Patents by Inventor Kyung Yun Choi

Kyung Yun Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240196661
    Abstract: An object of the present disclosure is to implement a coloring pattern with a high optical density on an electrode substrate to improve display reliability and lifetime as well as vivid colors as a display with high resolution. That is, the pixel having a size within the range according to the present disclosure can implement high resolution of a Black PDL and can manufacture a display with high luminance and long lifetime according to driving voltage and current.
    Type: Application
    Filed: October 16, 2023
    Publication date: June 13, 2024
    Applicant: DUK SAN NEOLUX CO., LTD.
    Inventors: Ju Cheol KWON, Changmin LEE, Yeon Soo LEE, Jun BAE, Hye Jung CHOI, Hak Young LEE, Soung Yun MUN, Kyung Soo KIM
  • Publication number: 20240196635
    Abstract: A sensor-embedded display panel includes a light emitting element and a sensor which include separate portions of a first common auxiliary layer including a hole transport material and a second common auxiliary layer including an electron transport material. The sensor includes first and second semiconductor layers proximate to the first and second common auxiliary layers, respectively, and including a p-type semiconductor and a non-fullerene n-type semiconductor having a LUMO energy level deeper than that of the electron transport material, respectively. An insertion layer between the second semiconductor layer and the second common auxiliary layer includes a metal, a metal compound, or any combination thereof. A work function of the metal or a LUMO energy level of the metal compound is deeper or shallower than the LUMO energy level of the non-fullerene n-type semiconductor and the LUMO energy level of the electron transport material within less than about 1.3 eV, respectively.
    Type: Application
    Filed: September 1, 2023
    Publication date: June 13, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Feifei FANG, Sungyoung YUN, Chul Joon HEO, Hyeong-Ju KIM, Kyung Bae PARK, Hwijoung SEO, Tae Jin CHOI
  • Publication number: 20240186555
    Abstract: An embodiment fuel cell including a high temperature polymer electrolyte membrane includes an electrolyte membrane including a phosphoric acid-doped polymer of intrinsic microporosity, a cathode disposed on a first surface of the electrolyte membrane, and an anode disposed on a second surface of the electrolyte membrane, the second surface opposite the first surface.
    Type: Application
    Filed: April 12, 2023
    Publication date: June 6, 2024
    Inventors: Da Hee Kwak, Won Jae Choi, Songi Oh, Hyoun Myung Park, Sung Hee Shin, Jee Youn Hwang, Ah Hyeon Park, Kyung Su Kim, Ji Yun Kim, Seong Min Cho, Chang Sik Song
  • Publication number: 20240179943
    Abstract: An object of the present disclosure is to implement a coloring pattern with a high optical density on an electrode substrate to improve display reliability and lifetime of a display as well as vivid colors. That is, the present disclosure relates to a composition and a method that can form the pattern of a pixel defining layer that can improve visibility and contrast by satisfying the optical density of 0.80/?m to 1.5/?m in the panel after post-baking treatment.
    Type: Application
    Filed: October 31, 2023
    Publication date: May 30, 2024
    Applicant: DUK SAN NEOLUX CO., LTD.
    Inventors: Hye Jung CHOI, Jaehyun LIM, Changmin LEE, Jun BAE, Yeon Soo LEE, Soung Yun MUN, Kyung Soo KIM
  • Publication number: 20240159587
    Abstract: A sensor may include a reflective electrode, a photoelectric conversion layer on the reflective electrode and including one or more photoelectric conversion materials, a semi-transmissive electrode on the photoelectric conversion layer, a light transmitting buffer layer on the semi-transmissive electrode, and a semi-transmissive auxiliary layer on the light transmitting buffer layer.
    Type: Application
    Filed: August 25, 2023
    Publication date: May 16, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Chul Joon HEO, Hwijoung SEO, Sungyoung YUN, Hyeong-Ju KIM, Kyung Bae PARK, Feifei FANG, Younhee LIM, Tae Jin CHOI
  • Patent number: 11974930
    Abstract: A system and method for a compliant four-bar linkage mechanism for a robotic finger that includes: a monolithic bone structure comprised of a compliant joint region and an input link segment and a coupler link segment, wherein the input link segment and the coupler link segment are connected through the compliant joint; an output link; a ground structure; wherein the monolithic bone structure, output link, and ground structure are connected through a set of joints in a configuration of a compliant four-bar linkage mechanism which comprises: the output link on a first end and the coupler link segment connected through an output joint, the output link on a second end connected to a ground joint on the ground structure, and the monolithic bone structure connected to an input joint connected to the ground structure; and an actuation input coupled to the input joint.
    Type: Grant
    Filed: October 27, 2021
    Date of Patent: May 7, 2024
    Assignee: PSYONIC, Inc.
    Inventors: Aadeel Akhtar, Timothy Bretl, Kyung Yun Choi
  • Patent number: 11961775
    Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.
    Type: Grant
    Filed: November 8, 2022
    Date of Patent: April 16, 2024
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Gyu Wan Han, Won Bae Bang, Ju Hyung Lee, Min Hwa Chang, Dong Joo Park, Jin Young Khim, Jae Yun Kim, Se Hwan Hong, Seung Jae Yu, Shaun Bowers, Gi Tae Lim, Byoung Woo Cho, Myung Jea Choi, Seul Bee Lee, Sang Goo Kang, Kyung Rok Park
  • Publication number: 20220183862
    Abstract: A system and method for a compliant four-bar linkage mechanism for a robotic finger that includes: a monolithic bone structure comprised of a compliant joint region and an input link segment and a coupler link segment, wherein the input link segment and the coupler link segment are connected through the compliant joint; an output link; a ground structure; wherein the monolithic bone structure, output link, and ground structure are connected through a set of joints in a configuration of a compliant four-bar linkage mechanism which comprises: the output link on a first end and the coupler link segment connected through an output joint, the output link on a second end connected to a ground joint on the ground structure, and the monolithic bone structure connected to an input joint connected to the ground structure; and an actuation input coupled to the input joint.
    Type: Application
    Filed: October 27, 2021
    Publication date: June 16, 2022
    Inventors: Aadeel Akhtar, Timothy Bretl, Kyung Yun Choi
  • Patent number: 11185427
    Abstract: A system and method for a compliant four-bar linkage mechanism for a robotic finger that includes: a monolithic bone structure comprised of a compliant joint region and an input link segment and a coupler link segment, wherein the input link segment and the coupler link segment are connected through the compliant joint; an output link; a ground structure; wherein the monolithic bone structure, output link, and ground structure are connected through a set of joints in a configuration of a compliant four-bar linkage mechanism which comprises: the output link on a first end and the coupler link segment connected through an output joint, the output link on a second end connected to a ground joint on the ground structure, and the monolithic bone structure connected to an input joint connected to the ground structure; and an actuation input coupled to the input joint.
    Type: Grant
    Filed: April 29, 2019
    Date of Patent: November 30, 2021
    Assignee: Psyonic, Inc.
    Inventors: Aadeel Akhtar, Timothy Bretl, Kyung Yun Choi