Patents by Inventor KyungEun Kim

KyungEun Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200395870
    Abstract: A triboelectric generator includes a first electrode and a second electrode spaced apart from each other, a first charging part on the first electrode, a second charging part on the second electrode, and a grounding unit. The first charging part and the second charging part may be configured to contact each other through a sliding motion. The grounding unit may be configured to intermittently connect a charge reservoir to the second charging part. The grounding unit may be configured to vary the electric potential of the second charging part so as to amplify current flowing between electrodes of the triboelectric generator.
    Type: Application
    Filed: August 31, 2020
    Publication date: December 17, 2020
    Applicants: Samsung Electronics Co., Ltd., UNIST (ULSAN NATIONAL INSTITUTE OF SCIENCE AND TECHNOLOGY)
    Inventors: Kyungeun BYUN, Jaeyoung KIM, Minsu SEOL, Hyeonjin SHIN, Jeongmin BAIK, Woojung YANG, Byeonguk YE, Jaewon LEE, Jinpyo LEE, Kyeongnam KIM
  • Patent number: 10770990
    Abstract: A triboelectric generator includes a first electrode and a second electrode spaced apart from each other, a first charging part on the first electrode, a second charging part on the second electrode, and a grounding unit. The first charging part and the second charging part may be configured to contact each other through a sliding motion. The grounding unit may be configured to intermittently connect a charge reservoir to the second charging part. The grounding unit may be configured to vary the electric potential of the second charging part so as to amplify current flowing between electrodes of the triboelectric generator.
    Type: Grant
    Filed: May 8, 2017
    Date of Patent: September 8, 2020
    Assignees: Samsung Electronics Co., Ltd., UNIST (Ulsan National Institute of Science and Technology)
    Inventors: Kyungeun Byun, Jaeyoung Kim, Minsu Seol, Hyeonjin Shin, Jeongmin Baik, Woojung Yang, Byeonguk Ye, Jaewon Lee, Jinpyo Lee, Kyeongnam Kim
  • Publication number: 20190367677
    Abstract: An embodiment can provide a polyamide-imide film and a method for producing same, the film comprising a polyamide-imide polymer formed by polymerizing an aromatic diamine compound, an aromatic dianhydride compound and a dicarbonyl compound, wherein, in an XRD graph with a section in which 2?=8° to 32° as a baseline, the film shows a peak area of 50% or above around 2?=23° with respect to a peak area seen around 2?=15°.
    Type: Application
    Filed: February 6, 2018
    Publication date: December 5, 2019
    Inventors: Dae Seong OH, Dawoo JEONG, Sunhwan KIM, Jin Woo LEE, Dong Jin LIM, Kyungeun OH
  • Publication number: 20190161351
    Abstract: Provided are nanocrystalline graphene and a method of forming the nanocrystalline graphene through a plasma enhanced chemical vapor deposition process. The nanocrystalline graphene may have a ratio of carbon having an sp2 bonding structure to total carbon within the range of about 50% to 99%. In addition, the nanocrystalline graphene may include crystals having a size of about 0.5 nm to about 100 nm.
    Type: Application
    Filed: November 7, 2018
    Publication date: May 30, 2019
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Hyunjae SONG, Keunwook SHIN, Hyeonjin SHIN, Changseok LEE, Changhyun KIM, Kyungeun BYUN, Seungwon LEE, Eunkyu LEE
  • Patent number: 8710640
    Abstract: A method of manufacture of an integrated circuit packaging system includes: mounting an integrated circuit over a package carrier; mounting a conductive connector over the package carrier; forming an encapsulation over the integrated circuit, the encapsulation having a recess exposing the conductive connector; and mounting a heat slug over the encapsulation, the heat slug having an opening with an opening width greater than a recess width of the recess, the opening exposing a portion of a top surface of the encapsulation.
    Type: Grant
    Filed: December 14, 2011
    Date of Patent: April 29, 2014
    Assignee: Stats ChipPac Ltd.
    Inventors: DaeSik Choi, JoungIn Yang, MinJung Kim, KyungEun Kim
  • Publication number: 20130154078
    Abstract: A method of manufacture of an integrated circuit packaging system includes: mounting an integrated circuit over a package carrier; mounting a conductive connector over the package carrier; forming an encapsulation over the integrated circuit, the encapsulation having a recess exposing the conductive connector; and mounting a heat slug over the encapsulation, the heat slug having an opening with an opening width greater than a recess width of the recess, the opening exposing a portion of a top surface of the encapsulation.
    Type: Application
    Filed: December 14, 2011
    Publication date: June 20, 2013
    Inventors: DaeSik Choi, JoungIn Yang, MinJung Kim, KyungEun Kim
  • Publication number: 20130113118
    Abstract: A semiconductor device has a semiconductor die with bumps formed over a surface of the semiconductor die. A conductive layer is formed over a substrate. A patterning layer is formed over the substrate and conductive layer. A masking layer having an opaque portion and linear gradient contrast portion is formed over the patterning layer. The linear gradient contrast portion transitions from near transparent to near opaque. The patterning layer is exposed to ultraviolet light through the masking layer. The masking layer is removed and a portion of the patterning layer is removed to form an opening having a sloped surface to expose the conductive layer. The sloped surface in patterning layer can be formed by laser direct ablation. The semiconductor die is mounted to the substrate with the bumps electrically connected to the conductive layer and physically separated from the patterning layer.
    Type: Application
    Filed: November 4, 2011
    Publication date: May 9, 2013
    Applicant: STATS CHIPPAC, LTD.
    Inventors: MinJung Kim, JoungIn Yang, DaeSik Choi, KyungEun Kim