Patents by Inventor Kyung Heum Kim

Kyung Heum Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250029747
    Abstract: A conductive particle to be dispersed in a resin composition of an anisotropic connection material containing binder resin and solvent, the conductive particle includes: a core, a conductive layer provided on the core and containing metal, insulating fine particles connected by a first substituent that binds to the metal of the conductive layer, provided on a first region of the conductive layer, and a hydrophobic surface treatment layer connected by a second substituent that binds to the metal of the conductive layer, provided on a second region of the conductive layer, wherein the first region and the second region do not overlap.
    Type: Application
    Filed: July 19, 2024
    Publication date: January 23, 2025
    Inventors: Yeong Jin LIM, Kyung Heum KIM, Chang Wan BAE, Hyeon Yun JEONG, Seok Won JEONG, Hyun Sang CHO, Kyung Soo KIM
  • Publication number: 20080206567
    Abstract: Plastic conductive particles having an outer diameter of 2.5 ?m˜1 mm obtained by sequentially plating a 0.1˜10 ?m thick metal plating layer and a 1˜100 ?m thick Pb solder layer or a Pb-free solder layer on plastic core beads having a high elastic modulus of compression, and a method of manufacturing thereof.
    Type: Application
    Filed: December 28, 2005
    Publication date: August 28, 2008
    Applicant: Dongbu Hitek Co., Ltd.
    Inventors: Byung Hoon Min, Kyung Heum Kim, Seung Bum Kim, Sung Soo Lee, Kyoung Bae Park, Nam Gyol Kim, Byoung Jae Yoo