Abstract: A semiconductor device comprises: a substrate having a set of conductive patterns; a semiconductor die mounted on the substrate, wherein the semiconductor die has on its top surface a set of bonding pads; and a conductive bar assembly for electrically connecting the set of conductive patterns of the substrate with the set of bonding pads of the semiconductor die, wherein the conductive bar assembly comprises: an insulating body; and a set of conductive bars extending within the insulating body, wherein the set of conductive bars have a set of first ends exposed from a first surface of the insulating body to be electrically connected to the set of conductive patterns of the substrate and a set of second ends exposed from a second surface of the insulating body to be electrically connected to the set of bonding pads of the semiconductor die.

Abstract: According to embodiments, a method for manufacturing an optical module may include: applying a polyamic acid solution to an upper surface of a substrate structure to form an adhesive layer; forming an active functional group on an upper surface of the adhesive layer; applying a polyamic acid solution to a first surface of a prism to form a prism adhesive layer; forming a polyamic acid layer on at least one of a planarized upper surface of the adhesive layer and a lower surface of the prism adhesive layer; disposing the prism on the substrate structure such that the polyamic acid layer contacts the adhesive layer and the prism adhesive layer; and applying pressure to the prism and the substrate structure to bond the adhesive layer to the prism adhesive layer.

Abstract: Provided is a heat spreader assembly comprising: a pair of locking bars mounted on a substrate of a semiconductor device and at two opposite sides of at least one semiconductor die, wherein each of the pair of locking bars comprises a plurality of locking hooks disposed along the locking bar and defines a slot; and a heat spreader comprising: a heat spreader body comprising a top portion and a pair of lateral portions, the heat spreader body defining a space for receiving the at least one semiconductor die; and a pair of protrusion ribs extending in opposite directions from the pair of lateral portions, respectively, wherein the pair of protrusion ribs is configured to slide past the locking hooks of the pair of locking bars and be engaged within the slots to prevent the heat spreader from moving away from the substrate of the semiconductor device.

Abstract: A modular semiconductor device comprises: an encapsulant layer with an encapsulant bottom surface and an encapsulant top surface, wherein the encapsulant layer comprises a component region and an interlayer connection region; wherein the semiconductor component comprises a component conductive pattern exposed from the encapsulant bottom surface; an interlayer connection array disposed within the interlayer connection region, wherein the interlayer connection array comprises one or more conductive vias each extending between the encapsulant bottom surface and the encapsulant top surface; and an interposer layer laminated on the encapsulant layer and having an interposer bottom surface and an interposer top surface, wherein the interposer top surface is in contact with the encapsulant bottom surface; wherein the interposer layer comprises an interposer conductive pattern on the interposer bottom surface, and an interposer interconnection structure electrically coupled to the component conductive pattern, the in

Abstract: Provided is a heat spreader for use with a semiconductor device comprising a substrate and at least one semiconductor die mounted on the substrate. The heat spreader comprises: a main body defining a space for receiving the at least one semiconductor die; and two foot supports extending downward from the main body and opposite to each other, each of the foot supports defining a slot at its inner surface, wherein the slots of the two foot supports are aligned with each other. When the heat spreader is mounted with the semiconductor device, the slots prevent the substrate from moving closer to or away from the main body.

Abstract: A heat spreader can be used with a semiconductor component. The heat spreader includes: a body having a bottom surface to be in thermal contact with the semiconductor component, and a top surface opposite to the bottom surface; a plurality of holes disposed at a non-peripheral region of the body, wherein each hole passes through the body between the top surface and the bottom surface; and a plurality of extensions each being disposed within one of the plurality of holes and extending from the top surface and downward below the bottom surface, wherein the plurality of extensions are configured to hold the semiconductor component when the heat spreader is mounted with the semiconductor component.

Abstract: According to embodiments, a method for manufacturing an optical module may include: applying a polyamic acid solution to an upper surface of a substrate structure to form an adhesive layer; forming an active functional group on an upper surface of the adhesive layer; applying a polyamic acid solution to a first surface of a prism to form a prism adhesive layer; forming a polyamic acid layer on at least one of a planarized upper surface of the adhesive layer and a lower surface of the prism adhesive layer; disposing the prism on the substrate structure such that the polyamic acid layer contacts the adhesive layer and the prism adhesive layer; and applying pressure to the prism and the substrate structure to bond the adhesive layer to the prism adhesive layer.

Abstract: According to embodiments, a method for manufacturing an optical module may include: applying a polyamic acid solution to an upper surface of a substrate structure to form an adhesive layer; forming an active functional group on an upper surface of the adhesive layer; applying a polyamic acid solution to a first surface of a prism to form a prism adhesive layer; forming a polyamic acid layer on at least one of a planarized upper surface of the adhesive layer and a lower surface of the prism adhesive layer; disposing the prism on the substrate structure such that the polyamic acid layer contacts the adhesive layer and the prism adhesive layer; and applying pressure to the prism and the substrate structure to bond the adhesive layer to the prism adhesive layer.

Abstract: The present invention includes a substrate, an optical waveguide on the substrate, a light source configured to provide light into the optical waveguide, and a prism between the light source and the optical waveguide. The light source includes a lens.

Abstract: According to embodiments, a method for manufacturing an optical module may include: applying a polyamic acid solution to an upper surface of a substrate structure to form an adhesive layer; forming an active functional group on an upper surface of the adhesive layer; applying a polyamic acid solution to a first surface of a prism to form a prism adhesive layer; forming a polyamic acid layer on at least one of a planarized upper surface of the adhesive layer and a lower surface of the prism adhesive layer; disposing the prism on the substrate structure such that the polyamic acid layer contacts the adhesive layer and the prism adhesive layer; and applying pressure to the prism and the substrate structure to bond the adhesive layer to the prism adhesive layer.

Abstract: The present invention includes a substrate, an optical waveguide on the substrate, a light source configured to provide light into the optical waveguide, and a prism between the light source and the optical waveguide. The light source includes a lens.

Abstract: A method of manufacture of an integrated circuit packaging system includes: mounting an integrated circuit over a package carrier; mounting a conductive connector over the package carrier; forming an encapsulation over the integrated circuit, the encapsulation having a recess exposing the conductive connector; and mounting a heat slug over the encapsulation, the heat slug having an opening with an opening width greater than a recess width of the recess, the opening exposing a portion of a top surface of the encapsulation.

Abstract: A method of manufacture of an integrated circuit packaging system includes: mounting an integrated circuit over a package carrier; mounting a conductive connector over the package carrier; forming an encapsulation over the integrated circuit, the encapsulation having a recess exposing the conductive connector; and mounting a heat slug over the encapsulation, the heat slug having an opening with an opening width greater than a recess width of the recess, the opening exposing a portion of a top surface of the encapsulation.

Abstract: A semiconductor device has a semiconductor die with bumps formed over a surface of the semiconductor die. A conductive layer is formed over a substrate. A patterning layer is formed over the substrate and conductive layer. A masking layer having an opaque portion and linear gradient contrast portion is formed over the patterning layer. The linear gradient contrast portion transitions from near transparent to near opaque. The patterning layer is exposed to ultraviolet light through the masking layer. The masking layer is removed and a portion of the patterning layer is removed to form an opening having a sloped surface to expose the conductive layer. The sloped surface in patterning layer can be formed by laser direct ablation. The semiconductor die is mounted to the substrate with the bumps electrically connected to the conductive layer and physically separated from the patterning layer.