Abstract: In a rechargeable battery, a case is combined with an upper surface of a bare cell by being fixed to a lead plate electrically coupling a protection circuit board of a protection circuit module to the bare cell. Alternatively, the case is combined with the bare cell by being fixed to the protection circuit board so as not to be separated from the bare cell, thereby improving the reliability of the products.

Abstract: A battery pack to improve assembling reliability in a battery with a cover frame. The battery pack according to the present invention includes a rechargeable battery having at least one rounded lateral side; a cover frame including a frame surrounding each of lateral sides of the rechargeable battery, wherein more than at least one groove is formed at both ends of the frame covering the rounded lateral side of the rechargeable battery. Therefore, it is possible to couple the cover frame to the rechargeable battery via the groove without deforming the cover frame. Also, the rounded battery and the rounded cover frame closing each other is an effect that assembly error of a battery to cover frame can be reduced.

Abstract: A secondary battery having a hard case that is integrally formed to be able to reduce the number of parts and the fabrication process. The secondary battery includes at least one bare cell, a circuit part electrically coupled to the at least one bare cell and a case covering the circuit part coupled to the at least one bare cell, wherein the case includes a main case arranged on a first surface of the at least one bare cell and at least one sub case arranged on at least one different surface of the at least one bare cell that is adjacent to the first surface of the at least one bare cell, each of the at least one sub case being integral to the main case.

Abstract: A battery pack increases coupled strength of a protection circuit module and an outer case, and realize a compact battery pack by physically coupling the protection circuit module coupled to a bare cell and the integral outer case by an adherent member. The battery pack includes a bare cell; a circuit module arranged on an upper surface of the bare cell and electrically coupled to the bare cell; an outer case integrally formed so as to cover a pair of short side surfaces and the upper surface of the bare cell including the circuit module, and coupled to the circuit module; and a label attached to the pair of the short side surfaces, a pair of long side surfaces and a lower surface of the bare cell. At least one protrusion part may be integrally formed an outer side surface of said circuit module. At least one tapered part may be integrally formed with said outer case.

Abstract: The present invention relates to a rechargeable battery, particularly a rechargeable battery having a bare cell, a protective circuit board, a lead plate, and a flat plate attached to a cap plate of the bare cell for connecting the lead plate to the cap plate. According to the invention, the lead plate is not directly combined with the cap plate, in which the cap plate is made of material differently from the lead plate, and the lead plate and cap plate are respectively welded to the metal layer made of the same material by means of the flat plate formed of metal, thereby allowing them to be easily combined with each other and the adhesive force to be enhanced.

Abstract: A contact is disposed to come into contact with a metal layer formed on a substrate being treated, the contact being in contact with a surface being treated from an opposite surface through a through hole present in a substrate. Alternatively, a contact is disposed to come into contact with a metal layer formed on a substrate, the contact coming into contact at an approximate center of the substrate. Alternatively, a plurality of needle bodies are disposed to be in electrical contact with a metal layer of a substrate being treated, thereby power supply for electrolytic polishing/plating to a substrate being treated being implemented, without restricting to a periphery of a substrate, from a plurality of points on a surface thereof. Due to any one of these, liquid treatment equipment enables to improve uniformity in plane of an electric current sent to a surface being treated and of liquid treatment.

Abstract: Providing liquid treatment equipment capable of largely reducing a frequency of discarding a treatment solution as a whole and capable of implementing smooth and high quality liquid treatment with less manufacturing burden. Equipment comprises a treatment solution bath capable of accommodating a treatment solution for implementing liquid treatment to a substrate to treat, a treatment solution circulating system circulating the accommodated treatment solution between the outside of the treatment solution bath, and a product removal unit removing a reaction product due to the liquid treatment contained in the circulated treatment solution. By circulating the accommodated treatment solution between the outside of the treatment solution bath, reaction products contained in the circulated treatment solution are removed by means of the product removal unit.

Abstract: Liquid treatment units are disposed in multi-tiers surrounding a main-arm 35. Among liquid treatment units, plating units M1 through M4 are disposed on a lower tier side, and a unit for post-treatment process such as a cleaning unit 70 where a cleaner atmosphere is necessary is disposed on an upper tier side. Thereby, an improvement in an area efficiency and the formation and maintenance of a clean atmosphere can be simultaneously obtained.

Abstract: The object of the present invention is to provide a plating method capable of planarization process of high quality in comparison with the conventional plating method and also provide a plating device and a plating system adopting the plating method of the invention. In the plating method and device, an object 10 to be processed and an electrode plate 20 are dipped in a solution including objective metal ions and a forward current is supplied between the object and the electrode plate to educe a metal on the surface of the object. After forming a plating film on the object excessively, a backward current is supplied between the object 10 and the electrode 20 to uniformly remove at least part of superfluous plating film.

Abstract: Providing liquid treatment equipment capable of largely reducing a frequency of discarding a treatment solution as a whole and capable of implementing smooth and high quality liquid treatment with less manufacturing burden. Equipment comprises a treatment solution bath capable of accommodating a treatment solution for implementing liquid treatment to a substrate to treat, a treatment solution circulating system circulating the accommodated treatment solution between the outside of the treatment solution bath, and a product removal unit removing a reaction product due to the liquid treatment contained in the circulated treatment solution. By circulating the accommodated treatment solution between the outside of the treatment solution bath, reaction products contained in the circulated treatment solution are removed by means of the product removal unit.

Abstract: Liquid treatment units are disposed in multi-tiers surrounding a main-arm 35. Among liquid treatment units, plating units M1 through M4 are disposed on a lower tier side, and a unit for post-treatment process such as a cleaning unit 70 where a cleaner atmosphere is necessary is disposed on an upper tier side. Thereby, an improvement in an area efficiency and the formation and maintenance of a clean atmosphere can be simultaneously obtained.

Abstract: A contact is disposed to come into contact with a metal layer formed on a substrate being treated, the contact being in contact with a surface being treated from an opposite surface through a through hole present in a substrate. Alternatively, a contact is disposed to come into contact with a metal layer formed on a substrate, the contact coming into contact at an approximate center of the substrate. Alternatively, a plurality of needle bodies are disposed to be in electrical contact with a metal layer of a substrate being treated, thereby power supply for electrolytic polishing/plating to a substrate being treated being implemented, without restricting to a periphery of a substrate, from a plurality of points on a surface thereof. Due to any one of these, liquid treatment equipment enables to improve uniformity in plane of an electric current sent to a surface being treated and of liquid treatment.

Abstract: Between a wafer and a holder holding a wafer, a seal member is disposed so that a contact surface is formed in an approximate plane, and an inner periphery surface is formed in an approximate plane and approximately vertical to a contact surface. The seal member, in a sealed state, has a brim portion of a radius of curvature of 0.5 mm or less at a boundary portion between an inner periphery surface of a seal member and a contact surface. Due to a brim portion, a gap between a contact surface of a seal member and a surface being plated of a wafer W can be made smaller, resulting in reducing bubbles entering in a gap.