Patents by Inventor Kyung-Tae Hong

Kyung-Tae Hong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240126890
    Abstract: An apparatus of verifying a software integrity of a vehicle controller and a method thereof includes a communication device that provides a communication interface with a software management system, and a controller which is configured to obtain first verification data of the vehicle controller from the software management system, obtains second verification data from the vehicle controller, and verifies an integrity of software loaded in the vehicle controller based on the obtained first verification data and the obtained second verification data.
    Type: Application
    Filed: April 19, 2023
    Publication date: April 18, 2024
    Applicants: HYUNDAI MOTOR COMPANY, Kia Corporation
    Inventors: Hye Ryun LEE, Kyung Tae NOH, Min Ho HEO, Sug Woo SHIN, Duk Won HONG, Dong Jun AHN
  • Patent number: 11961775
    Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.
    Type: Grant
    Filed: November 8, 2022
    Date of Patent: April 16, 2024
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Gyu Wan Han, Won Bae Bang, Ju Hyung Lee, Min Hwa Chang, Dong Joo Park, Jin Young Khim, Jae Yun Kim, Se Hwan Hong, Seung Jae Yu, Shaun Bowers, Gi Tae Lim, Byoung Woo Cho, Myung Jea Choi, Seul Bee Lee, Sang Goo Kang, Kyung Rok Park
  • Publication number: 20240112445
    Abstract: A continuous use authentication method includes: acquiring a normal state image and a current image for a user; determining an inferred classification state for the user from among a plurality of classification states by applying the normal state image and the current image to a low-depth inference model for the user; when the inferred classification state is included in an abnormality category, determining a high-depth inference model corresponding to the inferred classification state from among a plurality of high-depth inference models; and determining reliability of the inferred classification state by applying the current image to the high-depth inference model.
    Type: Application
    Filed: December 10, 2021
    Publication date: April 4, 2024
    Inventors: Yoo Bin IM, Kyung Tae KO, Gi Wan PARK, Byeong Kweon PARK, Seungun LEE, Tai Heon HONG
  • Publication number: 20230219251
    Abstract: The present invention relates to a multifunctional wood preservative composition containing a compound prepared by reaction of hydrazine hydrate and boric acid and to a method for wood preservation treatment using the same. The wood preservative composition of the present invention can not only impart flame retardant, insect-repellent, rot-resistant, insect-repellent, and rust-proof effects to wood, such as various wooden structures including wooden cultural assets, but also causes no whitening and makes relatively fewer color changes for dancheong. Furthermore, the wood preservative composition of the present invention is provided as a one-component type liquid and thus can save time and costs for wood treatment and is convenient to use.
    Type: Application
    Filed: March 30, 2022
    Publication date: July 13, 2023
    Inventors: Jinqyu KIM, Jae-Gwan PARK, Kyung Tae HONG, Soo Chang SONG, Jin Gu KANG
  • Patent number: 11359096
    Abstract: Disclosed is a fluorescent probe specifically labeling mitochondria, which can exhibit high transmittance by virtue of light emission in the NIR range and in which nonspecific fluorescence absorption in biomolecules can be avoided, making it possible to observe fluorescence images in deep tissue.
    Type: Grant
    Filed: May 3, 2019
    Date of Patent: June 14, 2022
    Assignee: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Jun-Seok Lee, Dhiraj P. Murale, Seong-Cheol Hong, Kyung-Tae Hong, Yun-Kyung Kim, Seok Lee
  • Publication number: 20200040190
    Abstract: Disclosed is a fluorescent probe specifically labeling mitochondria, which can exhibit high transmittance by virtue of light emission in the NIR range and in which nonspecific fluorescence absorption in biomolecules can be avoided, making it possible to observe fluorescence images in deep tissue.
