Patents by Inventor Kyung Nam Kang
Kyung Nam Kang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11804447Abstract: A semiconductor device includes a shielding wire formed across a semiconductor die and an auxiliary wire supporting the shielding wire, thereby reducing the size of a package while shielding the electromagnetic interference generated from the semiconductor die. In one embodiment, the semiconductor device includes a substrate having at least one circuit device mounted thereon, a semiconductor die spaced apart from the circuit device and mounted on the substrate, a shielding wire spaced apart from the semiconductor die and formed across the semiconductor die, and an auxiliary wire supporting the shielding wire under the shielding wire and formed to be perpendicular to the shielding wire. In another embodiment, a bump structure is used to support the shielding wire. In a further embodiment, an auxiliary wire includes a bump structure portion and wire portion and both the bump structure portion and the wire portion are used to support the shielding wire.Type: GrantFiled: January 22, 2021Date of Patent: October 31, 2023Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Jun Ho Jeon, Kyeong Sool Seong, Seok Ho Na, Jeong Il Kim, Young Kyu Kim, Sung Ho Jeon, Deok In Lim, Sung Moo Hong, Sung Jung Kim, Sung Han Ryu, Kyung Nam Kang, Seong Hak Yoo
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Publication number: 20230238226Abstract: A semiconductor device manufacturing method comprising loading a substrate into a substrate treatment apparatus, performing a deposition process on the substrate, and cleaning the substrate treatment apparatus. The substrate treatment apparatus includes a housing defining a treatment area in which the deposition process is performed, a gas supply supplying a first process gas at a flow rate of 1000 sccm to 15000 sccm and supplying a second process gas, a remote plasma supply connected to the gas supply, generating a first process plasma and a second process plasma by applying RF power to plasma-process the first process gas and the second process gas, and a shower head installed in the housing to supply the first process plasma and the second process plasma to the treatment area. The second process plasma cleans a membrane material deposited on an inner wall of the housing.Type: ApplicationFiled: October 26, 2022Publication date: July 27, 2023Inventors: Woo Hyun LEE, Su Ji GIM, Dong Jun KA, Kyung Nam KANG, Hong Sik PARK, Deok Cheon SON, Jeong Yeon SONG, Sun Hee CHOY
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Publication number: 20230020305Abstract: An apparatus for manufacturing a semiconductor device and a method of manufacturing the apparatus, the apparatus including a heater configured to heat a target, and a coating layer, the coating layer including a ternary material of transition metal(M)-aluminum(Al)-nitrogen(N) represented by the following Chemical Formula: [Chemical Formula] MxAl1?xNy, wherein x and y satisfy the following relations: 0<x<1 and y?1.Type: ApplicationFiled: May 4, 2022Publication date: January 19, 2023Inventors: Hwanyeol PARK, Kyung Nam KANG, Jeong Hoon NAM, Se Jin KYUNG, Dae Wee KONG, Tae-Min KIM
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Patent number: 11461704Abstract: A computing device of the present invention estimates an unknown parameter ? of a model formula when distributed sample data is acquired, wherein when an estimated quantity of ? is acquired, a function g is estimated using a random forest model, such that when an estimated quantity of g is acquired, the estimated quantity of g and the estimated quantity of ? are used so as estimate a function G as a prediction formula for new data corresponding to a specific item such that an estimated quantity of G is acquired, and thus new data xnew is received, thereby enabling the class of the specific item to be classified from the calculated value.Type: GrantFiled: November 9, 2017Date of Patent: October 4, 2022Assignee: BIOINFRA LIFE SCIENCE INC.Inventors: Chul Woo Kim, Yong Dai Kim, Kyung Nam Kang, Oh Ran Kwon
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Publication number: 20210143105Abstract: A semiconductor device includes a shielding wire formed across a semiconductor die and an auxiliary wire supporting the shielding wire, thereby reducing the size of a package while shielding the electromagnetic interference generated from the semiconductor die. In one embodiment, the semiconductor device includes a substrate having at least one circuit device mounted thereon, a semiconductor die spaced apart from the circuit device and mounted on the substrate, a shielding wire spaced apart from the semiconductor die and formed across the semiconductor die, and an auxiliary wire supporting the shielding wire under the shielding wire and formed to be perpendicular to the shielding wire. In another embodiment, a bump structure is used to support the shielding wire. In a further embodiment, an auxiliary wire includes a bump structure portion and wire portion and both the bump structure portion and the wire portion are used to support the shielding wire.Type: ApplicationFiled: January 22, 2021Publication date: May 13, 2021Applicant: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Jun Ho JEON, Kyeong Sool SEONG, Seok Ho NA, Jeong Il KIM, Young Kyu KIM, Sung Ho JEON, Deok In LIM, Sung Moo HONG, Sung Jung KIM, Sung Han RYU, Kyung Nam KANG, Seong Hak YOO
