Abstract: The present disclosure is directed to imaging LiDARs monolithic integration of focal plane switch array LiDARS with CMOS electronics. The CMOS wafer contains electronic circuits needed to control the focal plane array, e.g., digital addressing circuits and MEMS drivers, as well as circuits to amplify and process the detected signals, e.g., trans-impedance amplifiers (TIA), multi-stage amplifiers, analog-to-digital converters (ADC), digital signal processing (DSP), and circuits to communicate with external systems. Methods of use are also provided.

Abstract: The present disclosure is directed to imaging LiDARs with optical antennas fed by optical waveguides. The optical antennas can be activated through an optical switch network that connects the optical antennas to a laser source to a receiver. A microlens array is positioned between a lens of the LiDAR system and the optical antennas, the microlens array being positioned so as to transform an emission angle from a corresponding optical antenna to match a chief ray angle of the lens. Methods of use and fabrication are also provided.

Abstract: Provided are a integrated plasmonic circuit including a plasmonic source using a surface plasmon resonance phenomenon, a plasmonic detector detecting an optical signal generated in the plasmonic source, and a link structure between the plasmonic source and the plasmonic detector, that is, a signal transferring part, and a method of manufacturing the same. Provided are a integrated plasmonic circuit capable of realizing both of miniaturization and speed improvement by overcoming both of a limitation of an electronic device in terms of a signal speed in spite of being excellent in terms of miniaturization efficiency and a limitation of an existing optical device in terms of miniaturization due to a diffraction limitation of light in spite of being improved in terms of a signal speed, and a method of manufacturing the same.