    Type: Application
    Filed: May 3, 2019
    Publication date: February 6, 2020
    Inventors: Jun-Seok LEE, Dhiraj P. MURALE, Seong-Cheol HONG, Kyung-Tae HONG, Yun-Kyung KIM, Seok LEE
  • Patent number: 10124402
    Abstract: A method for manufacturing carbon fiber reinforced aluminum composites is provided. Particularly, the method uses a stir casting process during a melting and casting process and reduces a contact angle of carbon against aluminum by inputting carbon fibers while supplying a current to liquid aluminum to induce the carbon fibers to be spontaneously and uniformly distributed in the liquid aluminum and inhibits a formation of an aluminum carbide (Al4C3) phase on an interface between the aluminum and the carbon fiber, thereby manufacturing carbon fiber reinforced aluminum composites having excellent electrical, thermal and mechanical characteristics.
    Type: Grant
    Filed: March 3, 2017
    Date of Patent: November 13, 2018
    Assignee: Korea Institute of Science and Technology
    Inventors: Jin Kook Yoon, Kyung Tae Hong, Gyeung Ho Kim, Young Jun Choi, Geun Hun Oh
  • Publication number: 20170252798
    Abstract: A method for manufacturing carbon fiber reinforced aluminum composites is provided. Particularly, the method uses a stir casting process during a melting and casting process and reduces a contact angle of carbon against aluminum by inputting carbon fibers while supplying a current to liquid aluminum to induce the carbon fibers to be spontaneously and uniformly distributed in the liquid aluminum and inhibits a formation of an aluminum carbide (Al4C3) phase on an interface between the aluminum and the carbon fiber, thereby manufacturing carbon fiber reinforced aluminum composites having excellent electrical, thermal and mechanical characteristics.
    Type: Application
    Filed: March 3, 2017
    Publication date: September 7, 2017
    Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Jin Kook YOON, Kyung Tae HONG, Gyeung Ho KIM, Young Jun CHOI, Geun Hun OH
  • Patent number: 7468122
    Abstract: The present invention relates to a composite layer including a metal and inorganic powders, and a method for manufacturing the same. The method for manufacturing a composite layer including a metal and inorganic powders includes step of preparing an electrolyte which includes nickel sulfamate [Ni(NH2SO4)] at 50.0 g/l˜300.0 g/l, boric acid at 10.0 g/l˜20.0 g/l, nickel chloride (NiCl2) at 1.0 g/l˜10.0 g/l, coumarin (C9H6O2) at 0.02 g/l˜0.5 g/l, sodium dodecyl sulfate [CH3—(CH2)11—OSONa] at 4.0 g/l˜60.0 g/l, sulfuric acid at 0.0 ml/l˜150.0 ml/l, one or more inorganic powders selected from the group of alumina (Al2O3) and silicon carbide (SiC) at 20.0 g/l˜70.0 g/l, and the remainder being distilled water. A basic metal to be coated with the composite metal is dipped into the electrolyte, and power is applied to the basic metal to electroplate the basic metal with the electrolyte to form a composite layer on the basic metal.
    Type: Grant
    Filed: December 29, 2005
    Date of Patent: December 23, 2008
    Assignee: KIST
    Inventors: Ji-Young Byun, Kyung-Tae Hong, Jung-Man Doh, Heon-Phil Ha, Kyoung-Tae Kim
  • Publication number: 20070108059
    Abstract: The present invention relates to a composite layer including a metal and inorganic powders, and a method for manufacturing the same. The method for manufacturing a composite layer including a metal and inorganic powders includes steps of preparing an electrolyte including nickel sulfamate [Ni(NH2SO4)] at 50.0 g/l˜300.0 g/l, boric acid at 10.0 g/l˜20.0 g/l, nickel chloride (NiCl2) at 1.0 g/l˜10.0 g/l, coumarin (C9H6O2) at 0.02 g/l˜0.5 g/l, sodium dodecyl sulfate [CH3—(CH2)11—OSONa] at 4.0 g/l˜60.0 g/l, sulfuric acid at 0.0 ml/l˜150.0 ml/l, one or more inorganic powders selected from the group of alumina (Al2O3) and silicon carbide (SiC) at 20.0 g/l˜70.0 g/l, and the remainder being distilled water; dipping a basic metal into the electrolyte; supplying a powder to the basic metal and electroplating the basic material; and forming the composite layer on the basic metal.