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Patent number: 10943871Abstract: A semiconductor device includes a shielding wire formed across a semiconductor die and an auxiliary wire supporting the shielding wire, thereby reducing the size of a package while shielding the electromagnetic interference generated from the semiconductor die. In one embodiment, the semiconductor device includes a substrate having at least one circuit device mounted thereon, a semiconductor die spaced apart from the circuit device and mounted on the substrate, a shielding wire spaced apart from the semiconductor die and formed across the semiconductor die, and an auxiliary wire supporting the shielding wire under the shielding wire and formed to be perpendicular to the shielding wire. In another embodiment, a bump structure is used to support the shielding wire. In a further embodiment, an auxiliary wire includes a bump structure portion and wire portion and both the bump structure portion and the wire portion are used to support the shielding wire.Type: GrantFiled: October 18, 2018Date of Patent: March 9, 2021Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Jun Ho Jeon, Kyeong Sool Seong, Seok Ho Na, Jeong Il Kim, Young Kyu Kim, Sung Ho Jeon, Deok In Lim, Sung Moo Hong, Sung Jung Kim, Sung Han Ryu, Kyung Nam Kang, Seong Hak Yoo
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Patent number: 10663469Abstract: A method for diagnosing lung cancer in a subject by using a complex biomarker group is provided. The method includes steps of: (a) a computing system (1) acquiring a model M by using expression level data by individual biomarkers in the complex biomarker group and then (2) acquiring expression level data by the individual biomarkers measured from a biological specimen of the subject or their processed data Bk; and (b) the computing system determining whether lung cancer is detected in the subject by using the acquired data of the subject by referring to the model M; wherein the complex biomarker group includes CEA, HE4, ApoA2, TTR, sVCAM-1 and RANTES.Type: GrantFiled: February 10, 2017Date of Patent: May 26, 2020Assignee: BioInfra Life Science Inc.Inventors: Chul Woo Kim, Yong Dai Kim, Yong Sung Shin, Eun Hee Yeon, Kyung Nam Kang, Ho Sang Shin, Oh Ran Kwon
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Publication number: 20190318266Abstract: A computing device of the present invention estimates an unknown parameter ? of a model formula when distributed sample data is acquired, wherein when an estimated quantity of ? is acquired, a function g is estimated using a random forest model, such that when an estimated quantity of g is acquired, the estimated quantity of g and the estimated quantity of ? are used so as estimate a function G as a prediction formula for new data corresponding to a specific item such that an estimated quantity of G is acquired, and thus new data xnew is received, thereby enabling the class of the specific item to be classified from the calculated value.Type: ApplicationFiled: November 9, 2017Publication date: October 17, 2019Inventors: Chul Woo KIM, Yong Dai KIM, Kyung Nam KANG, Oh Ran KWON
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Publication number: 20190051616Abstract: A semiconductor device includes a shielding wire formed across a semiconductor die and an auxiliary wire supporting the shielding wire, thereby reducing the size of a package while shielding the electromagnetic interference generated from the semiconductor die. In one embodiment, the semiconductor device includes a substrate having at least one circuit device mounted thereon, a semiconductor die spaced apart from the circuit device and mounted on the substrate, a shielding wire spaced apart from the semiconductor die and formed across the semiconductor die, and an auxiliary wire supporting the shielding wire under the shielding wire and formed to be perpendicular to the shielding wire. In another embodiment, a bump structure is used to support the shielding wire. In a further embodiment, an auxiliary wire includes a bump structure portion and wire portion and both the bump structure portion and the wire portion are used to support the shielding wire.Type: ApplicationFiled: October 18, 2018Publication date: February 14, 2019Applicant: AMKOR TECHNOLOGY INC.Inventors: Jun Ho JEON, Kyeong Sool SEONG, Seok Ho NA, Jeong Il KIM, Young Kyu KIM, Sung Ho JEON, Deok In LIM, Sung Moo HONG, Sung Jung KIM, Sung Han RYU, Kyung Nam KANG, Seong Hak YOO
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Patent number: 10141269Abstract: A semiconductor device includes a shielding wire formed across a semiconductor die and an auxiliary wire supporting the shielding wire, thereby reducing the size of a package while shielding the electromagnetic interference generated from the semiconductor die. In one embodiment, the semiconductor device includes a substrate having at least one circuit device mounted thereon, a semiconductor die spaced apart from the circuit device and mounted on the substrate, a shielding wire spaced apart from the semiconductor die and formed across the semiconductor die, and an auxiliary wire supporting the shielding wire under the shielding wire and formed to be perpendicular to the shielding wire. In another embodiment, a bump structure is used to support the shielding wire. In a further embodiment, an auxiliary wire includes a bump structure portion and wire portion and both the bump structure portion and the wire portion are used to support the shielding wire.Type: GrantFiled: December 3, 2016Date of Patent: November 27, 2018Assignee: Amkor Technology, Inc.Inventors: Jun Ho Jeon, Kyeong Sool Seong, Seok Ho Na, Jeong Il Kim, Young Kyu Kim, Sung Ho Jeon, Deok In Lim, Sung Moo Hong, Sung Jung Kim, Sung Han Ryu, Kyung Nam Kang, Seong Hak Yoo
