when a plurality of cables are connected or disconnected by collectively connecting and separating connectors of the cables to and from a plurality of ports formed in a socket of a server device or the like.
    Type: Application
    Filed: December 15, 2014
    Publication date: November 17, 2016
    Applicant: ACS CO., Ltd.
    Inventors: Joung Youl KIM, Don Hyuk CHOI, Kyung Suk KANG
  • Publication number: 20090212409
    Abstract: A stackable semiconductor package is disclosed. In the stackable semiconductor package, land grid array (LGA) or ball grid array (BGA) semiconductor packages are stacked in the vertical direction.
    Type: Application
    Filed: April 25, 2008
    Publication date: August 27, 2009
    Applicant: Memory & Testing Inc.
    Inventor: Kyung Suk Kang
  • Publication number: 20020093358
    Abstract: A parallel logic device/circuit tester is a tester for testing a plurality of devices-under-test (DUTs), in which a proved quality device is made as a reference device and identical signals are input to the reference device and a number of DUTs under the same initial condition, to enable the reference device and the number of DUTs to operate. The parallel logic device/circuit tester includes a main tester unit for generating signals applied to the reference device and the DUTs in order to test the DUTs, and receiving the testing result, to thereby test each DUT, and a bidirectional comparator and detector on which the reference device and the DUTs are loaded, for applying the signals from the main tester unit to the loaded reference device and the loaded DUTs, and comparing the data signals from each of the DUTs with those from the reference device according to the applied signals, to thereby output the compared result as a testing result.
    Type: Application
    Filed: November 16, 2001
    Publication date: July 18, 2002
    Inventor: Kyung Suk Kang
  • Patent number: 6242285
    Abstract: A stacked package of semiconductor package units and a stacking method thereof through direct connection between leads to effectively stack a number of semiconductor packages are provided, in which a lead deformation process of straightening leads of an upper semiconductor package is performed to form a stacked package, and predetermined leads of the semiconductor packages above a lower semiconductor package being a conventional standard semiconductor package are directly connected, considering an external and internal electrical connection state of a package. The semiconductor packages are used for forming a stacked package through directly connecting predetermined leads of the semiconductor packages, in which a connection state between a CS lead of an operation select-function for activating the operation of a predetermined semiconductor package and any one NC lead of a number of NC leads which are not connected is changed externally and internally in a package.
    Type: Grant
    Filed: January 15, 1999
    Date of Patent: June 5, 2001
    Inventor: Kyung Suk Kang
  • Patent number: 6072794
    Abstract: A digital trunk interface unit for interfacing with a digital trunk of a PSTN in the RAS for connecting the PSTN to a different network by a T1 or E1 trunk, comprises a plurality of line card slots; a plurality of E1 line cards inserted into the line card slots to provide an interface of an E1 trunk; a plurality of T1 line cards inserted into the line card slots to provide an interface of a T1 trunk; a digital switch; an R2 signaling part; a tone generator; a processor; a clock selector; a PLL; a frequency-divider; and a clock converter. Therefore, personal computers of the PSTN connected to the RAS by the trunk interface unit, can be connected to a packet network by a modem unit and a gateway, thereby being provided information services from information providers.
    Type: Grant
    Filed: April 13, 1998
    Date of Patent: June 6, 2000
    Assignee: Daewoo Telecom Co., Ltd.
    Inventor: Kyung-Suk Kang