Abstract: The present disclosure has the following configurations. The present disclosure relates to a unit bracket in a square shape, in which outer surfaces of four surfaces of the unit bracket are formed with locking projections configured to insert a metal or plastic panel, and a center portion of the unit bracket is formed with a mesh part to be formed such that the bonding is possible at a vertical tensile strength and a horizontal tensile strength having desired forces even if the unit bracket and a wall or a base material are bonded with an adhesive, in order to bond the unit bracket to the wall or the base material.

Abstract: Disclosed is a method for manufacturing an FCCL capable of controlling flexibility and stiffness of a conductive pattern. The method for manufacturing an FCCL (Flexible Copper Clad Laminate) includes: an electroforming step of forming a conductive pattern on a mold for electroforming through electroforming; and a transfer step of transferring the conductive pattern from the mold for electroforming to the bottom of a polymer plastic film, wherein the electroforming process is performed in a plating bath equipped with a first metal, a second metal and a third metal, wherein the first metal is copper (Cu), the second metal serves to add flexibility and is one of tin (Sn), gold (Au), silver (Ag) and aluminum (Al), and the third metal serves to add stiffness and is one of nickel (Ni), cobalt (Co), chrome (Cr), iron (Fe), tungsten (W) and titanium (Ti).

Abstract: The present invention has the following features. The present invention relates to a flammable flame-proof material provided with a metal material, comprising a metal material and a non-flame-proof-treated thin film sheet on the top of the metal material, wherein an adhesive agent is between the metal material and the non-flame-proof-treated thin film sheet, and relates to an attachment structure for attaching a metal plate with a flammable thin-film construction interior material.

Abstract: The present invention is configured as follows. The present invention relates to a system wall characterized by comprising: a bracket attached to a wall part; a support attached to the bracket; a hole-processed metal panel corresponding to the support; and a decorative part inserted into the support protruding from the hole-processed metal panel.

Abstract: The present invention has the following configuration. The present invention relates to a wirable bracket attached to a wall body, the bracket being characterized by comprising: a rib which is bound to an upper portion of the bracket by inserting a metal panel; and a wiring part inserted into a hollow space section formed in the rib.

Abstract: The present disclosure has the following configurations. The present disclosure relates to a unit bracket in a square shape, in which outer surfaces of four surfaces of the unit bracket are formed with locking projections configured to insert a metal or plastic panel, and a center portion of the unit bracket is formed with a mesh part to be formed such that the bonding is possible at a vertical tensile strength and a horizontal tensile strength having desired forces even if the unit bracket and a wall or a base material are bonded with an adhesive, in order to bond the unit bracket to the wall or the base material.

Abstract: The present disclosure relates to interior material attachment structure with wall attachment part bolt grooves, including: binding protrusions formed at the outermost part of the interior material attachment structure in order to attach the metal interior material; and connection part grooves formed adjacent to the binding protrusions in order to connect the plurality of interior material attachment structures to each other.

Abstract: The present invention relates to a circuit board including: a base board having a circuit region and a terminal region; a circuit pattern formed on an upper portion of the base board; and a low-melting-metal layer formed on an upper portion of the circuit pattern. A circuit board capable of reducing manufacturing time and manufacturing costs may be manufactured by omitting a photoresist process.

Abstract: Disclosed is a circuit pattern continuous manufacturing device capable of quickly manufacturing a circuit pattern having a sufficient thickness. The circuit pattern continuous manufacturing device may include: an unwinder configured to unwind a transfer film to be horizontally unfolded; a rotary drum-type continuous electroforming part configured to form a circuit pattern having a first metal layer on the surface of a rotating cathode drum through electroforming; a continuous transfer part configured to transfer the circuit pattern, formed on the surface of the cathode drum of the rotary drum-type continuous electroforming part, onto the transfer film; a first horizontal plating path configured to additionally plate the circuit pattern, transferred onto the transfer film, with a second metal layer made of the same metal as the rotary drum-type continuous electroforming part; and a rewinder configured to rewind the transfer film.

Abstract: Disclosed is a method for manufacturing an FCCL capable of controlling flexibility and stiffness of a conductive pattern. The method for manufacturing an FCCL (Flexible Copper Clad Laminate) includes: an electroforming step of forming a conductive pattern on a mold for electroforming through electroforming; and a transfer step of transferring the conductive pattern from the mold for electroforming to the bottom of a polymer plastic film, wherein the electroforming process is performed in a plating bath equipped with a first metal, a second metal and a third metal, wherein the first metal is copper (Cu), the second metal serves to add flexibility and is one of tin (Sn), gold (Au), silver (Ag) and aluminum (Al), and the third metal serves to add stiffness and is one of nickel (Ni), cobalt (Co), chrome (Cr), iron (Fe), tungsten (W) and titanium (Ti).