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Publication number: 20180067118Abstract: A method for diagnosing lung cancer in a subject by using a complex biomarker group is provided. The method includes steps of: (a) a computing system (1) acquiring a model M by using expression level data by individual biomarkers in the complex biomarker group and then (2) acquiring expression level data by the individual biomarkers measured from a biological specimen of the subject or their processed data Bk; and (b) the computing system determining whether lung cancer is detected in the subject by using the acquired data of the subject by referring to the model M; wherein the complex biomarker group includes CEA, HE4, ApoA2, TTR, sVCAM-1 and RANTES.Type: ApplicationFiled: February 10, 2017Publication date: March 8, 2018Inventors: Chul Woo Kim, Yong Dai Kim, Yong Sung Shin, Eun Hee Yeon, Kyung Nam Kang, Ho Sang Shin, Oh Ran Kwon
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Publication number: 20170263568Abstract: A semiconductor device includes a shielding wire formed across a semiconductor die and an auxiliary wire supporting the shielding wire, thereby reducing the size of a package while shielding the electromagnetic interference generated from the semiconductor die. In one embodiment, the semiconductor device includes a substrate having at least one circuit device mounted thereon, a semiconductor die spaced apart from the circuit device and mounted on the substrate, a shielding wire spaced apart from the semiconductor die and formed across the semiconductor die, and an auxiliary wire supporting the shielding wire under the shielding wire and formed to be perpendicular to the shielding wire. In another embodiment, a bump structure is used to support the shielding wire. In a further embodiment, an auxiliary wire includes a bump structure portion and wire portion and both the bump structure portion and the wire portion are used to support the shielding wire.Type: ApplicationFiled: December 3, 2016Publication date: September 14, 2017Applicant: Amkor Technology, Inc.Inventors: Jun Ho JEON, Kyeong Sool SEONG, Seok Ho NA, Jeong Il KIM, Young Kyu KIM, Sung Ho JEON, Deok In LIM, Sung Moo HONG, Sung Jung KIM, Sung Han RYU, Kyung Nam KANG, Seong Hak YOO
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Patent number: 9725590Abstract: Provided are an alkoxysilylated epoxy compound, a composite of which exhibits good heat resistance properties, particularly low CTE and increased glass transition temperature, and a cured product thereof exhibits good flame retardancy and composition of which does not require additional silane coupling agent, a method for preparing the same and a composition and a cured product including the same. An alkoxysilylated epoxy compound including at least one alkoxysilyl group and at least two epoxy groups, a method for preparing the same by epoxide ring-opening reaction of starting material and alkoxysilylation, an epoxy composition including the epoxy compound, and a cured product and a use of the composition are provided. Since chemical bonds may be formed between alkoxysilyl group and filler and between alkoxysilyl groups, chemical bonding efficiency of the composite may be improved. Thus, the composite exhibits good heat resistance properties and the cured product exhibits good flame retardancy.Type: GrantFiled: September 17, 2013Date of Patent: August 8, 2017Assignee: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGYInventors: Hyun-Aee Chun, Yun-Ju Kim, Su-Jin Park, Sang-Yong Tak, Sung-Hwan Park, Kyung-Nam Kang, Sook-Yeon Park
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Patent number: 9640391Abstract: A method for growing a transition metal dichalcogenide on a substrate, the method including providing a growth substrate having a first side and a second side opposite the first side; providing a source substrate having a first side and a second side opposite the first side; depositing a transition metal oxide on at least a portion of the first side of the source substrate; combining the growth substrate with the source substrate such that the first side of the growth substrate contacts the transition metal oxide, the combining producing a substrate stack; exposing the substrate stack to a chalcogenide gas, whereby the transition metal oxide reacts with the chalcogenide gas to produce a layer of a transition metal dichalcogenide on at least a portion of the first side of the growth substrate; and removing the source substrate from the growth substrate having the layer of the transition metal dichalcogenide thereon.Type: GrantFiled: June 23, 2016Date of Patent: May 2, 2017Assignee: THE TRUSTEES OF THE STEVENS INSTITUTE OF TECHNOLOGYInventors: Eui-Hyeok Yang, Kyung Nam Kang