    Type: Application
    Filed: December 29, 2005
    Publication date: May 17, 2007
    Inventors: Ji-Young Byun, Kyung-Tae Hong, Jung-Man Doh, Heon-Phil Ha, Kyoung-Tae Kim
  • Patent number: 7179505
    Abstract: The embodiments of the invention relate to a MoSi2-SiC nanocomposite coating layer formed on surfaces of refractory metals such as Mo, Nb, Ta, W and their alloys. The MoSi2-SiC nanocomposite coating layer is manufactured by forming a molybdenum carbide (MoC and MoC2) coating layers on the surfaces of the substrates at high temperature, and the subsequent vapor-deposition of Si. The MoSi2-SiC nanocomposite coating layer has a microstructure in which SiC particles are mostly located on the equiaxed MoSi2 grain boundary. The MoSi2-SiC nanocomposite coating layer can have a close thermal expansion coefficient to that of the substrate by controlling a volume fraction of SiC particles exisiting in the nanocomposite coating.
    Type: Grant
    Filed: December 29, 2004
    Date of Patent: February 20, 2007
    Assignee: Korea Institute of Science and Technology
    Inventors: Jin-Kook Yoon, Gyeung-Ho Kim, Kyung-Tae Hong, Jung-Man Doh, Jong-Kwon Lee, Kyung-Hwan Lee, Keun-Hyung Son
  • Publication number: 20060029830
    Abstract: A NbSi2-base nanocomposite coating formed on the surface of niobium or niobium-base alloys is disclosed. The nanocomposite coating layer is manufactured by forming a niobium carbide layers or a niobium nitride layers by depositing of carbon or nitrogen on the surface, and then depositing silicon. The nanocomposite coating layer has a microstructure that SiC or Si3N4 particles are mostly precipitated on an equiaxed NbSi2 grain boundary. The thermal expansion coefficients of NbSi2-base nanocomposite coating layers become close to that of the substrates by adjusting the volume fraction of SiC or Si3N4 particles in the nanocomposite coating layers. Accordingly, the generation of cracks caused by thermal stress due to the mismatch in thermal expansion coefficient between the NbSi2-base nanocomposite coatings and the substrates can be suppressed, thereby improving the high-temperature oxidation resistance in the repeated thermal cycling use of the NbSi2-base nanocomposite coated substrates.
    Type: Application
    Filed: December 29, 2004
    Publication date: February 9, 2006
    Applicant: Korea Institute of Science and Technology
    Inventors: Jin-Kook Yoon, Gyeung-Ho Kim, Kyung-Tae Hong, Jung-Man Doh, Jong-Kwon Lee, Kyung-Hwan Lee, Keun-Hyung Son
  • Publication number: 20060003567
    Abstract: Disclosed are the MoSi2—SiC nanocomposite coating layer formed on surfaces of refractory metals such as Mo, Nb, Ta, W and their alloys. The MoSi2—SiC nanocomposite coating layer is manufactured by forming a molybdenum carbide (MoC and MoC2) coating layers on the surfaces of the substrates at high temperature, and the subsequent vapor-deposition of Si. The MoSi2—SiC nanocomposite coating layer has a microstructure in which SiC particles are mostly located on the equiaxed MoSi2 grain boundary. The MoSi2—SiC nanocomposite coating layer can have a close thermal expansion coefficient to that of the substrate by controlling a volume fraction of SiC particles exisiting in the nanocomposite coating. As a result, the generation of cracks due to the mismatch in the thermal expansion coefficients between the substrate and the nanocomposite coating layer is suppressed and the high-temperature repeated thermal cyclic oxidation resistance and the low-temperature oxidation resistance of the coated substrate are improved.
