Abstract: A semiconductor package device includes a substrate, a die, a package body, a shielding layer, a solder mask layer, an insulating film and an interconnection element. The die is disposed on a top surface of the substrate. The package body is disposed on the top surface of the substrate to cover the die. The shielding layer is disposed on the package body and is electrically connected to a grounding element of the substrate. The solder mask layer is disposed on a bottom surface of the substrate. The insulating film is disposed on the solder mask layer. The interconnection element is disposed on the bottom surface of the substrate. A first portion of the interconnection element is covered by the insulating film, and a second portion of the interconnection element is exposed from the insulating film.

Abstract: A semiconductor package device includes a substrate, a die, a package body, a shielding layer, a solder mask layer, an insulating film and an interconnection element. The die is disposed on a top surface of the substrate. The package body is disposed on the top surface of the substrate to cover the die. The shielding layer is disposed on the package body and is electrically connected to a grounding element of the substrate. The solder mask layer is disposed on a bottom surface of the substrate. The insulating film is disposed on the solder mask layer. The interconnection element is disposed on the bottom surface of the substrate. A first portion of the interconnection element is covered by the insulating film, and a second portion of the interconnection element is exposed from the insulating film.

Abstract: An integrated circuit package system includes a substrate having an integrated circuit die thereon; a heat slug having a tie bar, the tie bar having characteristics of singulation from an adjacent heat slug; and an encapsulant molded on the substrate, the heat slug, and the integrated circuit die includes the encapsulant which fills all of the space between the integrated circuit die and the heat slug.

Abstract: An integrated circuit package system includes a substrate having an integrated circuit die thereon; a heat slug having a tie bar, the tie bar having characteristics of singulation from an adjacent heat slug; and an encapsulant molded on the substrate, the heat slug, and the integrated circuit die includes the encapsulant which fills all of the space between the integrated circuit die and the heat slug.

Abstract: An integrated circuit package system includes providing a substrate having an integrated circuit die thereon. A support is provided on the substrate. A heat slug having a tie bar is positioned by the tie bar on the support. The substrate and the integrated circuit die are encapsulated with an encapsulant, the encapsulant in contact with the heat slug. The substrate, heat slug, and encapsulant are singulated to remove the support.

Abstract: An integrated circuit package system includes providing a substrate having an integrated circuit die thereon. A support is provided on the substrate. A heat slug having a tie bar is positioned by the tie bar on the support. The substrate and the integrated circuit die are encapsulated with an encapsulant, the encapsulant in contact with the heat slug. The substrate, heat slug, and encapsulant are singulated to remove the support.