Abstract: A substrate processing apparatus includes a photoresist coater applying a photoresist film on a substrate, a humidifier increasing an amount of moisture in an ambient to which the photoresist film on the substrate is exposed, and an exposer irradiating the photoresist film exposed to the ambient having the increased amount of moisture with light. The humidifier is disposed between the photoresist coater and the exposer.

Abstract: A three dimensional composite circuit board includes a first, second, and third circuit boards and a molding material. The first, second and third circuit board have a plurality of plates which are each folded in order to form a separate cubic shape. The second circuit board has a volume smaller than a volume of the first circuit board so as to be accommodated in the first circuit board, and is coupled to the first circuit board. The third circuit board has a volume smaller than the volume of the second circuit board so as to be accommodated in the second circuit board, and is coupled to the second circuit board. The molding material coats electronic elements which are mounted in the first, second and third circuit boards and brazing portions of the electronic elements to shield the electromagnetic waves generated by the electronic elements.