    Type: Application
    Filed: December 29, 2004
    Publication date: January 5, 2006
    Applicant: Korea Institute of Science and Techonology
    Inventors: Jin-Kook Yoon, Gyeung-Ho Kim, Kyung-Tae Hong, Jung-Mann Doh, Jong-Kwon Lee, Kyung-Hwan Lee, Keun-Hyung Son
  • Publication number: 20010003377
    Abstract: A heat sink for a semiconductor device comprises a tungsten-copper composite body and a diamond film coated on the surface of the body. A method for fabricating a heat sink for a semiconductor comprises the steps of fabricating a tungsten-copper composite heat sink, modifying a surface of the heat sink by selectively dissolving copper from the surface of the heat sink, carrying out a process for supplying nuclei for growth of a diamond film on the modified surface of the heat sink, and coating the thusly processed surface of the heat sink with a diamond film. Preferably, a process for etching of a tungsten grain precedes selective dissolution of the copper.
    Type: Application
    Filed: July 19, 1999
    Publication date: June 14, 2001
    Inventors: MYOUNG KI YOO, YOUNG-JOON BAIK, KYUNG TAE HONG
  • Patent number: 6049127
    Abstract: A method for fabricating a hermetically sealed tungsten-copper package container for a microwave device is provided with the steps of forming an injection feedstock by mixing a polymer binder with a tungsten powder having a particle diameter of 2 to 5 .mu.m and a purity 99.9 of weight percent, forming a three-dimensional part by applying a powder injection molding to the feedstock, obtaining a tungsten skeleton structure by eliminating the binder from the injection molded part, and carrying out a copper infiltration to a copper plate placed on the tungsten skeleton structure for two hours under a hydrogen atmosphere at a temperature of 1250.degree. C. The method incorporates an improved heat sink characteristic, a thermal expansion coefficient similar to that of GaAs, and a capability of applying thereto a strip wire connection, without an extra machining process.
    Type: Grant
    Filed: June 12, 1998
    Date of Patent: April 11, 2000
    Assignee: Korea Institute of Science and Technology
    Inventors: Myoung Ki Yoo, Jong Ku Park, Kyung Tae Hong, Young Do Kim, Seung Ick Lee, Seung Woo Lee, Ju Choi
  • Patent number: 5963773
    Abstract: A tungsten skeleton structure fabrication method employed in an application of a copper infiltration and tungsten-copper composite fabrication method includes the steps of forming a source powder by coating the tungsten powder surface having a purity of 99.9 weight percent and 2.about.5 .mu.m in size, with nickel by less than 0.06 weight percent (600 ppm), forming an injection molded admixture by admixing a source powder and a polymer binder, carrying out a powder injection molded with regard to the admixture, and obtaining a tungsten skeleton structure by removing the polymer binder from the resultant injection molded body. The method prevents the molded body from being unevenly shrunken during a liquid phase sintering for thereby decreasing its production cost.
    Type: Grant
    Filed: June 12, 1998
    Date of Patent: October 5, 1999
    Assignee: Korea Institute of Science and Technology
    Inventors: Myoung Ki Yoo, Jong Ku Park, Kyung Tae Hong, Ju Choi
  • Patent number: 5887241
    Abstract: A method for shaping a consolidated, substantially oxygen-free, equiaxed MoSi.sub.2 /SiC composite body having an average grain size of 10 .mu.m or less, a SiC content of 2 to 60 v/o and relatively low strength and relatively high ductility comprising subjecting the composite body to plastic deformation under conditions of forming temperature and rate of deformation such that grain growth is substantially avoided, the MoSi.sub.2 /SiC composite body being obtained by providing particles of molybdenum, silicon and carbon in a proportion relative to each other required to produce a composite powder of MoSi.sub.2 and SiC having a composition in that segment of the ternary diagram of FIG. 1 designated A, and subjecting the particles to mechanical alloying under conditions and for a time sufficient to produce the composite powder, followed by consolidation of the composite powder.
    Type: Grant
    Filed: December 11, 1996
    Date of Patent: March 23, 1999
    Assignee: University of Florida
    Inventors: S. Jayashankar, Kyung-Tae Hong, Michael J. Kaufman