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Publication number: 20160379822Abstract: A method for growing a transition metal dichalcogenide on a substrate, the method including providing a growth substrate having a first side and a second side opposite the first side; providing a source substrate having a first side and a second side opposite the first side; depositing a transition metal oxide on at least a portion of the first side of the source substrate; combining the growth substrate with the source substrate such that the first side of the growth substrate contacts the transition metal oxide, the combining producing a substrate stack; exposing the substrate stack to a chalcogenide gas, whereby the transition metal oxide reacts with the chalcogenide gas to produce a layer of a transition metal dichalcogenide on at least a portion of the first side of the growth substrate; and removing the source substrate from the growth substrate having the layer of the transition metal dichalcogenide thereon.Type: ApplicationFiled: June 23, 2016Publication date: December 29, 2016Applicant: The Trustees of the Stevens Institute of TechnologyInventors: Eui-Hyeok Yang, Kyung Nam Kang
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Patent number: 9249126Abstract: An oxetane-cyclic epoxy compound represented by Formula 1: where R1 is hydrogen, a methyl group or an ethyl group.Type: GrantFiled: April 27, 2012Date of Patent: February 2, 2016Assignees: CHEIL INDUSTRIES, INC., KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGYInventors: Young Kwon Kim, Sang Keol Lee, Tae Ho Kim, Woo Jin Lee, Sung Kook Kim, Hyun Ae Jeon, Yun Joo Kim, Sang Yong Tak, Suk Yeon Park, Kyung Nam Kang
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Publication number: 20150247033Abstract: Provided are an alkoxysilylated epoxy compound, a composite of which exhibits good heat resistance properties, particularly low CTE and increased glass transition temperature, and a cured product thereof exhibits good flame retardancy and composition of which does not require additional silane coupling agent, a method for preparing the same and a composition and a cured product including the same. An alkoxysilylated epoxy compound including at least one alkoxysilyl group and at least two epoxy groups, a method for preparing the same by epoxide ring-opening reaction of starting material and alkoxysilylation, an epoxy composition including the epoxy compound, and a cured product and a use of the composition are provided. Since chemical bonds may be formed between alkoxysilyl group and filler and between alkoxysilyl groups, chemical bonding efficiency of the composite may be improved. Thus, the composite exhibits good heat resistance properties and the cured product exhibits good flame retardancy.Type: ApplicationFiled: September 17, 2013Publication date: September 3, 2015Inventors: Hyun-Aee Chun, Yun-Ju Kim, Su-Jin Park, Sang-Yong Tak, Sung-Hwan Park, Kyung-Nam Kang, Sook-Yeon Park
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Publication number: 20150148452Abstract: There is provided a composition including an alkoxysilylated epoxy compound, a composition of which exhibits good heat resistance properties, low CTE and high glass transition temperature or Tg-less and not requiring a separate coupling agent, and inorganic particles, a cured product formed of the composition, and a use of the cured product. An epoxy composition including an alkoxysilylated epoxy compound and inorganic particles, an epoxy composition including an epoxy compound, inorganic particles and a curing agent, a cured product of the composition, and a use of the composition are provided. Since chemical bonds may be formed between the alkoxysilyl group and the inorganic particles and between the alkoxysilyl groups, a composition of the composition including the alkoxysilylated epoxy compound and the inorganic particles exhibits improved heat resistance properties, decreased CTE, and increased glass transition temperature or Tg less.Type: ApplicationFiled: February 15, 2013Publication date: May 28, 2015Applicant: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGYInventors: Hyun-Aee Chun, Su-Jin Park, Sook-Yeon Park, Yun-Ju Kim, Sang-Yong Tak, Sung-Hwan Park, Kyung-Nam Kang
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Patent number: 9034971Abstract: A composite sheet of the present invention comprises an oxetane-epoxy-based compound, represented by chemical formula 1, as a binder.Type: GrantFiled: May 7, 2012Date of Patent: May 19, 2015Assignees: Cheil Industries Inc., Korea Institute of Industrial TechnologyInventors: Young Kwon Kim, Sang Keol Lee, Sung Han Im, Seok Won Choi, Sung Kook Kim, Hyun Ae Jeon, Yun Joo Kim, Sang Yong Tak, Suk Yeon Park, Kyung Nam Kang, So Young Kang
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Publication number: 20140187111Abstract: A composite sheet of the present invention comprises an oxetane-(meth)acrylate compound, represented by chemical formula I, as a binder.Type: ApplicationFiled: May 8, 2012Publication date: July 3, 2014Inventors: Young Kwon Kim, Sang Keol Lee, Eun Hwan Jeong, Sung Kook Kim, Hyun Ae Jeon, Yun Joo Kim, Sang Yong Tak, Suk Yeon Park, Kyung Nam Kang, So Young Kang