Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.

Abstract: Disclosed herein are a neural network model deployment method and apparatus for providing a deep learning service. The neural network model deployment method may include providing a specification wizard to a user, searching for and training a neural network based on a user requirement specification that is input through the specification wizard, generating a neural network template code based on the user requirement specification and the trained neural network, converting the trained neural network into a deployment neural network that is usable in a target device based on the user requirement specification, and deploying the deployment neural network to the target device.

Abstract: The present invention relates to a polyketone resin composition and a method for manufacturing the same. The polyketone resin composition is prepared by mixing a polyketone terpolymer consisting of repeating units, represented by the following general formulas (1) and (2), with ABS, a glass fiber, a sulfonamide-based plasticizer and a mineral filler, and is applicable to various industrial fields requiring oil resistance, calcium chloride resistance, impact resistance, etc.

Abstract: The present invention relates to a polyketone resin composition and to a production method therefor; and relates to a polyketone copolymer having outstanding water resistance, moisture-absorption rate and shock resistance, characterised in that the polyketone copolymer comprises repeat units represented by general formulae (1) and (2) and has an intrinsic viscosity of between 1.0 and 2.0 dl/g. Because of the outstanding moisture-absorption rate and shock resistance, the present invention can be used in, inter alia, marine bolts, clips and holders, connectors, switches, bobbins, sludge-treatment chains, cable ties, automotive fuel injection ports, green juicer screws, office partition frames and box frames.