Abstract: A display device is provided. A display device includes a display panel including a plurality of connecting signal wires which supply different control voltages; a flexible printed circuit board attached to a side surface of the display panel and including a base film and a plurality of lead wires which are disposed on the base film; an anisotropic conductive film disposed between the plurality of connecting signal wires and the plurality of lead wires, and at least one bump wire disposed between adjacent connecting signal wires, the at least one bump wire being not supplied with the different control voltages controlling the display panel.

Abstract: A display device is provided. A display device includes a display panel including a plurality of connecting signal wires which supply different control voltages; a flexible printed circuit board attached to a side surface of the display panel and including a base film and a plurality of lead wires which are disposed on the base film; an anisotropic conductive film disposed between the plurality of connecting signal wires and the plurality of lead wires, and at least one bump wire disposed between adjacent connecting signal wires, the at least one bump wire being not supplied with the different control voltages controlling the display panel.

Abstract: A thermal print head and method of creating the same, in which a metal film and a cooling compound are inserted between a resistance substrate and a cooling board. This construction can prevent the formation of air bubbles in the cooling compound between the resistance substrate and the cooling compound. This construction can also reduce local heat accumulation and thereby reduce uneven priming contrast since even if an air bubble is formed it will have a thickness less than the thickness of a double-sided tape that acts as an adhesive between the resistance substrate and the cooling board. In addition, a clearer image can be obtained even in the hi-speed priming because the metal film having a thermal conductivity higher than that of the cooling compound is inserted inside the cooling compound. This increases the overall thermal conductivity between the resistance substrate and the cooling board and thus improves heat dissipation within the system.