Abstract: A semiconductor package includes an interposer, an electronic device having a first side surface and a second side surface opposite to the first side surface, and including a plurality of memory dies stacked in a vertical direction, at least one first through pipe passing through the electronic device in the vertical direction adjacent to the first side surface, and moving a cooling liquid therein, and a plurality of thermal transmission lines extending in a horizontal direction inside the memory die, and extending in parallel from the first through pipe toward the second side surface.

Abstract: The present invention relates to a mobile terminal including a metal case, and a method for manufacturing a metal case consisting of a side frame and a bottom frame. The present invention provides a mobile terminal comprising: a terminal body including a display unit disposed on one side thereof and an antenna; and a metal case which forms the exterior of the terminal body and supports the inside of the terminal body, wherein the metal case may include an annular side frame constituting a side surface of the terminal body and a bottom frame coupled to the side frame and supporting the display unit and including a plurality of holes, the side frame having a coupling portion engaged with the bottom frame formed on an inner side surface.