Abstract: The present disclosure relates to interior material attachment structure with wall attachment part bolt grooves, including: binding protrusions formed at the outermost part of the interior material attachment structure in order to attach the metal interior material; and connection part grooves formed adjacent to the binding protrusions in order to connect the plurality of interior material attachment structures to each other.

Abstract: The present invention relates to a circuit board including: a base board having a circuit region and a terminal region; a circuit pattern formed on an upper portion of the base board; and a low-melting-metal layer formed on an upper portion of the circuit pattern. A circuit board capable of reducing manufacturing time and manufacturing costs may be manufactured by omitting a photoresist process.

Abstract: According to an embodiment of the present invention, a method for producing a duplicate of a nano-pattern texture of a surface of an object through electroforming using an imprint mold comprises selecting the object having the nano-pattern texture, disposing the selected object and pretreating a surface of the object by washing, drying and then forming a nano-thin film thereto to block transfer of impurities, metallizing a surface of the plastic mold through, e.g., vapor deposition, spraying, and wet silver mirror reaction, and performing a first electroforming of the surface of the plastic mold, and repeating to thus manufacture a plurality of metal module master molds.

Abstract: A silicon solar cell is provided, including a first silicon layer that absorbing sunlight, a first layer of a structure of photonic crystals formed on the first silicon layer, and a second silicon layer formed on the first layer of a structure of photonic crystals and absorbing sunlight, wherein the first silicon layer and the second silicon layer absorb sunlight at different wavelengths and the first layer of structure of photonic crystals selectively reflects light of a wavelength absorbed by the second silicon layer.

Abstract: A method of duplicating the nano-pattern of the surface of an object is disclosed A method of duplicating the nano-pattern of the surface of an object comprises: selecting the object having the nano-pattern texture to be duplicated; disposing the selected object and pretreating a surface of the object by washing, drying and then forming a nano-thin film thereto to block transfer of impurities so as to facilitate separation of a nano-imprint mold; nano-imprinting the surface of the object, thus duplicating it on a plastic mold; metallizing a surface of the plastic mold and performing first electroforming of the plastic mold, thus manufacturing metal module master molds; preparing a standard pattern by scanning the surface of the object to achieve an two-dimensional image and three-dimensional depth information and determine a part of a scanned image of the surface of the object as the standard pattern; connecting the metal module master molds to each other through welding thus producing a large-area metal m

Abstract: Disclosed is a method of duplicating a nano-pattern texture of the surface of an object through electroforming using an imprint mold, including selecting the object having the surface texture to be duplicated; disposing the selected object and pre-treating the surface thereof; nano-imprinting the surface of the pretreated object, thus duplicating it on a plastic mold; metallizing the surface of the plastic mold through vapor deposition, and performing electroforming, thus manufacturing metal module master molds; trimming the edges of the metal module master molds, performing micro-processing, connecting the metal module master molds, and then performing electroforming, thus manufacturing a large-area metal unit master mold; and electroforming the metal unit master mold, thus producing a duplicate having the surface texture, thus exhibiting an effect in which the skin of a selected natural object can be duplicated on metal having a uniform thickness.

Abstract: Provided are a structure color of photonic crystals in which a new structure of a structure color of photonic crystals is provided so that a nanoimprint process can be performed and mass productivity is improved, a method of manufacturing thereof, and a manufacturing apparatus thereof. The method of manufacturing a structure color of photonic crystals includes: forming a plurality of basic element layers by using nanoimprinting, the plurality of basic element layers comprising a plurality of basic unit bodies each having a symmetrical cross-section and thin film connecting portions connecting the basic unit bodies! sequentially stacking the basic element layers! removing the thin film connecting portions by using etching; and determining whether the structure color of photonic crystals is completed, wherein, when it is determined that the structure color of photonic crystals is not completed, the forming, the stacking, and the removing are repeatedly performed.

Abstract: A silicon solar cell is provided, including a first silicon layer that absorbing sunlight, a first layer of a structure of photonic crystals formed on the first silicon layer, and a second silicon layer formed on the first layer of a structure of photonic crystals and absorbing sunlight, wherein the first silicon layer and the second silicon layer absorb sunlight at different wavelengths and the first layer of structure of photonic crystals selectively reflects light of a wavelength absorbed by the second silicon layer.